Standing in 2026, if one were to select a technology that represents China's "Strong-Nation Intelligent Manufacturing," silicon carbide (SiC) substrates would undoubtedly secure a place. Recently, the program "Strong-Nation Intelligent Manufacturing" has been continuously broadcast on CCTV9 and CCTV10. The latest special documentary, "Synlight, Beyond Contention," focuses its lens on Synlight Semiconductor and the Chinese SiC substrate industry. Why has an SiC material company entered the observ
October 12, 2026
Compiled by | Cui Yuanwei Edited by | Chen Junda Xindongxi reported on October 9 that yesterday, GlobalFoundries, a major global semiconductor foundry, announced a multi-year manufacturing agreement with TSMC to establish a silicon interposer production base in the U.S., supplying TSMC's CoWoS advanced packaging ecosystem. The agreement is valued at approximately USD 2 billion (equivalent to about CNY 13.4 billion). GlobalFoundries will expand the capacity of its Malta, New York facility to prov
October 10, 2026
Recently, the Phase II project of the advanced packaging pilot platform of Hubei Hsingchen Technology Co., Ltd. (hereinafter referred to as "Hsingchen Technology") has officially commenced operation. This is not only a major upgrade of the company's technology roadmap, but also marks the official operation of China's first mass production line with 3D advanced packaging capabilities, ushering the Chinese semiconductor advanced packaging industry into a new stage of scaled mass production. From L
October 10, 2026
The growth of AI computing power is pushing Advanced Packaging to the forefront of system innovation. The combination of logic, memory, and optical interconnects affects product performance, power consumption, and cost; whether these innovations can enter mass manufacturing depends on whether high-density interconnects can be stably realized under real production conditions. Consequently, the competition in Advanced Packaging extends to the coordinated control of materials, processes, equip
October 10, 2026
In 2026, price increase signals in the semiconductor market are extending from advanced computing and memory to 8-inch foundry, some 12-inch mature nodes, and power devices. Manufacturing platforms that previously endured price competition are regaining pricing power. Behind this trend are the growth in AI power supply demand, adjustments in legacy production lines, changes in product mix, and material cost pressures. However, the boom levels vary across different sizes, processes, and devices:
October 10, 2026
It took only six years for the overall market share of domestic manufacturers to approach 40%, shifting from a situation where Japanese and American companies guarded nearly 80% of the global semiconductor sputtering target market. This business, known as the "metal pipeline for chips," has completed a shift that outsiders find incredible—sputtering targets deposit layers of ultra-high-purity metal atoms onto wafers via physical vapor deposition (PVD). The barrier layers and interconnect layers
October 8, 2026
Capital operations are being implemented intensively, but the realization of high-end capacity remains to be seen. In September, four domestic advanced packaging companies made intensive strategic moves. Tongfu Microelectronics (TFME) 's CNY 4.209 billion private placement was completed; JCET disclosed a private placement plan of no more than CNY 6.5 billion; SJ Semiconductor provided a guarantee for a CNY 980 million project loan; and HT-Tech's major asset restructuring received the CSRC's app
October 8, 2026
In the summer of 2026, the delivery pace of NVIDIA's Blackwell architecture GPUs has become one of the most closely watched variables in the global tech industry. The metrics tracked by the market have long shifted from the yield rate of the most advanced 3nm process node to the capacity ramp-up progress of TSMC's CoWoS packaging. In the bill of materials for a high-end AI chip, high bandwidth memory (HBM) and packaging and testing combined account for over 60%, with packaging costs even approac
October 8, 2026
Recently, the three major Japanese photoresist giants—JSR, Tokyo Ohka Kogyo, and Shin-Etsu Chemical—jointly announced the implementation of a new pricing system for global customers starting October 1, 2026. The industry believes that this round of price hikes is jointly driven by tight supply and demand, rising costs, and changes in the industrial landscape. Driven by the price increases of these giants, what impact will it have on the semiconductor industry, and what will be the future of dome
October 8, 2026
On September 23, Hefei IC Valley Microelectronics Co., Ltd.' 6-inch GaAs (Gallium Arsenide) wafer manufacturing line reached a major milestone as the core advanced lithography equipment was officially moved in and installed. This marks a leapfrog upgrade in the company's wafer manufacturing process capabilities and accelerates the industrialization of high-end RF microwave chips in Hefei. As a core and critical equipment for compound semiconductor wafer manufacturing, the advanced lithography eq
September 28, 2026
Author: Li Yan The rapid advancement of AI (Artificial Intelligence) is driving a continuous surge in global computing power demand. Meanwhile, energy supply is gradually becoming a major constraint on the expansion of computing infrastructure. The International Energy Agency (IEA) estimates that by 2030, global data center electricity consumption will nearly double compared to current levels, with AI-related data centers showing particularly significant growth in power demand. Consequently, the
September 24, 2026
Glass Substrates Glass is one of the most common materials, yet it has rarely played a leading role in the semiconductor industry. Over the past six months, investments in production lines and pilot lines for glass substrates have been successively launched from Gimcheon in Gyeongsangbuk-do, South Korea, to Bengbu, Anhui, China, and Georgia, the United States, with amounts often reaching hundreds of millions. These capital bets are all placed on the same endeavor: drilling millions of micron-lev
September 23, 2026
Editor's Note The highly sophisticated semiconductor industry actually conceals many industrial secrets unknown to the general public. TOTO, a bathroom fixture manufacturer, monopolizes the semiconductor electrostatic chuck market; Ajinomoto, a MSG producer, controls the key materials for high-end packaging substrates. Traditional daily industries and core semiconductor tracks have long been deeply intertwined. Beneath the boom, the real landscape of the semiconductor industry is far more comple
September 23, 2026
On September 18, the Department of International Cooperation of the CSRC issued Guohehan [2026] No. 2003, approving the filing for the overseas listing and the "full circulation" of domestic shares of Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd. The company plans to issue no more than 368 million shares, with nearly 694 million domestic unlisted shares held by 51 shareholders converting to tradable shares—this "pass" to Hong Kong is the most tangible recognition for an advanced p
September 22, 2026
Recently, three overseas silicon carbide (SiC) wafer projects are advancing in construction, with a total investment exceeding CNY 3 billion and a planned annual capacity of over 80,000 wafers: SiCSem in India: The project has been approved with a wafer capacity of 60,000 pieces/year and an investment of approximately CNY 2.657 billion. RIR Power in India: Completed the installation and commissioning of epitaxial equipment. The capacity will reach 20,000 pieces by the end of 2027, with the secon
September 21, 2026
According to the Economic Daily News in Taiwan, China, the TSMC (Taiwan Semiconductor Manufacturing Company) Longtan fab construction plan, which was shelved for three years, has reached a key milestone. The draft "Longtan Campus Expansion Plan of Hsinchu Science Park" has been successfully reviewed and approved, removing a major hurdle for TSMC's return to the Longtan project. The current Longtan Campus expansion plans to cover a land area of approximately 104 hectares, with a total development
September 20, 2026
According to reports from the South Korean semiconductor media The Elec, Samsung Electro-Mechanics (SEM) is collaborating with Qualcomm to develop a 2.1D heterogeneous integration advanced packaging solution for AI chips. Both parties have been conducting R&D and reliability certification for this technology platform for over a year. The core innovation of this 2.1D packaging solution is the use of an embedded organic bridge. The technical architecture is similar to Intel's EMIB (Embedded Mu
September 17, 2026
In the LED display industry in 2026, COB (Chip on Board) shipments continue to rise, accelerating penetration into the commercial display market; MIP (Micro LED in Package) is gradually gaining volume in the sub-P1.0 pitch segment. Driven by market demand penetration and coupled with the PCB (Printed Circuit Board) price hike wave, multiple PCB manufacturers have initiated the construction and capacity expansion of display-specific HDI (High Density Interconnector) substrates this year. Recently
September 16, 2026
Author: Junxi On September 10, TSMC (Taiwan Semiconductor Manufacturing Company) announced its August revenue of TWD 514.805 billion, up 10.1% month-on-month and 53.32% year-on-year. This marks the first time the company's monthly revenue has exceeded TWD 500 billion, and it is the fourth consecutive month of setting a new record. According to disclosures from the second-quarter earnings call, nodes at 7nm and below collectively accounted for 77% of wafer revenue. Actions on both the capacity an
September 15, 2026
[Relevant Companies Mentioned in This Article] ASE, TSMC, Nvidia, ECTC, GF, SMIC, Innoscience. Mature Packaging > Novel Process Nodes At the recently concluded OCP APAC 2026 summit last month, CP Hung, Senior Vice President of ASE, delivered a highly substantive keynote titled "Advanced Packaging: Enabling AI at Scale." He not only broke down advanced packaging into a 'trilogy' of electrical, optical, and power domains, but also further demonstrated how panel-level packaging addresses through
September 15, 2026
