On November 10, AMEC (Advanced Micro-Fabrication Equipment Inc. China) announced via its official WeChat account the launch of its new product, the Primo Matrix® Dual-Station Plasma Wafer Dicing System. The first unit has been successfully shipped to a key domestic IC packaging customer. Advanced packaging has become the core pathway for extending Moore's Law. As a critical process in packaging, wafer dicing directly determines chip yield and production line efficiency. Addressing the stringent
November 12, 2026
I. First-Day Surge of 28.38% Pushes Market Cap Past HKD 12.1 Billion On November 10, 2026, the Hong Kong stock market's semiconductor and AI computing hardware sectors welcomed a heavyweight new entrant. Jiangsu Xinde Semiconductor Technology Co., Ltd. (abbreviated as "JSSI," Stock Code: 07672.HK), a leading advanced packaging and testing enterprise headquartered in the Pukou Economic Development Zone of Nanjing, Jiangsu Province, officially listed on the Main Board of the Hong Kong Stock Exchan
November 12, 2026
【Relevant Companies Mentioned in This Article】HT-Tech / Pangu Semiconductor, SJ Semiconductor, CXMT, XMC, SMIC, Fastprint, SCC / Sky Chip Interconnect, Zhejiang WAZAM New Materials, TSMC, PTI, ASE, Hsingchen Technology, JCET, TongFu Microelectronics, CR Micro / Sipan Micro, ECHINT Technology, Fozhixin Microelectronics, 3D CHIPS (GUANGDONG) Technology, Sky Semiconductor, WG Tech / TGVTECH, BOE, Lens Technology, Samsung Electro-Mechanics, Intel, Innolux, Absolics, Corning, SCHOTT, AGC, Rainbow Gro
November 12, 2026
Author | Cui Yuanwei Editor | Chen Junda ChipInsights reported on November 10 that Jiangsu-based semiconductor packaging and testing company Jiangsu Xinde Semiconductor Technology (JSSI) listed on the HKEX today. Based on the final offering price of HK$8.88 per share (approx. CNY 7.6), the total fundraising amount for this IPO is approximately HK$946 million (approx. CNY 800 million). After deducting underwriting commissions and related issuance expenses, the company raised a net amount of appro
November 11, 2026
Author: Peng Cheng The growth in demand for AI computing power and high-end storage has driven a large-scale expansion of the advanced packaging industry both domestically and internationally. The total investment across the entire industry, including mainland Chinese manufacturers such as JCET (Jiangsu Changjiang Electronics Technology), TFME (Tongfu Microelectronics), HT-Tech, Forehope Electronic, SJ Semiconductor, Shenzhen Kaifa Technology, and BIWIN Storage Technology, has exceeded CNY 40 bi
November 9, 2026
I. AI Expands to Power and Silicon Photonics, Igniting Global Silicon Wafer Demand In the macro observation system of the global semiconductor supply chain, silicon wafers (also known as "silicon substrates," Silicon Wafers), serving as the foundational substrate for manufacturing the vast majority of integrated circuits and discrete devices, have always acted as the most penetrating leading indicator, akin to "the first swallow of spring." On November 4, 2026 (November 5 Beijing Time), the Sili
November 9, 2026
On November 6, Guangdong Tianyu Semiconductor Co., Ltd. (02658.HK) issued an announcement stating its intention to acquire approximately 7% of the shares of Zhejiang Tony Electronic Co., Ltd. (603595.SH). The announcement reveals that Tonytech' semiconductor business primarily focuses on the development and manufacturing of silicon carbide (SiC) substrates, covering 6-inch and 8-inch conductive substrates. This investment signifies that Tianyu Semiconductor is further extending its reach upstrea
November 9, 2026
The robustness of mature and specialty process node foundries continues to manifest. Unlike the distinct logic driving advanced nodes, the vitality of mature specialty processes is underpinned by downstream demand from automotive-grade chips, power devices, image sensors, and analog ICs. During the Q3 earnings window, Hua Hong Grace and Nexchip have successively disclosed operational data and capital actions. Nexchip announced a 9.1 billion yuan capital increase plan for its Phase IV production
November 9, 2026
Author | Cui Yuanwei Editor | Chen Junda ChipInsights reported on November 4 that, according to the website of the China Securities Regulatory Commission (CSRC), on November 2, Jiangsu-based semiconductor epitaxial wafer company Huaxing Optoelectronics filed for listing tutoring registration with the Jiangsu Bureau of the CSRC, initiating its A-share IPO process. The tutoring institution is GF Securities. Huaxing Optoelectronics was established in February 2016, registered in Xuzhou, Jiangsu Pro
November 5, 2026
On October 29, HG Semiconductor Limited (06908.HK) issued a transaction announcement stating that its subsidiary Shenzhen Ganhonor Semiconductor Co., Ltd. and existing shareholders had signed a capital increase agreement with Chizhou Hengchuang Linghang Venture Investment Fund. In the announcement, HG Semiconductor revealed that the capital injection would be used for the construction of a gallium nitride (GaN) project and disclosed progress on Ganhonor Semiconductor's capacity and revenue. Mea
November 5, 2026
【Related Companies】JNTC, Jinwoo Engineering (진우엔지니어링), COMET (코멧), TOPPAN, AST (Advanced Substrate Technologies), Philoptics, LPKF, Taesung (태성), SKC (Absolics), Samsung Electro-Mechanics, LG Innotek, Intel, TSMC, Ibiden, Unimicron, Innolux, TPK, AT&S, Shinko, Kinsus, BOE, WG Tech / Hubei TGVTECH, Lens Technology, Sky Semiconductor, 3D CHIPS (GUANGDONG) Technology, Fozhixin Microelectronics, MA-tek, etc. I. Why Do AI Large Chips Require "2.0mm Ultra-Thick Glass Substrates"? From 2025 to 2026
November 5, 2026
[Related Companies Involved in This Article]: JCET (Jiangsu Changjiang Electronics Technology), TFME (Tongfu Microelectronics), HT-Tech (Hua Tian Technology), SJ Semiconductor, and Forehope Electronic I. Which of the Five OSAT Leaders Ran Fastest in Q3 2026? From the perspective of the global OSAT competitive landscape, the combined revenue of the top ten global packaging and testing companies in H1 2026 reached USD 22.50 billion. Mainland China occupied four seats: JCET maintained its position
November 5, 2026
Recently, Hangjia San Ban (Third-Generation Semiconductor Insights) observed that multiple projects in the third-generation semiconductor industry chain have made new progress, involving SiC production line construction, power device packaging expansion, semiconductor component base establishment, and wafer processing consumable capacity enhancement. 01 Global Power Technology: 8-Inch Silicon Carbide Production Line Building Tops Out According to information from "Poisson Core Energy Space," the
November 4, 2026
Recently, STMicroelectronics and X-FAB released their third-quarter financial reports. Epiworld International also issued a positive profit alert. Driven by strengthening demand, multiple indicators for these companies showed positive trends: Epiworld International: Projected revenue of approximately CNY 1.7 billion in 2026, representing a year-over-year increase of 110%-130%, with net profit surging 800%-1217% year-over-year. STMicroelectronics: Order volumes increased quarter-over-quarter; SiC
November 4, 2026
For the past three years, silicones have been repeatedly labeled as having "overcapacity." However, data from 2026 presents a different picture. According to monitoring by the Maihuasu Research Institute, the average market price of domestic DMC (Dimethylcyclosiloxane) in the first three quarters was CNY 14,162 per ton, a year-on-year increase of 15.7%. Data from the General Administration of Customs shows that during the same period, exports of polysiloxanes reached 437,100 tons (437,058.55 ton
November 3, 2026
United Nova Power (UNP) recently announced the completion of its Series C funding round, raising nearly CNY 2 billion. This round was led by China Mobile's Chain Leader Fund, with participation from grid central enterprises, IEIT SYSTEMS, Yuanjing Capital, Sinopec Hydrogen Energy Fund, Naura Technology Nuohua Capital, Jiangfeng Electronics, Changzhou Xingyu, Kaihui Fund, Jianxin Equity, CITIC Jinshi, and other industrial and financial investment institutions. The funds will be used to expand pro
November 3, 2026
Recently, the 16th International Nanotechnology Industry Expo was held at the Suzhou International Expo Center. During this expo, XinShiYe launched the "Q&A · NanoExpo" series of interview reports. This article features an exclusive interview with Pan Yao, General Manager of Suzhou MemsTech Semiconductor Technology Co., Ltd. A layer of silicon, a layer of silicon dioxide, and another layer of silicon—this "three-layer sandwich" structure is essential for silicon photonics chips. According to
November 2, 2026
On October 27, the official website of the Zhengzhou Airport Economy Comprehensive Experimental Zone published an announcement proposing to approve the environmental impact assessment documents for the "NEV Automotive-Grade Silicon Carbide Substrate Production Line Project" by Zhengzhou BYD Auto Co., Ltd. (via the notification and commitment system). According to the public notice, the project is located in the Zhengzhou BYD New Materials Industrial Park. With a total investment of CNY 215 milli
October 30, 2026
[Related Companies Mentioned in This Article] BOE, WG Tech (TGVTECH), Sky Semiconductor, Lens Technology, Rainbow Shares, Triumph Science & Technology, GobiJia, Qibin Group, Corning, SCHOTT, AGC, NEG, MKS Atotech, MacDermid Alpha, Dongwei Technology, Tiancheng Technology, Aisen Shares, Hwatsing Technology, DNP, JNTC, Yoke Technology, Nata Opto-electronic Material, Jiangfeng Electronics, Grinm Advanced Materials, Shanghai Sinyang, Anji Microelectronics, Zhongjuxin, Feikai Materials, Guanghua
October 30, 2026
I. Project Analysis: Details of the CNY 3 Billion Phase II, Stage 2 Plan in Nanjing On October 24, 2026, HT-Tech (002185.SZ), a leading domestic IC packaging and testing enterprise, explicitly responded to market concerns on the Shenzhen Stock Exchange investor interaction platform: The "HT Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base Phase II, Stage 2 Construction Project," invested with CNY 3 billion by its controlled subsidiary HT-Tech (Nanjing) Co., Ltd., has a c
October 30, 2026