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  • Intel Unveils Three-Pronged Strategy at 2026 Tech Innovation Conference to Accelerate Agentic AI Rollout Across PC, Edge & Data Center

    Recently, Annie Shea Weckesser, Chief Marketing and Communications Officer of Intel, delivered a keynote speech titled "Intelligence Ushers in the AI Era" at the 2026 Intel Technology Innovation and Industry Ecosystem Conference. In her speech, Annie Shea Weckesser introduced Intel's three-pronged strategy to collaborate with the industry ecosystem to drive the implementation of intelligence: first, building an open computing platform covering PCs, edge, and data centers; second, designing custo

    October 5, 2026

    Intel Unveils Three-Pronged Strategy at 2026 Tech Innovation Conference to Accelerate Agentic AI Rollout Across PC, Edge & Data Center
  • 10,000 Sandboxes in 10 Minutes: Intel Redefines Data Centers Built for Autonomous AI Agents

    By Fang Yuan "10,000 sandboxes spun up within 10 minutes." During Intel Connection 2026, Intel put forward this figure. The creation time for each sandbox must not exceed 60 milliseconds. A sandbox is not an empty shell; it must host a complete runtime environment, including images, file systems, and isolated spaces. This requirement is not a laboratory hypothesis; it comes from the production environments of real customers. It also points to a specific question: as agents evolve from chatting t

    September 29, 2026

    10,000 Sandboxes in 10 Minutes: Intel Redefines Data Centers Built for Autonomous AI Agents
  • Edge AI Studio & CCStudio Ecosystem: TI Lowers Development Barrier and Integrates AI Agent for Embedded R&D

    Author | Yunpeng, Editor | Moying From the cloud to the edge, today AI is profoundly changing the way humans interact with the physical world. From medical wearable devices and smart homes to industrial automation and embodied robots, edge AI, with its unique advantages of low latency, high security, and high reliability, has brought new solutions for AI deployment in many industries. Massive AI applications directly complete real-time perception, inference, and decision-making locally on termin

    September 27, 2026

    Edge AI Studio & CCStudio Ecosystem: TI Lowers Development Barrier and Integrates AI Agent for Embedded R&D
  • The CPU Business Repriced by AI Agents

    Over the past two years, the computing power market has been almost entirely dominated by GPUs. When training peaks could not be pushed higher, all other efforts seemed secondary, and the landscape was paced by a few accelerator cards. However, as the industry chain moves past its most boisterous phase, the trend is shifting from "making models larger" to "making models usable." Attention is quietly moving away from the peak computing power of a single chip to whether the entire system can handl

    September 24, 2026

    The CPU Business Repriced by AI Agents
  • TSMC Reportedly to Raise Prices by 3%–6% in Early 2027, Order Visibility Extends to 2030

    The capacity tightness driven by AI computing demand is steadily transmitting to the pricing of wafer foundry services. According to Digitimes, citing supply chain sources, TSMC plans to raise its wafer foundry quotes starting from January 2027, with an overall price increase ranging from 3%–6%. Advanced nodes such as 2nm and 3nm will see higher increases; mature and specialty processes will not undergo a uniform price adjustment, but will be negotiated individually based on customers and capaci

    September 24, 2026

    TSMC Reportedly to Raise Prices by 3%–6% in Early 2027, Order Visibility Extends to 2030
  • Agentic AI Drives Computing Sinking: Hygon 1000 Targets Industrial Control, Robotics & Vision Inference Scenarios

    Author | Yunpeng Editor | Moying As AI accelerates its shift from the cloud to the edge and endpoint, Agentic AI is rapidly penetrating various industries. A series of physical industries, including transportation, oil and gas, robotics, healthcare, and manufacturing, have been swept into the wave of intelligent transformation. Computing power support at the edge and endpoint has become a critical cornerstone driving the digital and intelligent transformation of the physical world. Such changes

    September 23, 2026

    Agentic AI Drives Computing Sinking: Hygon 1000 Targets Industrial Control, Robotics & Vision Inference Scenarios
  • Hygon 1000 Series CPU Launched: Domestic Embedded Chips Enter Phase Two — Shifting from "Availability" to "Reliable Long-Term Deployment"

    Author: Peng Cheng Over the past few years, computing power has been primarily concentrated in the cloud, such as data centers. However, as industry intelligence continues to deepen, an increasing number of computing tasks are shifting to the edge and on-site devices. There are three main reasons for this shift in computing power. First is real-time performance: industrial control requires microsecond-level response and multi-task concurrency, making a control loop that uploads data to the cloud

    September 23, 2026

    Hygon 1000 Series CPU Launched: Domestic Embedded Chips Enter Phase Two — Shifting from "Availability" to "Reliable Long-Term Deployment"
  • From 800G to 1.6T: How Does GigaDevice Position Itself in AI Optical Interconnect?

    Abstract: As 800G, 1.6T, and even CPO evolve rapidly, the optical module MCU is upgrading from a basic controller to a critical management chip for complex optoelectronic systems. GigaDevice is also leveraging its dedicated MCUs, Flash, analog capabilities, and supply chain synergy to further strengthen its competitiveness in the AI optical interconnect market. In recent years, the rapid expansion of AI computing infrastructure has been transforming data transmission within data centers. 800G op

    September 18, 2026

    From 800G to 1.6T: How Does GigaDevice Position Itself in AI Optical Interconnect?
  • ASIL-D Automotive MCU Market Outlook: Brake-by-Wire, Central Control Cerebellum and MCU-less Lighting Solutions

    ResearchInChina and Zuosi Auto Research jointly released the "2026 Automotive Microcontroller (MCU) and Application Scenario Research Report". In the vehicle's electrical and electronic (E/E) architecture, MCUs are widely distributed across various functional domains of the automobile, undertaking tasks such as functional safety monitoring, real-time control, sensor preprocessing, communication power management, and redundant supervision. Functional safety levels range from ASIL A to ASIL D depe

    September 17, 2026

    ASIL-D Automotive MCU Market Outlook: Brake-by-Wire, Central Control Cerebellum and MCU-less Lighting Solutions
  • Chip Wars: 2nm VS 3nm VS Logic Folding

    In September 2026, the mobile chip market is set for an unprecedented fierce battle. The Apple A20 Pro, MediaTek Dimensity 9600 Pro, Huawei Kirin 9050 Pro, and the recently launched Xiaomi Xuanjie O3 in August—these four chips are colliding head-on within the same timeframe. Interestingly, they have adopted four distinctly different technological approaches. Apple A20 Pro On the Geekbench benchmark website, the A20 Pro in the iPhone 18 Pro Max scored 4,727 in single-core and 12,424 in multi-core

    September 16, 2026

    Chip Wars: 2nm VS 3nm VS Logic Folding
  • he Unsung MCU in AI Optical Modules: Specialization, Software-defined and Integration amid 1.6T and CPO Evolution

    Abstract: AI (Artificial Intelligence) data centers are driving the rapid evolution of optical modules from 400G and 800G to 1.6T, and a long-overlooked MCU (Microcontroller Unit) is evolving accordingly. Although it does not participate in high-speed data transmission, it handles tasks such as the CMIS protocol, firmware management, analog monitoring, fault protection, and device coordination. With the continuous addition of Flash, I3C, analog resources, and security features, optical module MC

    September 15, 2026

    he Unsung MCU in AI Optical Modules: Specialization, Software-defined and Integration amid 1.6T and CPO Evolution
  • NVIDIA's "Full-Stack Native System" for AI Agent Factories, Vera Rubin, Enters Full-Scale Production

    At present, the focus of AI is shifting from large-scale training to agentic inference, and traditional hardware design centered on GPU compute struggles to capture the real workload characteristics of AI agents. An agent's workflow consists of numerous iterative loops of reasoning, tool invocation, code execution, and result verification. This entire pipeline generates massive amounts of tokens, intertwining long-context processing with decoding latency. Minute latencies progressively amplify a

    August 31, 2026

    NVIDIA's "Full-Stack Native System" for AI Agent Factories, Vera Rubin, Enters Full-Scale Production
  • Beken: What Is Its Relationship with Broadcom?

    In the semiconductor industry, naming is somewhat of an art. Some companies are low-key and pragmatic, while others reveal extraordinary ambitions from the very beginning. Beken Corporation is exactly such a company that sparks imagination right from its name. What exactly is its relationship with Broadcom, the global communications semiconductor giant? When eefocus disassembled a Xiaomi karaoke microphone, a Xiaomi walkie-talkie, and an AI toy named "Fuzai", and saw the Beken logo prominently p

    August 27, 2026

    Beken: What Is Its Relationship with Broadcom?
  • NVIDIA Launches Jetson Orin Nano 2, Reshaping Entry-Level Edge Physical AI

    Fresh off the release of the Jetson AGX Orin 3000 and 2000 last month, NVIDIA today introduced another robot computer targeting entry-level Edge AI—the Jetson Orin Nano 2. Behind these successive hardware updates lies a unified industry trend: optimized and compressed frontier large models are no longer exclusive to cloud servers; rather, there is an urgent need to deploy them into real-world physical devices. Image source: NVIDIA Deepu Talla, Vice President of Robotics and Edge AI at NVIDIA, po

    August 26, 2026

    NVIDIA Launches Jetson Orin Nano 2, Reshaping Entry-Level Edge Physical AI
  • Behind the Successful Hosting of the "Xiandao Cup" National Computer Competition: Domestic Computing Power Advances from "Usable" to "Highly Usable"

    On August 15, the offline finals and award ceremony of the 2026 National College Students Computer System Capability Competition - Intelligent Computing Innovation Design Competition ("Xiandao Cup") concluded at Tongji University. A total of 160 universities, over 500 teams, and nearly 1,900 students participated in the competition. The two major competition topics focused on the inference optimization of the Qwen Large Model and the deployment of the Meteorological Large Model, respectively. Du

    August 21, 2026

    Behind the Successful Hosting of the "Xiandao Cup" National Computer Competition: Domestic Computing Power Advances from "Usable" to "Highly Usable"
  • Why Does Robot Joint Control Require a "Dedicated" MCU?

    As large models transition from the virtual world to the physical space, embodied AI has become a new focal point in the global technological competition. According to forecast data from the Gaogong Robot Industry Institute (GGII), global sales of humanoid robots will experience explosive growth in 2026, approaching 94,700 units, achieving a nearly fivefold leap compared to 18,500 units in 2025. In this globally anticipated wave, a crucial hardware fact often overlooked by the public is that up

    August 18, 2026

    Why Does Robot Joint Control Require a "Dedicated" MCU?
  • Chengheng Micro Launches CH37 Series AI SoC, Rebuilding the Computing Foundation for Edge and Endpoint Intelligence

    A product launch event themed "Awakening at the Edge and Endpoint, Intelligent Computing for the Future" has put a chip company founded just three years ago in the spotlight. On August 13, 2026, Wuxi Chengheng Microelectronics Co., Ltd. (Chengheng Micro) officially launched the CH37 series AI SoC, the company's first flagship product for edge and endpoint applications. Edge and endpoint AI is an exploding trillion-yuan market. According to Frost & Sullivan, the global endpoint AI market size

    August 18, 2026

    Chengheng Micro Launches CH37 Series AI SoC, Rebuilding the Computing Foundation for Edge and Endpoint Intelligence
  • Has Japan Really Missed the Humanoid Robot Boom?

    Has Japan Lost the "Humanoid Narrative" or the Right to Define the Next Generation of Robots? Abstract: Japan was once one of the earliest countries globally to deploy humanoid robots, yet it has not become the protagonist in this wave of AI humanoid robot fever. The issue is not "technological backwardness": Japan still possesses profound accumulations in industrial robots, precision reducers, servo control, sensors, and manufacturing systems. The true shortcomings are more concentrated in VLA,

    August 14, 2026

    Has Japan Really Missed the Humanoid Robot Boom?
  • RISC-V-Based NIC Chip: Timesintelli's PT153S Ships One Million Units in Three Months

    On August 13, 2026, the 5th Dishui Lake China RISC-V Industry Forum was successfully held at the InterContinental Shanghai Dishui. Qiu Jianle, Vice President of R&D at Timesintelli, was invited to attend and introduced the company's purely domestic, high-performance, and robust NIC chip—the PT153S. Figure | Qiu Jianle, Vice President of R&D at Timesintelli Founded in Zhangjiang, Shanghai in 2018, Timesintelli focuses on three business areas: RISC-V processors, edge AI accelerators, and A

    August 13, 2026

    RISC-V-Based NIC Chip: Timesintelli's PT153S Ships One Million Units in Three Months
  • Geesemi DSP GS32MT8800 Field Test: Current Loop Runs Within 500ns, Single Chip Handles 25 Degrees of Freedom

    On August 13, 2026, the 5th Dishui Lake China RISC-V Industry Forum was successfully held at the InterContinental Shanghai Dishui Lake. Lu Xingqiang, Marketing Director of Shenzhen Geesemi Co., Ltd., was invited to attend and introduced the company's new DSP product based on RISC-V and its self-developed instruction set—the GS32MT8800. Photo | Lu Xingqiang, Marketing Director of Shenzhen Geesemi Co., Ltd. Established four years ago, Geesemi's product line currently covers digital power, server p

    August 13, 2026

    Geesemi DSP GS32MT8800 Field Test: Current Loop Runs Within 500ns, Single Chip Handles 25 Degrees of Freedom

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