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  • Q3 2026 LED Display Report: Concentrated COB Capacity Ramp, MIP/POG Progress, Micro LED Optical Communication as New Growth Curve

    In November 2026, the "Q3 2026 LED Display Industry Quarterly Analysis Report" by the Hangjia Shuo Industrial Research Center was officially released. The content covers performance reviews, event and trend interpretations, product and technology updates, as well as information and knowledge management from Hangjia Shuo. A review of key developments in the LED display industry during Q32026 is as follows: 1. The trend of "volume growth with price decline" on the display side continues, while hig

    November 12, 2026

    Q3 2026 LED Display Report: Concentrated COB Capacity Ramp, MIP/POG Progress, Micro LED Optical Communication as New Growth Curve
  • AMEC Launches Primo Matrix® Dual-Station Plasma Wafer Dicing System; First Tool Shipped to Domestic IC Packaging Customer

    On November 10, AMEC (Advanced Micro-Fabrication Equipment Inc. China) announced via its official WeChat account the launch of its new product, the Primo Matrix® Dual-Station Plasma Wafer Dicing System. The first unit has been successfully shipped to a key domestic IC packaging customer. Advanced packaging has become the core pathway for extending Moore's Law. As a critical process in packaging, wafer dicing directly determines chip yield and production line efficiency. Addressing the stringent

    November 12, 2026

    AMEC Launches Primo Matrix® Dual-Station Plasma Wafer Dicing System; First Tool Shipped to Domestic IC Packaging Customer
  • Zhongji InnoLight & Eoptolink Share Pullback; Optical Modules Face Volume-Up Price-Down, CPO & Domestic Bidding in Focus

    Shareholders of Zhongji InnoLight have had a rough four months. From July 1 to today, the stock price has fallen by 57.84%. Eoptolink’s situation is even worse, with a decline of 65.11%. In the first three quarters, the two companies generated revenues of CNY 69.5 billion and CNY 31.8 billion respectively, with growth rates of 178% and 93%. While their businesses are performing well, their stock prices have been halved. On November 11, Zhongji InnoLight once again topped the list in terms of tra

    November 12, 2026

    Zhongji InnoLight & Eoptolink Share Pullback; Optical Modules Face Volume-Up Price-Down, CPO & Domestic Bidding in Focus
  • AI Expansion Hits Power Crunch; Gas Turbine Lead Times Surge, Opening Opportunities for China’s Full Supply Chain

    It takes as little as18 months to go from groundbreaking to GPU deployment for a data center; however, the lead time for delivering a heavy-duty gas turbine has now extended beyond three years. For the first time, the pace of AI expansion is being constrained by power equipment. In 2025, global demand for gas turbines exceeded 100 GW, while supply stood at only 50–60 GW. Mitsubishi Power's production schedule extends to 2031, and GE Vernova's capacity is booked out until after 2029. Quotes for t

    November 12, 2026

    AI Expansion Hits Power Crunch; Gas Turbine Lead Times Surge, Opening Opportunities for China’s Full Supply Chain
  • Lithium Battery Export Controls Suspension Extended to Jan 2027; China-US Supply Chain Negotiation Window Opens

    Summary The negotiation window has opened. Recently, Announcement No. 58 of 2026 by the Ministry of Commerce (MOFCOM) and the General Administration of Customs stated: From November 11, 2026, to January 10, 2027, Announcements No. 55, 56, 57, and 58 of 2025 by the MOFCOM and the General Administration of Customs, as well as MOFCOM Announcements No. 61 and 62 of 2025, will continue to be suspended from implementation. As early as late October last year, China adjusted multiple export controls rel

    November 12, 2026

    Lithium Battery Export Controls Suspension Extended to Jan 2027; China-US Supply Chain Negotiation Window Opens
  • Manned eVTOL Certification Ongoing; Firefighting Low-Altitude Gear Lands G-End Procurement

    On November 4, in Wencheng, Zhejiang, at Baizhangji Town. A vacant lot piled with combustible materials was ignited, with flames reaching one to two stories high. An orange-red octocopter aerial vehicle with a fuselage length of approximately 5.7 meters took off from hundreds of meters away, carrying 12 fire extinguishing bombs under its belly. It flew above the fire point, hovered at 30 meters, and dropped the first bomb. The dry powder exploded mid-air, covering the entire ignition area. After

    November 12, 2026

    Manned eVTOL Certification Ongoing; Firefighting Low-Altitude Gear Lands G-End Procurement
  • China Lathe Growth Rises QoQ in 2026 Q1-Q3; Humanoid Robots, Liquid Cooling & Semis Drive Demand

    According to data from MIR DATABANK, the year-on-year growth rate of China's lathe sales in the first three quarters of 2026 rose quarter by quarter, with the third quarter achieving the highest YoY growth among the three quarters. While the fundamental base remains general machinery and automotive components, the steepening slope is driven by three new scenarios: humanoid robots, AI liquid cooling, and semiconductors. China Lathe Market Size and Growth Trend (Q1-Q3 2026) Data Source: MIR DATABA

    November 12, 2026

    China Lathe Growth Rises QoQ in 2026 Q1-Q3; Humanoid Robots, Liquid Cooling & Semis Drive Demand
  • JSSI (07672.HK) Jumps 28.38% on HKEX Debut; CAPiC Platform Targets TGV & CPO Advanced Packaging

    I. First-Day Surge of 28.38% Pushes Market Cap Past HKD 12.1 Billion On November 10, 2026, the Hong Kong stock market's semiconductor and AI computing hardware sectors welcomed a heavyweight new entrant. Jiangsu Xinde Semiconductor Technology Co., Ltd. (abbreviated as "JSSI," Stock Code: 07672.HK), a leading advanced packaging and testing enterprise headquartered in the Pukou Economic Development Zone of Nanjing, Jiangsu Province, officially listed on the Main Board of the Hong Kong Stock Exchan

    November 12, 2026

    JSSI (07672.HK) Jumps 28.38% on HKEX Debut; CAPiC Platform Targets TGV & CPO Advanced Packaging
  • Storage Supply Chain Value Redistribution: Fabs & Interconnect Chip Vendors Gain; Wafer Stockpiling for Spread Fades

    Agent workloads are shifting the CPU-to-GPU ratio in AI servers from the training-era standard of 1:8 toward 1:1, driving a multiplicative expansion in host-side memory and storage demand. Constrained by HBM production bottlenecks and the high premiums on large-capacity DDR5 modules, the competitive focus in AI storage is moving from single-layer high-speed video memory to cross-tier coordination among HBM, host memory, CXL, and enterprise SSDs. Google has leveraged TPU Sync to establish low-los

    November 12, 2026

    Storage Supply Chain Value Redistribution: Fabs & Interconnect Chip Vendors Gain; Wafer Stockpiling for Spread Fades
  • Huatian Pangu Panel-Level Packaging Breakthrough: Silicon Bridge & Glass Substrate Ease ABF and Interposer Shortages

    【Relevant Companies Mentioned in This Article】HT-Tech / Pangu Semiconductor, SJ Semiconductor, CXMT, XMC, SMIC, Fastprint, SCC / Sky Chip Interconnect, Zhejiang WAZAM New Materials, TSMC, PTI, ASE, Hsingchen Technology, JCET, TongFu Microelectronics, CR Micro / Sipan Micro, ECHINT Technology, Fozhixin Microelectronics, 3D CHIPS (GUANGDONG) Technology, Sky Semiconductor, WG Tech / TGVTECH, BOE, Lens Technology, Samsung Electro-Mechanics, Intel, Innolux, Absolics, Corning, SCHOTT, AGC, Rainbow Gro

    November 12, 2026

    Huatian Pangu Panel-Level Packaging Breakthrough: Silicon Bridge & Glass Substrate Ease ABF and Interposer Shortages
  • "Light Cavalry" Solar UAV Completes Maiden Flight; 8m Wingspan for Low-Altitude Long-Duration Linear Inspection

    Solar-powered UAVs have long been categorized as "stratospheric quasi-satellites": relying solely on solar radiation for energy, driving flight and charging during the day, maintaining cruise via batteries at night, and trading an energy closed-loop for endurance measured in days or weeks. On November 11, a different milestone emerged along this path—the "Light Cavalry" small-to-medium-sized solar-powered UAV, independently developed by the Eleventh Academy of China Aerospace Science and Technol

    November 12, 2026

    "Light Cavalry" Solar UAV Completes Maiden Flight; 8m Wingspan for Low-Altitude Long-Duration Linear Inspection
  • Guangdong’s 15th Five-Year Transport Plan Separates Low-Altitude Mobility; Cargo First, Manned eVTOL Developed Prudently

    When does an industry officially "graduate"? It is not about how many slogans are shouted at launch events, but rather when transport authorities write it into their five-year plans and assign it a specific slot in the hierarchy. On October 30, 2026, the Guangdong Provincial Department of Transport issued the Guangdong Provincial Comprehensive Transport Service Development Plan for the 15th Five-Year Period (Guangdong Transport Document [2026] No. 160). Low-altitude transportation secured its ow

    November 12, 2026

    Guangdong’s 15th Five-Year Transport Plan Separates Low-Altitude Mobility; Cargo First, Manned eVTOL Developed Prudently
  • Intelligent Driving Perception Tested by Tunnel Exit Light Shifts; Exposure, HDR & Sensor Fusion Explained

    When a vehicle exits a tunnel, it may face bright sunlight on a clear day, or encounter shadows, wet road surfaces, and dense traffic. Although the tunnel exit appears to be just an ordinary stretch of road, it concentrates imaging, object recognition, multi-sensor fusion, and vehicle control into a single scenario. For intelligent driving systems, diverse environmental changes test whether cameras can clearly see lane markings, leading vehicles, and obstacles on the road, and whether perception

    November 12, 2026

    Intelligent Driving Perception Tested by Tunnel Exit Light Shifts; Exposure, HDR & Sensor Fusion Explained
  • HP 65W GaN Charger Teardown, Cylindrical Design, Folding Plug, Made by Aohai Tech

    Chongdiantou recently obtained a 65W USB-C GaN fast charger launched by HP. This product features a compact, elongated cylindrical body design, equipped with new national standard semi-overmolded foldable pins, and comes with a 2-meter long 5A USB-C fast charging cable, balancing portability and output performance. This charger supports the mainstream USB PD3.0 65W fast charging standard, offering four fixed voltage levels: 5V3A, 9V3A, 15V3A, and 20V3.25A, meeting the fast charging needs of devi

    November 12, 2026

    HP 65W GaN Charger Teardown, Cylindrical Design, Folding Plug, Made by Aohai Tech
  • Solving Token Waste: How Compute Tokens and Physical Tokens Build a Value Loop

    Author: Peng Zhao In the first week of November, Tokens saw a wave of widespread attention: On the evening of November 2, Li Jiaqi's livestream listed an invisible product—a monthly membership card for Qwen Office. Priced at CNY 0.01 during the stream, nearly 100,000 units were sold within half an hour, equivalent to 2 trillion Tokens. A Token is the smallest unit for large models to read and write information; depending on the model, one Token roughly corresponds to 1.5 Chinese characters. On N

    November 11, 2026

    Solving Token Waste: How Compute Tokens and Physical Tokens Build a Value Loop
  • 2026 Chip Startup Boom: Capital Races in Weeks, While Chip R&D Runs in Years

    Author: Bao Yonggang | Editor: Liu Wei With CNY 50 million on the table, Dr. Zhang ultimately decided not to start his own company. He had just left an acquired firm when he encountered a new wave of chip startups. A prominent VC was willing to provide CNY 50 million for him to assemble a team and serve as CEO. Dr. Zhang frequently met with investors and scouted for core members; the project had already reached the launch stage. Soon after, he stopped. After speaking with investors and others in

    November 11, 2026

    2026 Chip Startup Boom: Capital Races in Weeks, While Chip R&D Runs in Years
  • Beni Robot: Balancing Utility & Companionship, Consumer Embodied AI Doesn’t Have to Choose

    Author | Dong Zibo Editor | Lin Juemin In the consumer embodied AI industry, one topic has been debated endlessly: "For a robot to be truly accepted by C-end users, is utility or companionship the primary factor? Some argue that for embodied AI to enter homes, it must perform tasks to generate real value. Therefore, they focus their efforts on specific scenarios, competing fiercely in models, data, and hardware, trying to make robots truly 'useful' and reliable 'helpers' in the home. After all,

    November 11, 2026

    Beni Robot: Balancing Utility & Companionship, Consumer Embodied AI Doesn’t Have to Choose
  • Denglin Tech Lists on HKEX, Self-developed Minsky GPGPU Targets Enterprise AI

    Author | ZeR0 Editor | Moying XinDongXi reported on November 10 that Denglin Technology, a Suzhou-based general-purpose GPU (GPGPU) company in Jiangsu, has officially listed on the Hong Kong Stock Exchange. The offer price for Denglin Technology was HKD 231.00 per share (approximately CNY 196.50). At today's open, the stock fell by 0.87% to HKD 229.00 per share (approximately CNY 194.80). By 9:45 AM, its share price had dropped as much as 5.97% to HKD 217.20 per share (approximately CNY 184.76),

    November 11, 2026

    Denglin Tech Lists on HKEX, Self-developed Minsky GPGPU Targets Enterprise AI
  • New Trends in Semiconductor Fab Construction

    As the global semiconductor market continues to expand, domestic wafer manufacturing and advanced packaging production lines are entering a new peak of capacity expansion. Behind the continuous shrinking of chip dimensions and increasingly complex structures, requirements for micro-vibration control, air cleanliness, and temperature/humidity precision in production workshops have risen significantly. Semiconductor fab construction has evolved from simple building work into complex environmental

    November 11, 2026

    New Trends in Semiconductor Fab Construction
  • JSSI Surges on HKEX Debut; Xiaomi, OPPO & MediaTek Back Its 2.5D/3D Packaging

    Author | Cui Yuanwei Editor | Chen Junda ChipInsights reported on November 10 that Jiangsu-based semiconductor packaging and testing company Jiangsu Xinde Semiconductor Technology (JSSI) listed on the HKEX today. Based on the final offering price of HK$8.88 per share (approx. CNY 7.6), the total fundraising amount for this IPO is approximately HK$946 million (approx. CNY 800 million). After deducting underwriting commissions and related issuance expenses, the company raised a net amount of appro

    November 11, 2026

    JSSI Surges on HKEX Debut; Xiaomi, OPPO & MediaTek Back Its 2.5D/3D Packaging

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