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AMEC Launches Primo Matrix® Dual-Station Plasma Wafer Dicing System; First Tool Shipped to Domestic IC Packaging Customer

by bandaotifengce·November 12, 2026

On November 10, AMEC (Advanced Micro-Fabrication Equipment Inc. China) announced via its official WeChat account the launch of its new product, the Primo Matrix® Dual-Station Plasma Wafer Dicing System. The first unit has been successfully shipped to a key domestic IC packaging customer.

Advanced packaging has become the core pathway for extending Moore's Law. As a critical process in packaging, wafer dicing directly determines chip yield and production line efficiency. Addressing the stringent requirements of advanced packaging for high precision, low damage, and narrow scribe lanes, AMEC has achieved a significant technological breakthrough in plasma wafer dicing. The Primo Matrix® series represents AMEC's core proprietary achievement in plasma dicing for advanced packaging, providing a leading indigenous solution for the localization of this technology route.

Built upon the Primo TSV® plasma deep silicon etching technology, which has been fully validated in mass production, this equipment integrates dual-station etching chambers with a wafer transfer module. It combines high throughput, high precision, low cost, and strong process adaptability. It efficiently performs dicing on framed 200mm and 300mm wafers, ensuring high throughput, high integration, and lower production costs while maintaining superior process performance.

Developed based on a mature deep silicon etching technology platform, the Primo Matrix® adopts a dual-station architecture compatible with 200mm and 300mm wafer production. It supports various advanced packaging scenarios, including ultra-thin wafers and wafers with bumps. The system supports minimum scribe lanes of 5μm, reducing wafer area waste, and is scalable to multiple stations, balancing process flexibility with mass production capacity.

The introduction of this new product further enriches AMEC's portfolio in the advanced packaging sector, offering domestic packaging lines an alternative for localized equipment.

After years of development, AMEC's etching equipment now covers processes from 65nm to 3nm and beyond, with several products achieving internationally top-tier performance. As of the end of September 2026, more than 9,300 reaction chambers have been validated in mass production across over 220 production lines worldwide. According to the company's plan, AMEC will continue to expand its product landscape over the next five years, aiming to cover more than 60% of the high-end semiconductor equipment market and more than 70% of the advanced packaging equipment market.

Looking ahead, AMEC will continue to practice its "Five Top-Tens" corporate culture, maximizing total enterprise energy and net competitive energy externally. The company is committed to a path of high-speed, stable, healthy, and secure high-quality development, striving to join the international first tier of micro-fabrication equipment manufacturers in terms of scale, product competitiveness, and customer satisfaction.

These continuous product breakthroughs are underpinned by a pioneer in the semiconductor industry—Dr. Gerald Yin, Founder of AMEC.

Dr. Gerald Yin, Founder, Chairman, and CEO of AMEC, is often referred to in the industry as the "Father of China's Etch Machines." He graduated from the University of Science and Technology of China with a bachelor's degree and earned a Ph.D. in Physical Chemistry from the University of California, Los Angeles (UCLA). Earlier in his career, he held positions at global leaders such as Intel, Lam Research, and Applied Materials. Having dedicated decades to plasma etching technology, he is one of the core inventors of several generations of plasma etch systems and holds hundreds of domestic and international patents.

In 2004, Dr. Yin led his team back to China to found AMEC, targeting "bottleneck" equipment such as high-end semiconductor etching and thin film deposition. Under his leadership, the team gradually broke overseas monopolies and propelled Chinese-made micro-fabrication equipment onto global mass production lines. Over the years, he has adhered to a path of independent innovation, growing AMEC into China's leading etch equipment provider and establishing himself as a symbolic leader in the progress of domestic semiconductor equipment self-sufficiency.