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  • Jingneng Microelectronics Signs MoU With Wolfspeed

    On October 12, Jingneng Microelectronics issued a press release announcing the signing of a Memorandum of Understanding (MoU) with Wolfspeed, specifically highlighting the signing location—the Geely Technology Building in Hangzhou. This partnership is another key move by Jingneng Microelectronics following the completion of its share reform and a CNY 630 million Series C funding round. It also represents a crucial step in the implementation of Wolfspeed's Greater China strategy. This is not a si

    October 14, 2026

    Jingneng Microelectronics Signs MoU With Wolfspeed
  • YASC Officially Kicks Off IPO; CITIC Construction Investment Acts as Sponsor for SiC Power Semiconductor Listing

    Recently, YASC announced the convening of its IPO project kickoff meeting, indicating that another domestic silicon carbide (SiC) company is embarking on the listing process. According to observations by "Hangjia Shuo Sandai Ban," since 2025, multiple domestic SiC companies have engaged in the listing process, including SICC, TanKeBlue Semiconductor, Tianyu Semiconductor, Epiworld International, and BASiC Semiconductor. This not only reflects the growth and expansion of SiC companies but also de

    October 13, 2026

    YASC Officially Kicks Off IPO; CITIC Construction Investment Acts as Sponsor for SiC Power Semiconductor Listing
  • SmartSens Completes CNY3.2B Private Placement; DJI & Orbbec Subscribe to Boost High-Performance CIS & Automotive Vision Chips

    On October 1, 2026, SmartSens (688213.SH) disclosed the report on the issuance of its private placement, issuing approximately 36.76 million shares at CNY 87.05 per share, raising a total of CNY 3.2 billion. Among the 11 allocated objects, Huaxin Dingxin subscribed for CNY 800 million, and four funds under Zhongyang subscribed for a total of CNY 1.52 billion; Shanghai Feilai Information Technology under the DJI system, Orbbec, and Shanghai International Group Investment Co., Ltd. also participat

    October 13, 2026

    SmartSens Completes CNY3.2B Private Placement; DJI & Orbbec Subscribe to Boost High-Performance CIS & Automotive Vision Chips
  • Automotive‑grade SiC Growth: Three Chinese Power Semiconductor Firms Deliver Strong 2026 Business Momentum

    In 2026, the prosperity of the silicon carbide (SiC) industry continues to rise, and downstream demand steadily expands, driving continuous improvement in corporate orders and performance. Recently, three domestic power semiconductor companies have jointly announced significant growth in their SiC revenue and shipment volumes: Yangjie Technology: In the first three quarters of 2026, the revenue of its SiC business achieved a year-on-year growth of over 100%; CR Micro: In the first half of 2026,

    October 12, 2026

    Automotive‑grade SiC Growth: Three Chinese Power Semiconductor Firms Deliver Strong 2026 Business Momentum
  • Sep 2026 Semiconductor Market: AI-Driven Component Shortage and Price Trends

    In September 2026, the electronic components market continued to experience structural tightness. AI servers drove a surge in demand for high-end materials such as memory, MLCCs, and power devices. Original manufacturers continuously shifted capacity towards HBM, automotive-grade, and high-end passive components, leading to generally extended lead times for core categories and sustained price increases. Prices for analog, MCU (Microcontroller Unit), and discrete devices showed divergence. New pr

    October 12, 2026

    Sep 2026 Semiconductor Market: AI-Driven Component Shortage and Price Trends
  • Lithium Material Listed Firm Embarks on Semiconductor Journey: Qiyuan Gas Boasts Dual Lithography Gas Certifications from Cymer & GIGAPHOTON

    zhangtongshe.com Stepping into the semiconductor field. Recently, Sunyes Electronic Manufacturing announced that it is planning to acquire a controlling stake in Shanghai Qiyuan Gas Development Co., Ltd. (hereinafter referred to as "Qiyuan Gas") by issuing shares and paying cash, and to raise matching funds. This transaction is expected to constitute a major asset restructuring. This marks a critical leap for an electronic process products company into the semiconductor sector. A Listed Company

    October 11, 2026

    Lithium Material Listed Firm Embarks on Semiconductor Journey: Qiyuan Gas Boasts Dual Lithography Gas Certifications from Cymer & GIGAPHOTON
  • 4 Domestic SiC Projects Accelerate Construction: Modules Packaging & Optical-Grade SiC Powder Advance in Parallel

    Recently, four domestic silicon carbide (SiC) projects have announced new progress, with their construction processes steadily accelerating: Leapers: Phase I of the Yangzhou SiC project is expected to be completed and delivered by the end of the year, with an annual capacity of 1.5 million units; Galaxy Microelectronics: The new base is expected to enter the trial production stage in the second quarter of next year, producing 50 million IGBT and SiC power modules; Singa Electronics: The dedicate

    October 11, 2026

    4 Domestic SiC Projects Accelerate Construction: Modules Packaging & Optical-Grade SiC Powder Advance in Parallel
  • Episil Financial Briefing: SiC Enters V-Shaped Rebound, 8-inch SiC Ready for Small-Batch Production & GaN Boosted by AI Datacenter Demand

    What is the real state of the SiC industry in 2026? And where will it head in 2027? These are probably the most urgently sought answers in the current market. On October 7, Episil Technologies released its latest financial report, using keywords such as "price hikes," "V-shaped rebound," and "rapid recovery of capacity utilization rate" to provide three strong signals from the front lines of the industry. Continuous Financial Improvement Operations Emerging from the Trough First, let us take a b

    October 11, 2026

    Episil Financial Briefing: SiC Enters V-Shaped Rebound, 8-inch SiC Ready for Small-Batch Production & GaN Boosted by AI Datacenter Demand
  • China’s Industrial Control Core Power Components: Market Growth, Role Shift & Three Major Industrial Hurdles

    Author: Cai Lu Servo systems and inverters hold a pivotal position in the wave of domestic substitution in industrial automation. They connect the performance breakthroughs of upstream semiconductor components with the intelligent upgrades of downstream manufacturing scenarios. They serve not only as the core execution terminals for achieving high-precision control and flexible speed regulation of equipment, but also as the core engine driving the entire industrial control supply chain to break

    October 10, 2026

    China’s Industrial Control Core Power Components: Market Growth, Role Shift & Three Major Industrial Hurdles
  • A-share STAR Market Semiconductor Valuation vs US Stocks: PE-TTM, Forward PE & Historical Percentile Benchmark

    Statistical basis: Unless otherwise specified, the price-to-earnings ratio refers to the trailing twelve months PE (PE-TTM); A-shares are denominated in CNY, while US stocks are in USD. Data sources and time points are marked in the tables and are for reference only. I. Direct Comparison at the Index Level (SSE STAR Market vs. US Stocks) Metric SSE STAR Market/A-shares PE-TTM (x) US Counterpart PE (x) A-share/US Multiple SSE STAR Market Chip Index STAR Chip (000685.SH) 137.97 Philadelphia Semico

    October 10, 2026

    A-share STAR Market Semiconductor Valuation vs US Stocks: PE-TTM, Forward PE & Historical Percentile Benchmark
  • From "Large but Low Value" to High-End Intelligent Manufacturing: Electronics Industry Rides AI Computing Power Boom

    Recently released data from the National Bureau of Statistics shows that from January to August, the profits of large-scale computer, communication, and other electronic equipment manufacturing (hereinafter referred to as the "electronic information manufacturing industry") increased by 1.1 times year-on-year, contributing 62% to the total profit growth of all large-scale industrial enterprises. A single industry accounting for the "major half" of the national industrial enterprise profit growth

    October 9, 2026

    From "Large but Low Value" to High-End Intelligent Manufacturing: Electronics Industry Rides AI Computing Power Boom
  • 12 Chinese Chip Cities Profiled: Diverse Industrial DNA, From Shanghai’s Full-Spectrum Ecosystem to Shenzhen’s Terminal-Driven Chip Design

    A 'Chip City' Competition Is Quietly Reshaping China's Urban Landscape Twelve Cities, Twelve 'Divine Beasts' This Time, We Unfold China's 'Chip' Map in a New Way Each city's IC (Integrated Circuit) industry development has its own characteristics, just as every animal has its own nature. Some are bold and enterprising, while others accumulate strength for a sudden burst. Behind each characteristic lies the unique IC footprint of the city. What animals would the twelve representative 'chip cities

    October 9, 2026

    12 Chinese Chip Cities Profiled: Diverse Industrial DNA, From Shanghai’s Full-Spectrum Ecosystem to Shenzhen’s Terminal-Driven Chip Design
  • SiC Remains Core Financing Engine; Ga₂O₃ Ultra-Wide Bandgap Materials Attract Fresh Capital Infusion in 2026

    Since 2026, financing enthusiasm in the domestic third-generation semiconductor sector has gradually returned to rationality. Primary market capital has moved away from blind concept speculation, with funds significantly concentrating on industrialized enterprises that have achieved product sampling, customer validation, and small-batch delivery. Among the sub-sectors, Silicon Carbide (SiC) remains the core driver of financing. Financing for Gallium Nitride (GaN), Gallium Oxide (Ga2O3), and upst

    October 8, 2026

    SiC Remains Core Financing Engine; Ga₂O₃ Ultra-Wide Bandgap Materials Attract Fresh Capital Infusion in 2026
  • Domestic Substitution Race in Low-Dk & Low-CTE Electronic Fabric: Chinese Firms Break Japanese Dominance

    Textile mills have been weaving fabric for a lifetime, but there is one type of fabric whose customers are not apparel brands, but NVIDIA and Apple. It is not used for clothing, nor is it dyed or printed; instead, it has become the most lucrative yet low-profile track right now—electronic fabric, fully named electronic-grade glass fiber fabric, which is the core skeleton material for copper clad laminates (CCL) and printed circuit boards (PCB). Without it, there would be no PCBs; without PCBs, t

    October 8, 2026

    Domestic Substitution Race in Low-Dk & Low-CTE Electronic Fabric: Chinese Firms Break Japanese Dominance
  • Lithium Niobate: The "Optical Silicon" Bridging AI Optical Interconnects and Quantum Devices, National Quantum Standards Accelerate Industrial Rollout

    In mid-September, the State Administration for Market Regulation (SAMR) released a batch of national standards for core quantum devices. Lithium niobate, explicitly named in the "Test Methods for Performance of Periodically Poled Lithium Niobate Quantum Frequency Conversion Devices," immediately became the focus of renewed market attention. 01. Lithium Niobate: The "Universal Crystal" in the Optical World Lithium niobate is a synthetically grown optical crystal, referred to in the industry as "o

    October 8, 2026

    Lithium Niobate: The "Optical Silicon" Bridging AI Optical Interconnects and Quantum Devices, National Quantum Standards Accelerate Industrial Rollout
  • AMD Buys World Labs & GF Acquires Processor IP: Physical AI Redraws Semiconductor Industry Boundaries

    On September 28, AMD announced that it had reached a definitive agreement to acquire World Labs, founded by Fei-Fei Li, in an all-stock transaction valued at approximately USD 8.2 billion. The transaction is subject to regulatory approval and is expected to close by the end of this year. World Labs focuses on spatial intelligence and world models, among other areas. Upon completion of the transaction, Fei-Fei Li will join AMD as Executive Vice President and Chief Scientist. A semiconductor compa

    October 8, 2026

    AMD Buys World Labs & GF Acquires Processor IP: Physical AI Redraws Semiconductor Industry Boundaries
  • Three SiC Giants Secure New Orders: Epiworld, ST & ROHM Announce Major Deals

    Recently, three leading silicon carbide (SiC) companies have secured new orders: Epiworld International: Secured an additional order for SiC epitaxial wafers from an international customer, with an order value of approximately CNY 646 million; STMicroelectronics: Partnered with SST enterprise DG Matrix to provide SiC power devices and collaborative technology development; ROHM Semiconductor: SiC devices adopted by BMW for its electric vehicle platform. Epiworld International: Secured a Single Or

    October 5, 2026

    Three SiC Giants Secure New Orders: Epiworld, ST & ROHM Announce Major Deals
  • Electronic Materials Enter Sustained Price Hike Cycle; AI Computing Power Triggers Full-Chain Price Reshaping Across PCB & Semiconductor Segments

    In early September, the electronic materials industry witnessed a synchronized "price tag change": Japan's Panasonic raised substrate material prices effective that day, with some products increasing by up to 30%; Nan Ya Plastics, headquartered in Taiwan, China, implemented new prices for copper clad laminates and prepregs simultaneously, with increases of 20% to 25%; South Korea's Samsung Electro-Mechanics raised prices across its entire MLCC product line by 30%; and China Jushi, a domestic lea

    September 30, 2026

    Electronic Materials Enter Sustained Price Hike Cycle; AI Computing Power Triggers Full-Chain Price Reshaping Across PCB & Semiconductor Segments
  • Semiconductor Materials Sector Enters Cost Pass-Through Phase: Silicon Epitaxial Wafers to Rise 15%-20%

    The semiconductor materials sector has seen another wave of price hike news! Recently, Nanjing Guosheng Electronics, Nanjing Shengxin Semiconductor Materials, and CETC Jinghua (Tianjin) Semiconductor Materials have successively issued price adjustment notices to their customers. Silicon epitaxial materials are about to experience a round of centralized price increases, with this round of hikes officially taking effect from October 1, 2026. Among them, CETC Jinghua explicitly stated in its price

    September 29, 2026

    Semiconductor Materials Sector Enters Cost Pass-Through Phase: Silicon Epitaxial Wafers to Rise 15%-20%
  • From Materials to Substrates: A Review of 12 Indium Phosphide Companies

    Indium Phosphide (InP) is a binary compound semiconductor formed by the combination of Group IIIA indium and Group VA phosphorus. It belongs to direct bandgap semiconductors and features a zincblende crystal structure. The journey from indium ore to InP substrates requires a complete process chain: crude indium, mostly a byproduct of tin and zinc smelting, is purified via electrolysis and vacuum distillation to produce high-purity indium of 5N or above; high-purity red phosphorus is obtained thr

    September 29, 2026

    From Materials to Substrates: A Review of 12 Indium Phosphide Companies

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