At the intersection of the digitalization wave and the green low-carbon transition, the global electronic components industry has welcomed a "new force" that carries genes of precision manufacturing while brimming with entrepreneurial vitality. On November 5, the ninth China International Import Expo (hereinafter referred to as "CIIE") grandly opened in Shanghai. Electronic component innovation company Aratas Corporation made its debut with a brand-new image in the Technology Equipment Exhibitio
November 10, 2026
At SAECCE, Murata showcased automotive-grade capacitors, PoC, IMUs, sensors, and local simulation/test support for intelligent driving. It is extending proven automotive technologies to humanoid robots and eVTOLs, targeting sensing, power, motor drive, and reliability modules amid early-stage standards.
November 9, 2026
Recently, several new developments have emerged in the automotive-grade SiC application field. It can be observed that high-voltage SiC and embedded SiC are accelerating toward market application, and the trend of automakers developing their own SiC chips is becoming increasingly clear: AccoPower Semiconductor & InfiMotion: Electric drive assemblies equipped with 1400V SiC chips and modules have been mass-produced. Infineon: Vehicles featuring embedded SiC are scheduled for mass production i
November 9, 2026
Increasing demand from high-voltage platforms in new energy vehicles (NEVs), energy storage systems, and server power supplies is driving growth for silicon carbide (SiC) and gallium nitride (GaN). However, the benefits are not evenly distributed across the supply chain. Recently, third-quarter reports for A-share listed companies in the third-generation semiconductor industry have been largely released. Commercialization stages vary significantly among substrate, epitaxy, power devices, and pow
November 4, 2026
Author: Jiulin Recently, multiple listed companies in the semiconductor industry have released their Q3 performance announcements. We observed that ChangXin Memory Technologies (CXMT) achieved a cumulative revenue of CNY 269.024 billion in the first three quarters, with a year-over-year increase of 738.51%. Its net profit attributable to parent company shareholders reached CNY 132.040 billion, completing a dramatic turnaround from a massive loss last year to generating billions in profits this y
November 4, 2026
Recently, China Jushi disclosed its Q3 2026 report. The report shows that the company achieved operating revenue of CNY 18.078 billion in the first three quarters, a year-on-year increase of 30.02%; total profit was CNY 6.533 billion, up 102.11% YoY; net profit attributable to shareholders of the listed company reached CNY 5.346 billion, an increase of 108.15% YoY; and net profit attributable to shareholders after deducting non-recurring gains and losses was CNY 5.313 billion, up 103.39% YoY. Du
November 3, 2026
In 2011, in an unassuming factory building in Haidian, Beijing, a few individuals were wrestling with several pieces of equipment. At that time, silicon carbide (SiC) was still an extremely obscure term in China. Investors would politely nod after hearing the pitch, calling it "a story for ten years later," and then turn their attention to chasing the booms in photovoltaics and LEDs. Customers would inspect samples repeatedly, with their first question always being, "Can this be cheaper?" Even s
November 3, 2026
Recently, Sanan Optoelectronics, CR Micro, Yangjie Technology, StarPower Semiconductor, and five other companies related to third-generation semiconductors successively released their Q3 2026 financial reports, disclosing operational results for the first three quarters and the latest progress in SiC and GaN businesses. Sanan Optoelectronics: Revenue Exceeds CNY 10 Billion in First Three Quarters Sanan Optoelectronics achieved revenue of CNY10.039 billion in the first three quarters of 2026, a y
November 3, 2026
The market typically ranks semiconductor companies by market capitalization and revenue scale. However, an analysis of the Q3 2026 reports reveals that the true value of leading companies lies not in who has higher revenue, but in whose profits withstand scrutiny and whose valuations can be justified. This article uses the top ten A-share semiconductor companies by total market capitalization as a sample, breaking down each company's latest P/E ratios and sell-side target valuations to determine
November 3, 2026
In the broader industry context, this news is hardly a major headline. It involves a silicon carbide (SiC) design company established in 2025, spun off from its parent company's power device business unit to operate independently in the market; and a packaging and testing manufacturer with over thirty years of experience in discrete devices, whose name exudes the steady aura of an old-established brand. The two parties have signed a strategic cooperation intent for SiC discrete MOSFET packaging.
November 2, 2026
In this episode of "Daily SSE STAR Market," we look at SICC (688234). According to the company's Q3 2026 report, revenue for the first three quarters reached CNY 1.559 billion, a year-on-year increase of 40.22%; net profit attributable to shareholders was CNY 27.2162 million, up 2330.24% year-on-year; and net profit attributable to shareholders excluding non-recurring items was CNY 8.8295 million, turning from a loss to a profit. Specifically, in Q3 alone, revenue was CNY 646 million, up 102.89%
November 2, 2026
Recently, Nanya New Material disclosed an announcement stating that to deepen its global strategic layout, enhance the company's comprehensive competitiveness and international influence, and expand diversified financing channels, the company is planning to issue overseas shares (H-shares) and list on the Hong Kong Stock Exchange. Nanya New Material stated that, as of now, the company is discussing relevant work regarding this H-share issuance and listing with related intermediary institutions,
November 2, 2026
As the focus of generative AI shifts from the cloud to the edge, intelligent cockpits and Agent Boxes (AI agent boxes) have become key battlegrounds for large model deployment. However, a fundamental physical contradiction exists between the limited hardware resources of edge devices and the massive scale of large models, which often contain billions or even tens of billions of parameters. The challenge facing the entire industry is how to reduce model size while preserving logical capabilities
October 29, 2026
On October 19, the Hohhot Economic and Technological Development Zone officially signed an agreement with Xiyue Semiconductor (Beijing) Co., Ltd. The landed project is an "Ultra-High Voltage Power Semiconductor Device Production Project" with a total investment of CNY 558 million. According to the announcement schedule, the project has allocated only a 10-month construction period for itself, planning to commence production in November 2027. In this round of capacity expansion in the power semic
October 25, 2026
In October 2026, Macrocore Semiconductor announced the completion of its Series B+ funding round of hundreds of millions of CNY. Shortly after, the Series B++ round was also closed. The company also revealed that it will launch its Series C round in the fourth quarter, along with the share reform. Wow, Macrocore Semiconductor's rapid-fire series of moves has turned the funding pace into a thrilling drama. Before the audience can even memorize the investor list from the previous episode, the titl
October 23, 2026
At the end of August, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. ("XMC") released the "Xinguang Plan" for the next decade, targeting 3D storage-computing and optoelectronic integration; at the end of September, the second phase of the advanced packaging pilot platform of Hsingchen Technology, an incubated enterprise of Jiangcheng Laboratory, was officially put into operation, building the first domestic 3D advanced packaging mass production line; in October, HGTECH showcased cutting-edge
October 21, 2026
On October 15, YOFC Advanced Semiconductor Co., Ltd. (YASC) held a technology conference in Shenzhen themed "Beyond the Peak: A Four-Year Technological Long March". The company unveiled a range of innovative achievements, including the latest generation of main drive-level SiC MOSFETs, trench gate technology platform, embedded PCB modules, and diffusion soldering power modules, marking a new milestone in its technological long march. As an invited media outlet, "Hangjia Shuo Sandaiban" attended
October 20, 2026
Amid the dual technological evolution of high-voltage main drives in new energy vehicles and high-power-density AI computing power supplies, the competitive focus in the silicon carbide (SiC) power semiconductor sector has shifted from simple material substitution to deep integration of "process miniaturization—packaging thermal management—electronic control system integration." At the 2026 Bay Area Semiconductor Industry Ecology Expo (WESEMiBAY), YASC disclosed the latest electrical data and pr
October 19, 2026
The story of Jinqiao Equipment Town is just unfolding its prologue. Recently, the 26th China International Industry Fair - Integrated Circuit Exhibition (ICES) opened at the National Exhibition and Convention Center (Shanghai). In the vast exhibition area, the largest exhibitor was not a single company, but a "town". With a booth of nearly 500 square meters, more than 20 companies formed a delegation: etching machines, cleaning machines, metrology and inspection equipment, vacuum valves, probe c
October 18, 2026
On 12 October, the primary market unveiled two major funding announcements on the same day. ChinaVenture exclusively disclosed that AI Infra company Infinigence AI has completed a new round of financing of CNY 2.3 billion, with cumulative financing exceeding CNY 4.3 billion, and has secretly submitted a listing application to the Hong Kong Stock Exchange, with the earliest listing in the first half of 2027; almost at the same time, Pedata reported that RISC-V server CPU company Lanxin Computing
October 17, 2026
