Recently, several new developments have emerged in the automotive-grade SiC application field. It can be observed that high-voltage SiC and embedded SiC are accelerating toward market application, and the trend of automakers developing their own SiC chips is becoming increasingly clear:
AccoPower Semiconductor & InfiMotion: Electric drive assemblies equipped with 1400V SiC chips and modules have been mass-produced.
Infineon: Vehicles featuring embedded SiC are scheduled for mass production in 2027.
Li Auto: Over the past year, self-developed silicon carbide power chips have seen 4 million units installed in vehicles with zero failures.
Hyundai Mobis: Collaborating with foundries such as SK Key Foundry to promote the mass production and vehicle integration of self-developed SiC.
01. AccoPower Semiconductor & InfiMotion: Mass Production of SiC Electric Drive Assemblies
On November 4, AccoPower Semiconductor revealed via its official WeChat account that high-voltage electric drive assemblies, equipped with AscenPower and AccoPower Semiconductor's second-generation 1400V silicon carbide MOSFET main drive chips and supporting power modules, have achieved mass production at InfiMotion, a leading domestic three-electric system enterprise.
AccoPower Semiconductor stated that this mass production indicates that the relevant products have completed customer selection, verification, and mass production introduction processes, entering a normal supply phase.
It is understood that AscenPower and AccoPower Semiconductor have established an automotive-grade silicon carbide supply chain capability covering chip design, wafer manufacturing, module packaging and testing, and automotive application verification. In 2025, AscenPower's first-generation silicon carbide main drive chips were already mass-produced for vehicles; in September 2026, the second-generation 1400V chip and module combination also achieved mass production for vehicles.
Currently, AscenPower has completed the layout of process platforms including 2-3kV high voltage, JFET, trench MOSFET, and super-junction MOSFET. Meanwhile, AccoPower Semiconductor's SiC power modules are installed in multiple NEVs from brands such as Geely, Hongqi, Leapmotor, Voyah, Smart, and Scania.
Wuxi InfiMotion Propulsion Technology Co., Ltd., established in 2021, is a subsidiary of Zhejiang Geely Powertrain Co., Ltd., specializing in pure electric and hybrid electric drives, power supplies, and electronic products. InfiMotion's electric drive solutions cover various voltage levels from 400V to 900V. They previously customized 900V silicon carbide electric drive systems and 16-in-1 rear-drive oil-cooled silicon carbide electric drive systems for Zeekr and Lynk & Co.
In July this year, InfiMotion revealed via its official WeChat account that its electric drive products have been supplied in bulk to global mainstream car brands such as Geely, Volvo, and Jaguar Land Rover. Overseas orders reached CNY 30 billion. In the first half of 2026, motor and controller installation volumes remained among the industry leaders, with full-year export growth expected to reach 100% in 2026.
Based on this, as the partnership between AccoPower Semiconductor and InfiMotion deepens, both parties will boost the application of domestic silicon carbide chips and modules in more brand models.
02. Infineon: Embedded SiC to Be Mass Produced for Vehicles
Recently, Infineon announced on its official website that they launched a new brand, ENDOPACK™, to provide embedded SiC chip solutions covering a wide range of voltage levels, package sizes, and application fields.
Notably, ENDOPACK Cell is ready for mass production, and vehicles equipped with this product are scheduled to enter mass production in 2027.
Infineon stated that ENDOPACK Cell is an automotive-grade high-voltage chip embedding solution designed specifically for PCB integration. It directly integrates 1200V automotive-grade SiC MOSFET technology into the circuit board, enabling automakers to develop traction inverters faster.
In terms of performance, this architecture can reduce inductance to below 2nH, thereby reducing switching losses by30% and achieving approximately 99.5% efficiency under CLTC conditions. Prototype and simulation data show that peak power density reaches up to 200kW/L, which is expected to increase vehicle range by 7%.
Actually, Infineon's technology layout originated in 2023 when they announced an expanded collaboration with PCB embedding technology company Schweizer Electronic to jointly develop solutions for directly embedding Infineon's 1200V CoolSiC™ chips into PCBs.
In 2024, Infineon launched Chip Embedding products, successfully embedding 1200V SiC chips directly into PCBs. In 2025, Infineon demonstrated a demo board of a 1200V embedded SiC module at a trade show, using two 1200V embedded SiC modules, embedding the modules into the PCB via diffusion bonding technology. Each single module used only one 25mm² silicon carbide MOSFET chip, with the module rated current reaching 100A.
From its layout path, it is evident that Infineon's strategic intent to promote embedded SiC in vehicles is clear, positioning it as a key direction for next-generation technology competition.
03. Li Auto: Self-Developed SiC Chips Mass Produced for 4 Million Vehicles
On October 20, Li Auto revealed via its official WeChat account that over the past year, Li Auto's self-developed silicon carbide power chips have seen 4 million units installed in vehicles with zero failures.
Earlier in June this year, Li Auto also disclosed that its cumulative installation volume of self-developed SiC MOSFET chips had exceeded 1.5 million units, widely applied in pure electric main drive systems. This indicates that the scale of Li Auto's silicon carbide chip installations is continuously expanding, and the pace of vehicle integration has significantly accelerated.
According to previous reports by "Hangjiashuo Third Generation Semiconductor," Li Auto's silicon carbide-equipped models include Li MEGA, Li i8, Li i6, Li L8, and other flagship models. As of October 31, 2026, Li Auto's historical cumulative deliveries totaled 1.862676 million units.
In recent years, Li Auto's layout model in the SiC field has clearly shifted to "independent R&D + foundry/independent production." In the SiC chip sector, before 2024, Li Auto primarily used ON Semiconductor and STMicroelectronics chips. After 2025, Li Auto collaborated with United Nova Technology (UNT) and Sanan Optoelectronics, adopting a foundry approach to produce self-developed silicon carbide chips.
In the SiC module sector, Sanan Optoelectronics and Li Auto jointly established Suzhou Sike Semiconductor Co., Ltd. for the R&D and production of silicon carbide modules. The factory's first-phase production line achieved operation at the end of2024. Reportedly, Suzhou Sike Semiconductor plans an annual output of 2.4 million silicon carbide half-bridge power modules, with current annual capacity at 1.2 million.
04. Hyundai Mobis: To Promote Mass Production of Self-Developed SiC
Recently, according to Yonhap News Agency, Hyundai Mobis, a core component supplier for Hyundai Motor, held an industry forum aimed at expanding cooperation in automotive semiconductors.
On that day, Hyundai Mobis signed commercial agreements with SK Key Foundry, four small and medium-sized Fabless companies, and four supporting institutions to establish a process and evaluation ecosystem for automotive power semiconductors.
They agreed to build core manufacturing capabilities and evaluation equipment for automotive silicon carbide power semiconductors through cooperation, while simultaneously developing specific vehicle and road test platforms, allowing power semiconductor Fabless companies and component suppliers to utilize these resources.
Lee Kyu-sik, President of Hyundai Mobis, stated: "To avoid individual enterprises bearing the high entry barriers of automotive semiconductors alone, we will build a full-cycle cooperation structure where responsibility is shared from development to verification and mass production." He also added that this year, they will move to a higher stage of development through actual product development, vehicle application, and verification of commercial viability.
The article further revealed that Hyundai Mobis has conducted 19 collaborative projects with domestic Korean companies in the semiconductor field, nine of which will be applied to specific models of Hyundai Motor and Kia, with the earliest launch scheduled for 2029.
According to previous reports by "Hangjiashuo Third Generation Semiconductor," Hyundai Mobis, belonging to the Hyundai Motor Group, began its layout in the silicon carbide field early on. In 2021, Hyundai Motor released its first dedicated electric vehicle platform—e-GMP, which adopts 800V charging and silicon carbide power semiconductor technology. Hyundai Mobis provides the electric drive module and battery system, already installed in models such as the IONIQ 5 and Kia EV6.
The Hyundai Motor Group plans to use this platform to create its next-generation pure electric vehicle product line, aiming to launch 23 pure electric vehicle models by 2025 and achieve global pure electric vehicle sales of 1 million units. According to Hyundai Mobis' H1 2026 report, they registered a series of core patents related to power semiconductors in the first half of this year, including "Silicon Carbide Trench Gate Power Semiconductor Device and Its Manufacturing Method." In its semi-annual report, Hyundai Mobis pointed out that in the power semiconductor field, they are independently designing Si and SiC power semiconductors and building a mass production system through cooperation with domestic foundries.