Recently, Hangjia San Ban (Third-Generation Semiconductor Insights) observed that multiple projects in the third-generation semiconductor industry chain have made new progress, involving SiC production line construction, power device packaging expansion, semiconductor component base establishment, and wafer processing consumable capacity enhancement.
01 Global Power Technology: 8-Inch Silicon Carbide Production Line Building Tops Out
According to information from "Poisson Core Energy Space," the building for the 8-inch silicon carbide (SiC) production line of Global Power Technology has successfully topped out recently.
The first phase of this project involves a total investment of CNY 400 million. Upon completion, it will form a production capacity of 20,000 8-inch SiC Schottky Barrier Diode (SBD) and MOSFET wafers per year, with an estimated annual output value of CNY 800 million. Full capacity is planned to be reached by 2028. The long-term plan for this project targets a production capacity of100,000 8-inch wafers per year.
In terms of capacity layout, Global Power Technology initiated the construction of its 4-inch SiC production line in Beijing as early as2011, which began operations in 2013. Subsequently, it established a 6-inch production line in Hunan, currently achieving an annual capacity of 100,000 wafers. The advancement of this 8-inch project will further refine its SiC wafer manufacturing layout across 4, 6, and 8 inches.
Global Power Technology is focusing on high-voltage SiC MOSFETs ranging from 2000V to 6500V, expanding into application fields such as power grids and solid-state transformers for data centers. The implementation of this project will also enhance the wafer manufacturing segment of the third-generation semiconductor industrial cluster in Shunyi District, Beijing, providing process verification and industrial collaboration opportunities for related material and equipment companies.
02 Scilicon Electric: Introduces 10 Fully Automatic Wire Bonding Machines
According to official news from Chengdu Scilicon Electric Co., Ltd., to meet growing order demands, they completed the introduction, installation, and debugging of 10 fully automatic wire bonding machines in April. These machines are now operational in the packaging workshop.
The theoretical units per hour (UPH) efficiency of the new equipment can reach 5,300 cycles/hour. After commissioning, Scilicon Electric's monthly delivery capability for its TOLL series products can reach 7 million units, helping to improve production efficiency and shorten delivery cycles. The new equipment also features crater suppression and wire loop precision control, significantly enhancing operational stability under complex bonding patterns. Currently, Scilicon Electric's total wire bonding equipment scale exceeds 60 units, covering aluminum ribbon, aluminum wire, and copper wire bonding processes.
Scilicon Electric was established in 2016, primarily engaged in power semiconductor packaging and power module business, and is expanding into new power devices such as SiC MOSFETs and GaN FETs. To date, Scilicon Electric has built packaging platforms including TOLL and TO252, with an overall monthly capacity of 50 million units.
03 Zhicheng Semiconductor: Wuhan R&D and Production Base Signed and Established
According to official news from "China Optics Valley," on October 28, the Zhicheng Semiconductor Wuhan R&D and Production Base Project was signed and settled in the Optoelectronic Integration Industrial Park within the Wuhan East Lake Comprehensive Bonded Zone. Upon completion, the project will further enhance the company's R&D and production capabilities and refine its semiconductor core component business layout.
Zhicheng Semiconductor, established in 2017 and headquartered in Shenzhen, is a national-level Specialized, Innovative, and "Little Giant" enterprise. It primarily engages in the R&D and manufacturing of semiconductor core components, with products covering multiple key semiconductor process steps including crystal growth, polishing, epitaxy, etching, oxidation diffusion, atomic layer deposition, and ion implantation. The company has currently established cooperation with over 300 leading industry customers.
Prior to this, Zhicheng Semiconductor had already laid out its SiC Material R&D and Manufacturing Headquarters Project in Huangpu, Guangzhou, with a planned total investment of approximately CNY 647 million. This project mainly produces core components such as SiC-coated graphite susceptors, focus rings, and showerheads used in semiconductor equipment for SiC epitaxy, MOCVD, and etching. Construction began in 2021, and the first production lines commenced operations in 2023.
In terms of SiC business, Zhicheng Semiconductor continues to advance the R&D and industrialization of SiC-related components and crystal growth hot zones. Some products have entered the supply systems of leading domestic semiconductor equipment and chip manufacturing enterprises.
04 Horn Precision Technology: Adds 10 SiC Thinning Wheel Production Units
According to news from "Chongchuan Online," Jiangsu Horn Precision Technology Co., Ltd. recently disclosed the latest progress in semiconductor thinning wheel capacity construction and customer expansion.
Horn Precision primarily develops and manufactures diamond grinding wheels for the thinning processing of semiconductor wafers such as silicon and SiC. It has currently built two cleanroom production lines, each with a monthly capacity of 200 thinning wheels. Additionally, the company has constructed 10 new production units, scheduled to go live soon, to further enhance precision machining capabilities and production environment standards.
Regarding customer expansion, Horn Precision stated that in May this year, its products targeting semiconductor materials such as SiC, Gallium Arsenide (GaAs), and Indium Phosphide (InP) received recognition from several leading domestic companies. They underwent customer factory audits and will proceed with scaled-up production subsequently.
On the technical front, Horn Precision continues to optimize wheel bonders, abrasive formulations, and manufacturing processes, improving product performance in terms of processing efficiency, wafer surface quality, and wheel lifespan to meet the demands for precise semiconductor wafer thinning.