Silai Semiconductor (Wuhan) Co., Ltd. (referred to as "Silai Semiconductor") is a strategic layout of the listed company DR Laser (Stock Code: 300776) in the semiconductor equipment sector. The company focuses on the R&D of complete equipment and the delivery of solutions for semiconductor material processing. Relying on the laser technology accumulation of Huazhong University of Science and Technology and its in-house R&D team, Silai Semiconductor continues to innovate and achieve breakthroughs, providing customers with low-cost, high-performance overall solutions for SiC substrate slicing, comprehensively helping customers enhance their market competitiveness.
Editor's Note Driven by the demand for NEVs and AI data centers, the domestic silicon carbide (SiC) industry is comprehensively upgrading from 6-inch to 8-inch, with 12-inch R&D accelerating simultaneously. The traditional physical contact dicing mode faces an efficiency ceiling that is hard to break through; processing a single 8-inch wafer takes over a week. In contrast, non-contact laser stealth dicing opens up new possibilities with its high efficiency and high yield. What are the differences between the two process routes? Is there really a hundredfold gap in efficiency? In this episode of "Chip Unveiled", we talk with Liu Langui, Sales Director of Silai Semiconductor, to dissect the technical logic behind it.
Welcome to the Dialogue Podcast *The following is a transcript of the podcast, confirmed and authorized by the guest.
SiC 8-Inch Upgrade: Where is the Bottleneck in Dicing Efficiency? Huanshi: Director Liu, among the numerous clients you interact with, are they all evolving from 6-inch to 8-inch large-size wafers? During this upgrade process, many enterprises are transitioning from traditional dicing processes to new dicing solutions. Your company has been deeply engaged in the new slicing technology—laser stealth dicing. We would like to invite you to start from the common market pain points and dissect the real needs of customers in the current industrial chain.
Principle of laser stealth dicing technology: Pulsed lasers are focused on the dicing plane parallel to the base plane. Local transient high temperatures generate high-density dislocations, forming a very thin modified layer mixed with amorphous silicon, amorphous carbon, and amorphous silicon carbide. In the modified layer, the material’s molecular bonds are broken and material adhesion is weakened; the wafer is then split into two separate pieces.
Liu Langui: In our view, silicon carbide is the "chosen material" in the third-generation semiconductor field, with its hardness and various electronic properties second only to diamond. Diamond is too perfect, but its processing difficulty is the highest in the world, making it hard to achieve large-scale industrialization at this stage. Therefore, silicon carbide is currently the most compatible and most practical high-performance wide-bandgap material in the industry.
Currently, the demand in scenarios such as NEVs, AR glasses, and high-voltage power electronics is comprehensively booming, driving the continuous rise in demand for SiC-based chips. Domestically, we now have mature SiC crystal growth capabilities, but the biggest bottleneck in the entire industrial chain is the extremely high hardness of SiC materials, which makes slicing processing extremely difficult. Traditional processes severely restrict the release of production capacity.
Huanshi: Compared to traditional silicon wafers, how much is the hardness of silicon carbide improved?
Liu Langui: According to the Mohs hardness scale, the hardness of silicon carbide is two orders of magnitude higher than that of monocrystalline silicon. The traditional dicing solution for silicon carbide is multi-wire diamond wire sawing. For a 6-inch SiC wafer, relying on the most advanced equipment available now, it still takes 3 days to dice a single wafer.
Mohs Hardness: Proposed by mineralogist Friedrich Mohs, it is a relative scratch hardness scale for minerals, with a grade range of 1–10. The higher the value, the more scratch-resistant the material. The Mohs hardness of monocrystalline silicon is about 7, silicon carbide can reach 9.2–9.5, and diamond is the highest grade of 10. The commercial name for single-crystal SiC jewelry is moissanite.
Liu Langui: Once the size of SiC wafers is upgraded to 8-inch, the processing time will increase exponentially. Currently, leading manufacturers in the industry have released 12-inch wafers. Even with the most advanced multi-wire dicing equipment, the dicing cycle for a single 12-inch wafer takes 10–15 days. The ultra-long processing cycle greatly extends the pace of material verification, product iteration, and capacity ramp-up, which is a common bottleneck for the scaled development of the entire SiC industry.
Laser processing technology has actually accumulated over a decade of technical precipitation. In the early days, it was mainly some manufacturers in Japan and Germany conducting laboratory research. In the past two years, with the start of the domestic SiC capacity expansion wave, the industry has been actively seeking brand-new processing solutions to replace the traditional inefficient dicing modes, and a large number of customers have come to consult us.
Relying on the profound optoelectronic technology reserves, laboratory R&D foundation, and regional industrial synergy advantages of Wuhan Optics Valley, we have developed a brand-new technology route that can significantly reduce the processing time of SiC wafers. At the Jiufengshan Exhibition in April, we heavily launched a brand-new equipment solution. Currently, the laser processing time for 8-inch SiC wafers can be reduced to 10 minutes per wafer.
Huanshi: This data comparison is too intuitive. You just mentioned that the traditional process takes 3 days for 6-inch and nearly a week for 8-inch, while your laser solution directly achieves it in ten minutes.
Liu Langui: Yes, so it has brought a huge shock to the industry. Actually, at the 6-inch stage, laser dicing could process one wafer in under half an hour, yet large-scale industrial adoption was difficult at that stage. The core reason is that traditional diamond dicing can run multiple wires in parallel. In the 6-inch scenario, the comprehensive costs of the two processes are almost the same. Without obvious advantages, the industrial chain still holds a conservative attitude towards the introduction of new processes.
As scenarios such as new energy, AI computing power, and ultra-high voltage power transmission continue to boom, the demand for SiC devices is surging. 8-inch and 12-inch large-size wafers have become a clear trend in the industry. The efficiency ceiling of traditional physical dicing is completely exposed, and the industrial value of the new laser process is thoroughly activated.
Beyond Efficiency, Yield Becomes a Key Competitiveness Huanshi: With the dicing efficiency improved, how is the yield performance? After all, the cost of SiC substrates is extremely high. Will the wafers be damaged because the dicing speed is too fast? Compared to traditional diamond multi-wire dicing, is the yield advantage of laser dicing significant?
Liu Langui: Single-crystal silicon carbide is also called moissanite, and the raw material value is very high. Yield is the core demand of the entire industry, and this is precisely where the advantage of laser dicing lies.
Traditional diamond wire is a physical contact process. During high-speed dicing, there is a certain probability of causing wafer breakage, surface defects, edge chipping, and other issues, leading to large yield fluctuations. In contrast, laser dicing is a non-contact process. By focusing the laser inside the crystal to form a modified layer, precise planar dicing is achieved before separation. The whole process has no physical wear and no extrusion damage. The yield stability is far superior to traditional processes, which is also the core reason why mainstream wafer fab customers in the industry are beginning to show great interest in laser processing.
This year, leading customers in the industry have started asking us to make samples. After testing and verification, we found that the yield advantage of laser slicing is very prominent.
Huanshi: Dual advantages, "both fast and good". Then, is the application threshold of this new process high? What is the approximate cost that needs to be invested?
Liu Langui: In the 6-inch scenario, the cost of the laser process and traditional dicing is basically the same. Upgrading to the 8-inch large-size scenario, although the procurement cost of a single laser equipment is higher, the processing efficiency and yield are improved, and the overall mass production economics far exceed traditional processes. It is the optimal solution for large-size SiC mass production.
Huanshi: What stage have overseas giants reached in the laser slicing track? Has the industry formed a unified technical consensus?
Liu Langui: In the industry, Japan's DISCO is the pioneer who first laid out laser slicing and took the lead in launching commercial equipment. However, according to our exchanges with the industry at various exhibitions, it is very difficult to sell a single unit of this equipment in China because its average unit price is several times higher than that of similar domestic equipment. Therefore, even though DISCO's equipment possesses industry-leading technology, given its extremely low cost-performance ratio, its implementation in the domestic market is very limited.
With the maturity of the domestic SiC industrial chain and the landing of large-scale mass production lines, domestic laser equipment enterprises are iterating rapidly. Currently, our technical indicators have achieved catching up with and even surpassing overseas giants. Moreover, localized services, cost-performance ratio, and process iteration speed are all advantages that overseas equipment does not possess.
Huanshi: DISCO doesn't seem to be a laser company; it mainly has a customer base in the dicing field.
Liu Langui: Right. In the past, the demand in the semiconductor industry mainly came from overseas manufacturers, and there were relatively few domestic application scenarios. With the large-scale release of domestic market demand, some leading overseas SiC enterprises have fallen into operational difficulties and started debt restructuring adjustments.
Huanshi: This shows that the competition in the domestic industrial chain has been transmitted overseas, and they also have to face transformation pressure.
Liu Langui: Yes. The current competitive advantage is the result of the joint improvement of the entire industrial chain, and we have also contributed a part of it.
Huanshi: The domestic laser industry has a solid foundation. Are there many peers currently laying out SiC laser slicing? What is the industry competition landscape like?
Liu Langui: Indeed, there are quite a few domestic enterprises conducting R&D benchmarking against overseas technology routes, and they have also achieved certain technical breakthroughs. However, relying on the optoelectronic technology accumulation of Wuhan Optics Valley, we have chosen a completely differentiated technology route. In the first half of the year, we completed on-site verification and process comparison with leading domestic customers. The test results show that our solution has obvious advantages in processing efficiency, finished product effect, and process stability.
Huanshi: This is indeed something worth being happy about. I see you speaking with great confidence; your confidence has greatly increased after customer verification.
Liu Langui: In the field of silicon carbide, our team is still very confident.
From Silicon Carbide to Diamond: The Extension Path of Laser Huanshi: Besides silicon carbide, what other cutting-edge application scenarios does this laser slicing technology have?
Liu Langui: We are currently also laying out in the more cutting-edge field of diamond semiconductor slicing.
Huanshi: Diamond is the hardest known material currently; you cannot use it to cut itself.
Liu Langui: Yes, so it can only be processed using our laser means. We started cooperating with leading customers a year ago to conduct pre-testing and process R&D. Currently, we have achieved advanced breakthroughs at the laboratory stage. When the time is right in the future, we can continue to discuss this topic.
Huanshi: Looking forward to it very much. As the core material of the fourth-generation semiconductor, diamond has strong domestic support and high industrial popularity. You see, lab-grown diamonds are no longer highly priced, which just shows how many players are working on diamond semiconductor technology.
Liu Langui: This is reshaping the global competitive landscape.
Export Data of Domestically Produced Lab-Grown Rough Diamonds in the First Half of 2026
Huanshi: I've also heard a very interesting statement: India is now the world's largest lab-grown diamond processing center because it has purchased a large amount of CVD equipment, which can maximize the production capacity scale.
Liu Langui: But CVD requires a large amount of energy support, and China has an absolute advantage in this regard. I believe that in the future, the initiative in this field will be in China's hands.
Huanshi: You transitioned from technology to the market. As an excellent salesperson, what kind of cooperative relationship should be established with customers? Especially in a hard-tech track like the semiconductor industry, the circle is relatively closed, and it is very difficult for ordinary people to break into this market.
Liu Langui: You asked a very crucial point. After graduating from school, my first job was in technical work. Later, by chance, I came into contact with the Fortune 500 technology enterprise—Siemens. Their sales concept was very advanced in China two or three decades ago, and it is still applicable today. That is, when communicating with customers, practitioners cannot merely discuss technical parameters; they must fully understand the customer’s product portfolio, existing process bottlenecks, and future technology iteration roadmaps, and be able to stand from the perspective of customer needs, provide customized process solutions, and create higher industrial value. In other words, what the high-tech field needs is technical sales; just chatting about gossip and the weather is far from enough.
Silai Semiconductor Equipment and Production Line Site (Image source: Silai Semiconductor)
Huanshi: The threshold of this industry lies in the fact that you also need to understand their field and technical bottlenecks.
Liu Langui: Yes. I have been deeply engaged in technology for many years, and later transitioned to the market, always adhering to technology as the foundation. I keep up with any technology iteration and R&D breakthrough, including how to match customer needs and how to meet customers' new processes; I must comprehensively master them. Only in this way can we provide customers with the most comprehensive solutions, explore better solution paths with customers, and truly achieve value symbiosis.
Huanshi: You are quite like an all-domain consultant, able to respond to customers' various demands at any time. Under this cooperative model, customers can discuss any new ideas with you, and you will have a stronger sense of direction when defining products. I think this is a very good sales strategy, but it has quite high requirements for people.
Liu Langui: Exactly. My requirements for the sales team are the same; they must master solid technical skills to match the long-term development needs of customers and accompany customers to iterate and grow together.
Industrial Shareholder Empowerment: Solving the Mass Production Problem of Equipment
Huanshi: As the parent company, has the listed company DR Laser provided any differentiated support in your process of expanding the market?
Liu Langui: DR Laser's help to us is all-around, mainly focusing on two levels.
The first is the R&D end. DR Laser has invested financial and technical resources in our early R&D, helping us build a complete technical framework.
The second is the mass production end. The value at this level is more critical. Our customers are all world-class enterprises. After they recognize the technology, their biggest concern is whether we can deliver in batches. At this time, DR Laser's mature experience in quality management systems and supply chain management systems, as well as its reputation in the market, gave us a great endorsement. With this guarantee, our R&D team can focus on technological innovation without worrying about the issue of mass production implementation.
Main Product System of DR Laser (Image source: DR Laser)
Liu Langui: DR Laser itself is an absolute technology leader in the solar energy field. Relying on the laser micro-nano processing base, it lays out advanced packaging, third-generation semiconductors, new displays, and high-end PCBs, exploring the second growth curve of pan-semiconductors. Under this background, its full-chain support from R&D to mass production is a very scarce resource for us.
Huanshi: The endorsement of DR Laser has indeed given you the confidence to quickly introduce customers in batches. Many companies take a long time to get batch orders, and you are moving faster in this regard. Finally, please give a future outlook, Director Liu. What kind of changes do you think will happen in the track of silicon carbide and diamond dicing in the next 3–5 years? Do you have any messages for your peers?
Liu Langui: SiC-based power electronic devices have obvious advantages over silicon-based devices. I believe the silicon carbide market will see sustained year-on-year growth over the next 3–5 years, and the device cost will continue to drop, eventually competing directly with silicon-based devices. So I am very optimistic about the future development of the SiC market.
Huanshi Invited by Jiufengshan Laboratory to Visit the Exhibition Click to Play
Huanshi: That is, everyone should not be scared by the current industry reshuffle and the stage where everyone is losing money.
Liu Langui: Right, we must have confidence in the future.
Huanshi: Okay, thank you Director Liu for bringing a different perspective to share today. Using lasers for silicon carbide dicing and achieving performance no worse than international manufacturers is indeed something to be proud of.
Liu Langui: In the future, this market will definitely belong to China. Let's create brilliance together!
END Interview | Huanshi Editor | Xiaoqie Review | Huanshi
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