From September 19 to 22, within a short span of four days, four diamond projects were successively disclosed in Yancheng (Jiangsu), Huzhou (Zhejiang), Hami (Xinjiang), and Zhecheng (Henan). The products cover MPCVD single-crystal diamond, diamond-based epitaxial wafers, diamond heat sink devices, and high thermal conductivity diamond powder composite materials, with a total disclosed investment of approximately CNY 1.678 billion.
Among them, the three projects by Weina Hongxin, Kunpeng Xinxing, and Huaxia Kunpeng Hami are in the stages of EIA public notice, completion acceptance and fire protection filing, and EIA approval, respectively, while the third phase of Huifeng Diamond has already held a groundbreaking ceremony.
I. Yancheng, Jiangsu | CNY 150 Million, Annual Production of 150,000 Carats of MPCVD Single-Crystal Diamond
The annual production project of 150,000 carats of large-size high-purity MPCVD single-crystal diamond by Weina Hongxin (Jiangsu) Technology Co., Ltd. has entered the EIA public notice stage. The construction site is located in the Jiangsu Dafeng Port Economic Development Zone, Dafeng District, Yancheng City. The total investment is CNY 150 million, and the project nature is new construction.
The company was established in April 2025 with a registered capital of CNY 45 million. Its business scope covers the R&D and promotion of new material technologies, R&D and manufacturing of electronic special materials, IC (Integrated Circuit) design, production and sales of semiconductor discrete devices and equipment, and it also possesses qualifications for the import and export of goods and technologies.
The designed product specifications for this Weina Hongxin project are 7~10×7~10mm in length and width, and 0.5~1mm in thickness. The 7~10mm square single-crystal wafers correspond to the mainstream sizes of chip-level heat dissipation substrates and semiconductor device substrates, while the 0.5~1mm thickness balances growth efficiency and subsequent thinning processing requirements.
However, such small-size finished products are currently mostly cut from 2-inch single-crystal substrates, resulting in limited output per furnace. For the industry to further reduce costs, it must expand the single-crystal substrate size from 2 inches to 4 inches and above. Yet, the growth zone diameter of mainstream commercial MPCVD reactors is only 2 to 2.5 inches. Leaping to larger sizes requires optimizing the reactor structure or switching to a 915MHz microwave frequency. The core difficulties lie in dislocation density control and balancing the growth rate with crystal quality. With the entry of this new player, Weina Hongxin, the domestic supply landscape of MPCVD single-crystal diamond will be further expanded.
II. Huzhou, Zhejiang | CNY 100 Million, Annual Production of 1,200 Diamond-Based Epitaxial Wafers
The annual production project of 1,200 diamond-based epitaxial wafers (less than 4 inches) by Huzhou Kunpeng Xinxing Semiconductor Co., Ltd. has completed the fire protection filing for the completion acceptance of the construction project. The construction site is located in the Nantaihu New District, Huzhou City. The total investment is CNY 100 million, and the project nature is new construction.
The project leases about 8,000 square meters of existing factory space in the Digital Economy Industrial Park and purchases 82 units (sets) of equipment, including MPCVD machines, PVD machines, and laser cutting machines.
Huzhou Kunpeng Xinxing was established in September 2025 as a wholly-owned enterprise of Hefei Kunlun Xinxing Semiconductor Co., Ltd. Focusing on the semiconductor field, it is mainly engaged in the R&D, manufacturing, and sales of electronic special materials, IC chips, and semiconductor devices.
Diamond-based epitaxial wafers are a critical step for diamond to extend from heat dissipation materials to active devices—such as RF power devices, power electronic devices, and quantum sensors. The upscaling of epitaxial wafers is currently the hardest nut to crack in industrialization.
Starting with sizes less than 4 inches and backed by Hefei Kunlun Xinxing, Huzhou Kunpeng Xinxing has a certain foundation for industrial synergy in the semiconductor field, but customer introduction and size upscaling for epitaxial wafers still require time.
III. Hami, Xinjiang | CNY 428 Million, Synchronous Planning for Heat Sink Devices and 6-Inch Wafers
The Phase I project of the fourth-generation large-size wide-bandgap green and low-carbon semiconductor (diamond) chip material project by Huaxia Kunpeng Core Material Technology (Hami) Co., Ltd. has obtained EIA approval. The construction site is located in Yizhou District, Hami City. With a total investment of CNY 428 million, it is the largest investment among the four projects.
The construction content includes four production lines: an annual production of 200,000 pieces of semiconductor heat sink devices, 200,000 pieces of military-grade heat sink devices, 5,000 pieces of 6-inch diamond wafers, and 600,000 carats of rough diamonds.
Huaxia Kunpeng Core Material (Hami) was established in December 2025, registered in the Hami High-tech Zone, Yizhou District, Hami City, Xinjiang. It is a wholly-owned enterprise of Huaxia Kunpeng Technology Co., Ltd., mainly engaged in the R&D and manufacturing of IC chips, semiconductor discrete devices, optoelectronic devices, and electronic special materials.
Heat sink devices are currently the most concentrated direction for the industrialization of diamond heat dissipation, and there has been clear progress on the industrial end: the yield rate of Huanghe Whirlwind's 8-inch CVD diamond heat sink mass production line has reached over 85%, and it has achieved batch supply after passing the certifications of Huawei and SMIC (Semiconductor Manufacturing International Corporation); Liliang Diamond follows the single-crystal route, has passed NVIDIA's official certification, and entered the BOM list of HGX modules.
The Phase I product line of the Huaxia Kunpeng project simultaneously covers military-grade heat sinks, semiconductor heat sinks, and 6-inch wafers. The layout in Hami is directly related to the local advantages of green electricity and electricity prices—60% of the cost of diamond heat sink wafers comes from energy consumption, and the sensitivity to electricity prices will be further highlighted after large-scale mass production.
IV. Zhecheng, Henan | CNY 1 Billion, 2 Billion Carats of High Thermal Conductivity Powder and 1.5 Million Pieces of Composite Materials
On September 21, the Phase III project of Huifeng Diamond Digital Intelligence Technology Park broke ground in Zhecheng. Covering an area of 202 mu with a total construction area of 100,000 square meters, it will build production lines for an annual output of 2 billion carats of high thermal conductivity diamond powder and 1.5 million pieces of diamond composite materials.
The Phase III project will integrate the industrial chain of "diamond single crystal—functional powder—composite materials—thermal management," realizing the digitalization of the entire process of R&D, manufacturing, and control. The products are targeted at fields such as AI (Artificial Intelligence) computing power, NEVs (New Energy Vehicles), high-end optical windows, and consumer electronics. The total investment for Phase III is CNY 1 billion.
Huifeng Diamond has been deeply engaged in the diamond powder industry for over 30 years and has grown into a listed company on the BSE (Beijing Stock Exchange), a national high-tech enterprise, a national specialized, refined, differential, and innovation "little giant," and a single champion enterprise.
In May this year, the company's CVD diamond heat dissipation project with a total investment of CNY 1 billion started construction in Baotou. The first phase plans to invest in 500 MPCVD equipment units, and upon reaching full production, the annual production capacity can reach 1 million pieces of diamond heat sink wafers.
The company is transforming from a "traditional diamond cutting, grinding, and polishing material supplier" to a "diamond functional application material solution provider." The Zhecheng Phase III and Baotou CVD projects form a vertical synergy of "powder—composite materials—heat sink wafers."