[Companies Involved in This Article] Huafeng Jixin, Xinli Technology, Silex Microsystems, United Si (Beijing/Dezhou), Quean Technology, NXP Tianjin, Shijiazhuang METDA, Wuyuan Semiconductor, Qingdao Xinhexin, Shandong Qixin Micro, UTAC Yantai, Shandong Xinhengguang, Jingwang Semiconductor (Shandong), Huaxinbang Shandong Project, The 47th Research Institute of CETC, etc.
I. Packaging and Testing Capacity: Inventory of Bohai Rim OSATs and Capacity Restructuring
Compared with the scale advantages of OSAT leaders in the Yangtze River Delta, the Bohai Rim packaging and testing industry is more like a composite region combining "technology sourcing + specialized scenarios + project increments." Unlike the terminal application-driven model in the Greater Bay Area, the core driving forces in the Bohai Rim mainly come from Beijing's scientific research and capital, Shandong's manufacturing undertaking capacity, Tianjin's multinational IDM packaging and testing foundation, and the long-term accumulation of Hebei and Liaoning in optoelectronics, military industry, and high-reliability electronics.
From a spatial structure perspective, Bohai Rim packaging and testing enterprises present a pattern of "three cores and multiple points":
Beijing is the innovation source for advanced packaging design, Chiplet platforms, third-party testing, and specialty process packaging and testing;
Shandong is the region with the most concentrated new manufacturing projects, covering hybrid bonding, Bump/RDL, memory packaging and testing, RF packaging and testing, and SiC advanced packaging and testing;
Tianjin, represented by NXP, emphasizes IDM packaging and testing capabilities for automotive electronics, secure connectivity, and industrial applications;
Hebei and Liaoning lean more towards optoelectronic packaging, high-reliability packaging, and scientific research production support.
Figure 1: Schematic Diagram of Bohai Rim 2026 H1 Packaging and Testing Manufacturers and Capability Distribution.
Tables 1-1 and 1-2 sort out representative packaging and testing and testing enterprises according to the narrow definition of the Bohai Rim. Since some enterprise projects are still in the construction, ramp-up, or limited public information stage, this article uses categories such as "mass production/mature mass production, capability building, signed construction, and scientific research support" for labeling, which should not be equated with disclosed financial scale.
Table 1-1: Representative Packaging and Testing/Testing Enterprises in the Beijing-Tianjin-Hebei Region and Liaoning of the Bohai Rim
Table 1-2: Representative Packaging and Testing/Testing Enterprises in the Shandong Peninsula and Shandong Province
Overall, the Bohai Rim packaging and testing capacity is shifting from "dispersed specialized capabilities" to "regional supply chain completion capabilities." Beijing's Huafeng Jixin, Xinli Technology, Silex Microsystems, and Quean Technology have enhanced the North's presence in Chiplet design, advanced packaging collaboration, MEMS packaging and testing, and independent testing. Shandong, through projects such as Wuyuan Semiconductor, Qingdao Xinhexin, Qixin Micro, United Si Dezhou, UTAC Yantai, and Huaxinbang, has formed an expansion path closer to the manufacturing end. In contrast, the number of packaging and testing enterprises in Tianjin, Hebei, and Liaoning is not large, but they possess vertical scenario advantages in automotive electronics, optoelectronic modules, and high-reliability applications.
II. Advanced Packaging Layout: Bohai Rim Completing the Supply Chain from "Design-Driven" to "Packaging Manufacturing"
The competitiveness of advanced packaging in the Bohai Rim does not come from a single technology route, but is distributed across six paths: Chiplet heterogeneous integration, hybrid bonding, wafer-level packaging, RF/automotive packaging and testing, memory/IC card packaging and testing, and professional testing. In the first half of 2026, the most noteworthy changes in the region are the accelerated supply chain completion of high-end packaging in Beijing and the intensive landing of manufacturing projects in Shandong, which is gradually transforming the Bohai Rim from a northern ecosystem focused on "design, R&D, and testing" to one where "advanced packaging manufacturing capabilities become visible."
Figure 2: Heat Map of Advanced Packaging Capabilities of Major Packaging and Testing Enterprises in the Bohai Rim.
(I) Chiplet, 2.5D/3D, and High-Computing Packaging: Beijing and Qingdao Form Dual Fulcrums
Huafeng Jixin is a representative enterprise in completing the advanced packaging supply chain in Beijing. Public materials show that the company was introduced and built in the Beijing Economic-Technological Development Area in 2021, positioned as a comprehensive solution platform covering interface chip design, Chiplet packaging integration design, packaging materials, process R&D, testing, and production manufacturing, with Chiplet as its technology route. Its value lies not only in a single packaging process but in integrating packaging design, materials, processes, and testing into the same system, making it suitable for undertaking AI/HPC heterogeneous integration and domestic high-end chip verification needs.
Xinli Technology is also located in the Beijing E-Tech Area. Public recruitment and industry information show that it provides one-stop Chiplet design, advanced packaging, and testing services for the high-computing field. Unlike Huafeng Jixin, which focuses on completing the packaging production and manufacturing supply chain, Xinli is more like a "design-packaging-testing" collaborative platform, which is conducive to transforming Beijing's strong design, EDA, IP, and scientific research resources into mass-producible advanced packaging solutions.
Wuyuan Semiconductor in Qingdao, Shandong, represents the breakthrough of the Bohai Rim in next-generation interconnect technology. Using hybrid bonding as its technology platform, the company focuses on 3D integration processes such as Wafer-on-Wafer (WoW) and Chip-on-Wafer (CoW), serving AI computing, memory chips, and automotive electronics. Compared with traditional bump interconnects, hybrid bonding can support higher interconnect density and lower power consumption, representing a key path for advanced packaging to shift from "side-by-side integration" to "vertical stacking."
(II) RF, Automotive, and Optoelectronic Packaging: Tianjin, Shandong, and Hebei Constitute Application-Oriented Depth
NXP Tianjin is one of the few mature nodes in the Bohai Rim packaging and testing industry with a global IDM background. Official public information shows that NXP has developed in Tianjin for nearly 30 years, possessing leading packaging and testing factories and a large-scale local R&D team. Its advantage lies not in the scale of external OSAT foundry services, but in the engineering capabilities for long-term high-reliability applications such as automotive, secure connectivity, and industrial control, which plays a driving role in automotive-grade packaging and testing and localized innovation in Tianjin and even the entire Bohai Rim.
United Si has formed an RF manufacturing and packaging/testing layout in Beijing and Dezhou. Public introductions from Qorvo show that it provides RF and power technology solutions for the mobile, infrastructure, IoT, defense/aerospace, and power management markets. RF front-end packaging has high requirements for consistency, heat dissipation, electrical performance, and large-scale manufacturing management. Therefore, United Si Beijing and United Si Dezhou have the significance of "mature production line anchors" for the Bohai Rim's RF packaging and testing capabilities.
METDA in Hebei is another sample of "optoelectronic packaging." Public data shows that it focuses on optoelectronic chips, devices, components, and supporting packaging modules, with applications covering optical communication, laser ranging, LiDAR, and high-power lasers. This capability does not belong to the large-scale consumer electronics packaging of general OSATs, but it has strong irreplaceability in the northern optoelectronic communication, LiDAR, and military electronics industry chains.
(III) Shandong Manufacturing Increment: From Bump/RDL to Memory Packaging and Testing and SiC Advanced Packaging
Shandong is the most noteworthy incremental area for Bohai Rim packaging and testing capacity. Relying on the Hon Hai (Foxconn) system, Qingdao Xinhexin provides overall services including engineering verification, Bump/RDL, wafer probing, die processing, and packaging and testing, and received new investment in 2025, according to public data. Qixin Micro has long focused on IC card chip packaging and testing, RFID, and MEMS devices, reflecting Shandong's stock capabilities in low-to-medium power, security identification, and IoT chip packaging and testing.
In terms of memory packaging and testing, projects such as Xinhengguang and Jingwang Shandong have supplemented Shandong's capacity in embedded memory, CSP/WLCSP, RDL, and wafer testing. The Huaxinbang Shandong project focuses on FOiP heterogeneous integration fan-out advanced packaging and silicon carbide (SiC) chip advanced packaging and testing. If the project is successfully mass-produced subsequently, it will enable Shandong to form a clearer differentiated label in third-generation semiconductor packaging.
(IV) Third-Party Testing and Reliability: Beijing and Yantai Form Verification Fulcrums
The introduction cycle of advanced packaging is often limited by reliability verification, failure analysis, and system-level testing. Beijing's Quean Technology focuses on wafer testing, final testing, design verification, and overall testing solutions, possessing a service chain from design verification to industrialization testing. Yantai UTAC, relying on the UTAC system and automotive quality certification, has a verifiable quality system in packaging design, manufacturing, and product manufacturing. As the testing cycles for AI chips, automotive-grade chips, and high-reliability chips lengthen, third-party testing capabilities will become key infrastructure for the Bohai Rim packaging and testing ecosystem.
III. Industrial Ecosystem: Upstream and Downstream Analysis of the Bohai Rim Advanced Packaging and Testing Industry Chain
The biggest characteristic of the Bohai Rim packaging and testing ecosystem is "strong R&D sourcing, dispersed manufacturing nodes, and high-reliability application scenarios." Beijing possesses nationally leading universities, research institutes, EDA/IP, equipment, wafer manufacturing, and capital resources, making it suitable for incubating Chiplet, MEMS, silicon photonics, and AI packaging platforms. Shandong has advantages in land, manufacturing organization, and undertaking foreign/Taiwan/Hong Kong-funded projects, making it suitable for forming increments in Bump/RDL, memory packaging and testing, RF packaging and testing, and advanced packaging manufacturing. Tianjin, Hebei, and Liaoning undertake industry chain depth through specialized scenarios such as automotive electronics, optoelectronic devices, and high-reliability electronics, respectively.
Figure 3: Ecosystem Map of the Bohai Rim Advanced Packaging and Testing Industry Chain.
Table 2: Representative Enterprises in Core Links of the Bohai Rim Advanced Packaging and Testing Industry Chain
Compared with the Yangtze River Delta, the Bohai Rim lacks the headquarters-level scale advantages of national pure OSAT leaders such as JCET, TFME, and Hua Tian; compared with the Greater Bay Area, the Bohai Rim lacks the large-scale intimate traction of smartphones, wearables, and consumer electronics terminals. However, the special value of this region lies in its ability to connect Beijing's advantages in design, equipment, testing, and capital with Shandong's advanced packaging and testing project landing capabilities, and then form demand verification through the automotive, RF, optoelectronic, and high-reliability applications in Tianjin, Hebei, and Liaoning.
Therefore, the key to the Bohai Rim advanced packaging and testing industry is not simply pursuing the number of enterprises, but forming a closed loop of "packaging design - process development - small-batch verification - reliability testing - specialized scenario mass production." If Beijing's platform enterprises can solve the problems of high-end customer introduction and mass production yield, and Shandong's projects can complete capacity ramp-up and stable delivery, the Bohai Rim will have the opportunity to form a third type of packaging and testing growth pole in the North, complementary to the Yangtze River Delta, the Greater Bay Area, and the central and western regions.
IV. Conclusion
Figure 4: Comprehensive Score of Packaging and Testing Competitiveness in Sub-Regions of the Bohai Rim.
Overall, the core judgments on the Bohai Rim packaging and testing industry in the first half of 2026 can be summarized in four points.
First, the Bohai Rim is not a "scale-oriented OSAT center" in the traditional sense, but has become a key region for completing the advanced packaging supply chain in the North. Beijing's Huafeng Jixin, Xinli Technology, and Silex Microsystems have made Chiplet, MEMS packaging and testing, and wafer-level packaging capabilities more visible; Shandong's projects such as Wuyuan Semiconductor, Qingdao Xinhexin, Qixin Micro, UTAC Yantai, and Huaxinbang have brought advanced packaging and testing manufacturing out of the conceptual stage.
Second, the competition logic of the Bohai Rim is "Beijing + Shandong" dual-core drive. Beijing is responsible for technology sourcing, design traction, testing verification, and capital organization, while Shandong is responsible for project undertaking, manufacturing landing, and capacity ramp-up. Although Tianjin, Hebei, and Liaoning are not regions with the highest enterprise density, they undertake specialized scenario nodes in automotive electronics, RF, optoelectronics, and high-reliability packaging.
Third, the shortcomings are equally clear. The Bohai Rim lacks headquarters of national packaging and testing leaders and ultra-large-scale OSAT clusters. Advanced substrates, temporary bonding materials, system-level testing, and high-end packaging mass production yield still require more public verification. Some newly built projects are still in the stage of production, customer verification, or capacity ramp-up, and their true competitiveness cannot be simply judged by "planned investment."
Fourth, the most important observation variables in the next two years are whether Beijing's high-end packaging platforms can form stable customer introduction, whether Shandong's hybrid bonding/Bump/RDL/memory/SiC packaging and testing projects can achieve stable delivery, and whether Tianjin, Hebei, and Liaoning can transform automotive, optoelectronic, and high-reliability applications into replicable packaging and testing orders. If the above closed loop is formed, the Bohai Rim will form a new positioning as the "highland for advanced packaging and professional testing in the North" in the national packaging and testing map.
References:
1. Corporate websites and public information: NXP official website, Qorvo official website, Wuyuan Semiconductor official website, Qingdao Xinhexin official website, Shandong Qixin Micro System official website, Beijing Quean Technology official website, Silex Microsystems official website, etc.
2. Public reports and industry materials: Public reports on Huafeng Jixin's financing and the construction of the high-end packaging base in Beijing E-Tech Area, reports on Qingdao Xinhexin's capital increase, reports on Huaxinbang Shandong project, public information from East Money/Securities Times/JiWeiNet, etc.
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