Recently, four domestic silicon carbide (SiC) projects have announced new progress, with their construction processes steadily accelerating:
Leapers: Phase I of the Yangzhou SiC project is expected to be completed and delivered by the end of the year, with an annual capacity of 1.5 million units;
Galaxy Microelectronics: The new base is expected to enter the trial production stage in the second quarter of next year, producing 50 million IGBT and SiC power modules;
Singa Electronics: The dedicated production line for SiC modules is operating at full capacity, with an annual capacity of up to 600,000 units;
Zhongyi Chuangxin: The construction progress of the optical-grade SiC powder project has reached 80%.
Leapers Semiconductor: Phase I of SiC Project Expected to be Completed and Delivered by Year-End
Recently, according to Jiangdu News, the Yangzhou Leapers automotive-grade third-generation power semiconductor module project, a provincial major project, has completed the acceptance of the foundation and substructure. The main factory building is taking shape. It is expected that the main factory building will be fully topped out by the end of September and completed and delivered by the end of the year.
It is understood that the total investment of the project is CNY 1 billion, of which CNY 180 million is invested in Phase I. The project will plan and construct two main buildings and build two new automotive-grade SiC module packaging and testing production lines. More than 100 sets of various production equipment will be introduced, with an annual capacity of up to 1.5 million units. After the project reaches full production capacity, the annual capacity will reach 3 million units.
The head of the construction unit revealed to reporters that No. 1 production workshop has now entered the main construction stage and is expected to complete the capping of the main structure by the end of September. Currently, there are more than 200 construction workers on site, and the surrounding supporting facilities are also being advanced simultaneously to ensure completion on schedule.
According to previous reports by "Hangjia Shuo Sandaiban", in March this year, Leapers held a groundbreaking ceremony for its Yangzhou production base, marking the official entry of the project into the construction phase. At the same time, Leapers signed strategic cooperation agreements with five companies: Weiheng Intelligent Technology, Link Touch, Subao, Shenlan Tansuo, and iFaster, to carry out in-depth cooperation on IGBT/SiC technology in multiple downstream applications.
Galaxy Microelectronics: SiC Project Expected to Enter Trial Production Next Year
On October 8, according to the official WeChat account of Changzhou National High-tech Zone, the main structure of the industrialization base for high-end IC discrete devices of Galaxy Microelectronics, a provincial major project, has been topped out. Various supporting constructions are advancing at full speed, and it is expected to enter the trial production stage in the second quarter of next year.
It is reported that the project focuses on the layout of advanced automotive-grade semiconductor discrete devices and third-generation semiconductor power module production lines, mainly producing core products such as automotive-grade semiconductor power devices, IGBTs, and IPM power modules.
After the project reaches full production capacity, it is expected to produce 550 million automotive-grade discrete devices, 8 billion small signal and power devices, 2.5 billion optoelectronic devices, and 50 million IGBT and SiC power modules annually, further strengthening the regional high-end semiconductor industry chain.
Changzhou Galaxy Century Microelectronics Co., Ltd. (Galaxy Microelectronics) focuses on the R&D, wafer fabrication, packaging and testing, and market sales of semiconductor discrete devices. Its product matrix covers four major sectors: power devices, small signal devices, third-generation semiconductor devices, and optoelectronic and integrated devices. Currently, its SiC power devices have completed automotive-grade reliability verification and sample delivery to leading customers.
Singa Electronics: SiC Production Line Operating at Full Capacity
On October 8, according to the Economic Daily, the fully automated dedicated production line for automotive-grade SiC modules of Singa Electronics is operating at full capacity, and its products have successfully entered the supply chain of leading domestic automakers.
The report revealed that the semiconductor packaging capacity of Singa Electronics ranks among the top in China. Next year, it will add two new automotive-grade production lines. It is expected that by the end of 2027 to the beginning of 2028, the annual capacity of automotive-grade products will reach 1.5 million units, and the annual capacity of industrial-grade products will reach 4 million units.
In April this year, according to Weihai News, the first SiC production line of Singa Electronics had already reached full production. The second SiC production line under construction is expected to be put into production around the May Day holiday this year. After production, the capacity will double, reaching an annual capacity of 600,000 units.
Weihai Singa Electronics Co., Ltd. was established in 2004, focusing on the design, R&D, and production of power semiconductor devices. It built its first IGBT module packaging production line in 2006. Currently, it has completed the R&D layout of SiC devices for AI computing center power supplies and solid-state transformer (SST) systems, continuously broadening its industrial tracks.
Zhongyi Chuangxin: SiC Project Construction Progress Reaches 80%
On October 8, according to Pingdingshan Broadcasting and Television Station, the optical-grade SiC powder project of Zhongyi Chuangxin was officially launched in June this year, and the current engineering construction progress has reached 80%.
It is reported that Zhongyi Chuangxin has been deeply engaged in the field of SiC new materials and has successfully developed semi-insulating SiC powder raw materials suitable for AR glasses lenses, which can provide core material support for the domestic AR equipment industry.
Dong Jianxun, Chairman and General Manager of Henan Zhongyi Chuangxin Development Co., Ltd., stated that after the project is completed, it will once again fill the industrial gap of optical-grade SiC powder materials in Henan Province. In the next step, they will enrich the product types of SiC and strive to build the largest SiC semiconductor material production base in the country.
This article is published by [Hangjia Shuo Sandaiban], focusing on industry observation of third-generation semiconductors (SiC and GaN).