[Relevant Companies Involved in This Article] Hua Tian Technology, Unisem (Chengdu), Yicheng Technology, Intel Chengdu Assembly and Test Plant, Yuemo Advanced, Anmuquan, YMTC (Yangtze Memory Technologies Co., Ltd.), SK Hynix (Chongqing), CR Micro (Chongqing), Lipixin, Hanwei Technology, Guoxinwei (Chongqing), etc.
I. Assembly and Test Capacity: Review of OSAT Vendors and Capacity Restructuring in Central and Western China
1.1 Advanced Packaging Remains the Most Certain Incremental Segment in the Post-Moore Era
The global advanced packaging market remains in an upswing cycle. The fastest-growing sub-sectors continue to be 2.5D/3D, HBM co-packaging, Chiplet interconnects, and high-end fan-out technologies. The fundamental drivers are not smartphones or general consumer electronics, but rather AI training and inference, data center network upgrades, automotive-grade high computing power, and the increasing demand for memory bandwidth.
Figure Global Advanced Packaging Market 2023-2030E
The core focus of the assembly and test industry in Central and Western China has shifted significantly westward and northward. Tianshui in Gansu and Xi'an in Shaanxi form the main axis of the Northwest: the former hosts the headquarters of Hua Tian Technology and a mature customer base, while the latter strengthens process and manufacturing synergy through projects such as the expansion of Hua Tian Xi'an, Samsung memory-related supporting facilities, Powertech Technology, and Xinye Shidai; the Sichuan-Chongqing region has formed a dual-center structure, with Chengdu possessing diverse manufacturing nodes including Unisem, Yicheng Technology, and the Intel Chengdu Assembly and Test Plant, and Chongqing rapidly supplementing its back-end ecosystem driven by SK Hynix DRAM packaging, CR Micro power device assembly and test, Guoxinwei, and local policy guidance.
Figure Business Structure of Representative OSAT Vendors in Central and Western China
From the perspective of regional division of labor, the assembly and test sector in Central and Western China can be summarized as "one core and multiple belts": the core is the Tianshui-Xi'an advanced packaging and large-scale delivery hub, while the multiple belts include the Sichuan-Chongqing dual-city manufacturing and test belt, the central Hunan-Hubei high-computing and memory application belt, and the central Henan-Jiangxi special device and sensor supporting belt. This pattern differs from the logic of the "one pole and four belts" in the Yangtze River Delta; Central and Western China places more emphasis on "complementarity among functional nodes" rather than ultra-high-density synergy within the same urban agglomeration.
Figure Spatial Division of Labor in the Assembly and Test Industry in Central and Western China for 1H 2026
1.2 Review of Major OSAT Enterprises and Projects in Central and Western China
Compared with the simultaneous expansion of multiple projects costing tens of billions of RMB in the Yangtze River Delta, the capital expenditures disclosed in Central and Western China for the first half of 2026 exhibit a more "precise gap-filling" characteristic. The two most explicit major projects are the 2.7 billion RMB expansion of Hua Tian Xi'an Plant No. 3 and the 3.2 billion RMB Phase I of Xinye Shidai's 8-inch line, totaling 5.9 billion RMB. Factoring in the assembly and test capacity expansion driven by Chongqing's policies, the continuous construction of the Chengdu node, and the advanced packaging investments in Changsha/Zhuzhou, the regional capital intensity is not low; it merely manifests more as "making point-by-point breakthroughs around key shortcomings" rather than pursuing large-scale deployment across multiple routes and parks simultaneously.
Figure Investment Scale of Key Projects in Central and Western China
II. Advanced Packaging Layout: Review of the Main Technological Lines in Central and Western China
In terms of technological routes, Central and Western China is not comprehensively replicating the advanced packaging spectrum of the coastal regions, but has instead formed a combined structure of "comprehensive platform + specialized breakthroughs + scenario binding." The comprehensive platform is responsible for turning complex processes into deliverable capabilities; specialized breakthroughs focus on building a strong reputation in high-barrier areas such as Fan-Out MCM (FOMCM), Flip-Chip SiP (FC-SiP), and Chiplet; and scenario binding ensures order stickiness through memory, power, sensors, and automotive-grade electronics.
Figure Advanced Packaging Technology Matrix of Representative Enterprises in Central and Western China
2.1 2.5D/3D/TSV Path: Hua Tian Technology Provides the Most Critical Scale Foundation in Central and Western China
Hua Tian Technology remains the most irreplaceable enterprise in the advanced packaging system of Central and Western China. Its value lies not merely in "having revenue and factories," but in having mastered a relatively complete technological spectrum including SiP, FC, Through-Silicon Via (TSV), Bumping, Fan-Out (FO), Wafer-Level Packaging (WLP), Panel-Level Packaging (PLP), and 2.5D/3D, which means it can advance advanced packaging from concept verification to engineering mass production. For the Northwest region and even the entirety of Central and Western China, as long as Hua Tian's advanced packaging platform continues to upgrade, the region will not be locked into low-end traditional packaging positions.
The significance of the Hua Tian Xi'an expansion in 2026 is particularly crucial. On the one hand, Xi'an is closer to automotive electronics, memory, and western manufacturing customers compared to Tianshui; on the other hand, the 2.7 billion RMB expansion project continues to concentrate advanced assembly and test capabilities in Xi'an, helping to form a dual-center structure of "headquarters process precipitation + regional customer service + expanded capacity." From a medium- to long-term perspective, Tianshui is the historical foundation, while Xi'an acts more as an incremental hub catering to new demand scenarios.
2.2 Chiplet/SiP/FCBGA: Yuemo Advanced Constitutes the Innovation Interface for High-Computing Packaging in Central China
The value of Yuemo Advanced in the advanced packaging landscape of Central and Western China lies in the fact that it is not a large-scale packaging factory in the traditional sense, but rather a "small but hard-core" platform capable of linking design, simulation, process, and delivery. Following the production line launch of its Chiplet product line at the Zhuzhou Yunlong factory area, its external narrative is no longer just about conventional packaging such as QFN/DFN, but more explicitly connects Chiplet, SiP, and Flip-Chip Ball Grid Array (FCBGA) with applications in BeiDou, automotive electronics, industrial control, and computing power chips.
The strategic significance of such platforms is that when domestic computing power chips, control chips, or special-purpose chips need to quickly find packaging partners with engineering collaboration capabilities, enterprises like Yuemo can more easily integrate into joint development. It does not need to surpass industry leaders in absolute capacity, but can enter earlier at the customer demand definition stage, thereby sharing higher technological value-added.
2.3 FC-SiP: Anmuquan's "Deep Dive into a Narrow Door" Highlights High-End Large Chip Packaging Capabilities
According to a review of public information, the headquarters and main advanced packaging bases of Anmuquan are both located in Changsha, Hunan, and thus are retained under the scope of this article. Anmuquan is not a Hefei enterprise, nor is it an object to be excluded. Its core competitiveness lies in its continuous deep exploration of FC-SiP and 3D-SiP for high-end chips. Public parameters directly point to the demands for large-size chips, high I/O density, and high-layer substrates, which precisely correspond to the most difficult back-end constraints for high-computing chips such as CPUs, GPUs, DSPs, FPGAs, and AI accelerators.
From an industry comparison perspective, Anmuquan's approach is not to become an "all-around Outsourced Semiconductor Assembly and Test (OSAT)," but to focus on a few high-barrier packaging problems, combining design simulation, R&D, small-batch trial production, and mass production services. For Central and Western China, such companies have strong demonstrative significance: they do not need to possess the largest scale first, and can still become a mandatory option in the national supply chain by relying on a certain type of key process.
2.4 Memory Packaging: Chongqing and Wuhan are the Most Noteworthy Demand-Driven Sectors in Central and Western China
If advanced packaging represents the future, one of the directions with the most realistic order traction in Central and Western China is memory packaging. On the Chongqing side, the SK Hynix DRAM packaging base enables Chongqing to resonate with international memory giants; on the Wuhan side, YMTC, as an integrated memory enterprise combining design, manufacturing, assembly and test, and system solutions, provides Hubei with a complete scenario from front-end to back-end and then to modular applications.
The strategic significance of memory packaging lies in the fact that, unlike some new-concept advanced packaging that highly relies on a small number of cutting-edge customers, it is more likely to form stable capacity and continuous technological iteration. Once the demand from YMTC in Wuhan and the memory back-end capabilities in Chongqing continue to strengthen, the position of Central and Western China in the national semiconductor back-end system will become more solid.
2.5 Power and Specialty Packaging: Chongqing, Suining, Zhengzhou, and Other Regions Constitute the "Non-Computing" Back-End Foundation
Central and Western China cannot solely focus on AI/HPC advanced packaging. What truly supports regional industrial resilience is often power devices, automotive-grade electronics, sensors, optoelectronic devices, and general advanced packaging. CR Micro's power semiconductor assembly and test and panel-level packaging projects in Chongqing enable the region to have stronger absorption capabilities in NEV (New Energy Vehicle), industrial control, and PMIC (Power Management IC) scenarios; Suining Lipixin provides flexible capacity through processes such as QFN/DFN and LQFP; and Zhengzhou Hanwei Technology and the sensor industry it represents illustrate that the central region continues to embed assembly and test into broader terminal scenarios.
Such "non-computing" packaging is not always the most watched by the capital market, but it is an important source of regional industrial cash flow, customer stickiness, and engineering talent cultivation. Without this foundational layer, it is difficult for Central and Western China to form a truly stable back-end ecosystem relying solely on a few star advanced packaging projects.
2.6 Comparison of Three Mainstream Architectures: Viewing the Capability Boundaries of Central and Western China from Route Selection
From the perspective of architectural logic, the current technological layout in Central and Western China is not evenly distributed: the three architectures of TSV-less high-density fan-out, 2.5D silicon interposer/TSV, and 3D stacked memory are all reflected in regional samples, but there are significant differences in mass production maturity. Hua Tian Technology is closer to comprehensive platform capabilities, while Yuemo and Anmuquan lean more towards scenario adaptation around specific architectural combinations, and memory-related nodes are more driven by customer and device routes.
Figure Comparison of Three Representative Advanced Packaging Architectures (Simplified Cross-Section Schematic)
III. Third-Party Testing: A New Capability Layer in the Industrial Chain of Central and Western China
Compared with the original report, this chapter is a key addition in this revision. The reason is that a new change in the assembly and test competitiveness of Central and Western China in 2026 is not just about "who is building factories," but "who can perform testing, verification, failure analysis, and reliability support." The more complex the advanced packaging, the less testing is an ancillary link, and the more it becomes a core capability determining customer certification speed and mass production stability.
3.1 CP/FT Testing Enterprises: Third-Party Testing is Moving from a Supporting Link to Strategic Positioning
The spillover and layout of third-party testing forces such as Weice Technology, Leadyo, and Hualing Shares are changing the back-end competitive landscape in Central and Western China. Public performance data from Weice Technology shows that its high-end chip testing business has grown significantly in 2025 and the subsequent stages, and third-party CP/FT testing has become one of the fastest-growing segments in the domestic back-end industry. For Central and Western China, this means that many local design companies, packaging projects, and special-purpose chip customers can obtain relatively high-level test development and mass production support without completely relying on the Yangtze River Delta or the Pearl River Delta.
Guoxinwei (Chongqing) is another noteworthy case. Public reports show that it has cumulatively invested about 80 million RMB to build a testing factory and inspection line, with annual sales growing from 25 million RMB in 2021 to about 80 million RMB in 2023, forming comprehensive capabilities including wafer testing, final testing, and laboratory verification. This indicates that Chongqing is not only striving for manufacturing projects but also turning the testing link into a local industrial hallmark.
3.2 Third-Party Testing Laboratories: Wintech Nano, Xi'an University Platforms, and Public Capability Gap-Filling in the Western Science City
Against the backdrop where advanced packaging projects increasingly emphasize failure analysis, material analysis, reliability verification, and customer certification, the importance of third-party laboratories is rising rapidly. As a listed third-party testing and analysis service provider, public information on Wintech Nano has shown its service reach and laboratory layout capabilities for western customer groups such as Chengdu and Xi'an; even if Chongqing may not necessarily form physical laboratories on the same scale as Suzhou and Nanjing, the Chengdu-Chongqing market has already been included in the service radius of such platforms.
The existence of the School of Microelectronics at Xidian University and its related CNAS/ILAC certified laboratories, as well as the public testing platform of the Western Science City, indicates that the verification capabilities in Central and Western China are not entirely borne independently by market-oriented enterprises, but a co-construction model of "universities—research platforms—enterprise verification" is beginning to emerge. This point is crucial: when a region does not yet possess enough large-scale OSATs, public testing and verification platforms are often the most effective industrial infrastructure.
3.3 Specialty Chip Testing: Testing of Special Devices, Automotive-Grade, and Sensors is Becoming a Differentiated Direction in Central and Western China
Unlike coastal regions that focus more on mobile SoC (System on Chip), general computing, and large-scale consumer electronics, a major feature of testing demand in Central and Western China is serving specialty chips that are more complex, more dispersed, but have higher verification thresholds. Guoxinwei in Chongqing, local testing and verification teams in Shaanxi, and the assembly and test demand formed around the Hanwei Technology sensor ecosystem all point to a trend: Central and Western China has the opportunity to take the lead in forming differentiated capabilities in the testing of special-purpose chips, automotive-grade devices, sensors, and industrial control chips.
The industrial significance of this direction lies in the fact that although specialty chip testing may not necessarily bring the largest short-term revenue, it often has higher customer stickiness and a longer verification cycle. Once the platform passes certification, the substitution cost is very high, making it more suitable for Central and Western China to establish long-term competitive barriers.
IV. Industrial Ecosystem: Analysis of the Upstream and Downstream of the Advanced Assembly and Test Industrial Chain in Central and Western China
The strength of Central and Western China first lies in the "chain leader + scenario" combination. Hua Tian Technology proves that the region has the capability to operate large-scale OSATs and comprehensive advanced packaging; YMTC, SK Hynix, CR Micro, and Intel Chengdu provide the region with real demand scenarios or internationalized process interfaces; and specialized enterprises such as Yuemo, Anmuquan, and Yicheng Technology provide flexible entry points for high-end tracks.
Scale platform-type enterprises, represented by Hua Tian Technology, have core values in mature customers, mass production management, full-process technology platforms, and capacity elasticity. Without such enterprises, it is difficult for Central and Western China to upgrade from a collection of regional projects to a true industrial sector.
Technology breakthrough-type enterprises include Yicheng Technology, Yuemo Advanced, Anmuquan, etc., emphasizing rapid entry into the customer definition stage in high-barrier tracks such as FOMCM, Chiplet, and FC-SiP. The scale of such enterprises may not be the largest, but they are more likely to gain higher bargaining power during the switching of new-generation architectures.
Scenario-driven enterprises include CR Micro Chongqing, Guoxinwei, Lipixin, Hanwei Technology, and related supporting entities. Relying on the demand for power devices, sensors, memory, industrial control, or automotive-grade applications, they form stable back-end businesses and undertake the role of the "basic foundation" of the regional supply chain. The coexistence of these three types of enterprises is precisely the key to distinguishing Central and Western China from the single assembly and test park model.
If the advantage of the Yangtze River Delta lies in the high-density closed-loop of the industrial chain, then the most commendable aspect of Central and Western China at present is that it has begun to consciously fill the weak links in the closed loop: at one end are the main manufacturing or demand nodes such as Hua Tian, Unisem, YMTC, and CR Micro; at the other end are the testing and verification nodes such as Weice, Leadyo, Wintech Nano, Guoxinwei, and university platforms; and in the middle, front-end and back-end synergy is enhanced through Xinye Shidai, local government action plans, and public platforms.
Figure Synergy Closed-Loop of the Advanced Assembly and Test Industrial Chain in Central and Western China
V. Conclusion
From a national perspective, Central and Western China currently cannot comprehensively compete with the Yangtze River Delta and the Greater Bay Area in terms of total output value, enterprise density, and high-end customer structure, but its competitive position is already significantly higher than the "passive acceptance" stage. The existence of Hua Tian Technology ensures that Central and Western China has a sufficiently strong basic foundation; Chengdu and Chongqing enable the region to access internationalized manufacturing, memory, and power devices; and Changsha and Zhuzhou truly bring the imagination space of high-computing packaging to reality.
More importantly, the business structure in Central and Western China is not a single bet on the AI concept, but has formed multiple parallel main lines such as memory, power, special devices, Chiplet, FC-SiP, and third-party testing. Such a structure is actually more resilient during prosperity cycles: when a certain advanced packaging route has not yet fully ramped up, other scenario-based businesses can support cash flow and the stability of engineering teams.
China's high-computing chips, automotive-grade power devices, industrial control, memory, and sensor industries all need more available assembly and test nodes; Central and Western China has natural advantages in labor costs, policy support, land space, application scenarios, and some chain leader resources. Once the synergy among nodes such as Hua Tian, Xi'an, Chengdu, Chongqing, Changsha/Zhuzhou, and Wuhan is gradually strengthened, Central and Western China will have every opportunity to form a higher strategic position in the national assembly and test landscape than it holds today.