Recently, three leading silicon carbide (SiC) companies have secured new orders:
Epiworld International: Secured an additional order for SiC epitaxial wafers from an international customer, with an order value of approximately CNY 646 million;
STMicroelectronics: Partnered with SST enterprise DG Matrix to provide SiC power devices and collaborative technology development;
ROHM Semiconductor: SiC devices adopted by BMW for its electric vehicle platform.
Epiworld International: Secured a Single Order Exceeding CNY 600 Million
On September 24, Epiworld International issued a "Voluntary Announcement" revealing that it recently secured a large-scale order.
According to the announcement by the board of directors of Epiworld International, a major international customer has agreed to purchase additional6-inch and 8-inch SiC epitaxial wafers, with a maximum total sales value of approximately USD 95.8 million (approximately CNY 646 million). Epiworld International will deliver these to the customer on or before December 31, 2026.
In the document, Epiworld International stated that the customer is a listed company and a global leader in the SiC semiconductor industry. After making all reasonable inquiries, the directors confirmed that the customer and its ultimate beneficial owners are independent third parties and are not connected with Epiworld International or its connected persons.
Notably, the number of customers and the shipment volume of epitaxial wafers for Epiworld International are steadily growing. According to the 2026 semi-annual report, as of the reporting date, Epiworld International has served 4 of the top 5 global SiC power device manufacturers and 8 of the top 10 global power device manufacturers, with the number of customers purchasing 8-inch wafers reaching 35.
As of June 30, 2026, the monthly production capacity of Epiworld International has exceeded 60,000 wafers. Along with the release of production capacity, the shipment volume of Epiworld International's 6-inch products has grown rapidly; the sales volume of 8-inch products in the first half of 2026 has already surpassed the total level for the whole year of 2025; and 12-inch products have achieved breakthroughs in small-batch orders.
STMicroelectronics: Providing SiC Devices for DG Matrix
On September 25, DG Matrix, a solid-state transformer solution provider, announced the continuation of its partnership with STMicroelectronics, adopting SiC technology as the core of its Interport™ multi-port solid-state transformer platform.
Haroon Inam, CEO and Co-founder of DG Matrix, stated that STMicroelectronics has provided technical support for DG Matrix's R&D efforts from the very beginning. Benefiting from SiC technology, the output power of the Interport™ has doubled from 200 kW to 400 kW with basically the same power module size. It is understood that the collaboration between the two parties is not limited to component supply. STMicroelectronics will provide DG Matrix with technical support and insights into relevant technology development to help optimize the use of SiC devices in the Interport™ platform. DG Matrix's application experience will enable STMicroelectronics to gain an in-depth understanding of system-level requirements, including considerations for voltage, current, and thermal performance in future generations of power devices.
As DG Matrix continues to evolve, its business focus has shifted to high-voltage and medium-voltage platforms. DG Matrix is committed to providing larger-scale products globally for hyperscale data centers, new cloud platforms, and electrification deployments, adopting SiC technology to support its product roadmap. Founded in 2022, DG Matrix primarily provides multi-port SST systems and completed a USD 60 million Series A funding round in March this year, led by well-known institutions and funds such as Swiss power equipment giant ABB and Chevron Technology Ventures. According to its disclosure, AI data centers currently account for approximately 90% of DG Matrix's business, and DG Matrix's procurement order value for 2025-2026 has already reached "tens of millions of US dollars".
ROHM Semiconductor: Providing SiC Devices for BMW
On September 17, according to the official website of ROHM Semiconductor, its SiC chips have been adopted by BMW for its electric vehicle platform and will be搭载 (equipped) in the "Neue Klasse" models.
According to official data, BMW Neue-Klasse is a complete technology cluster officially launched by the BMW Group in 2021. This system is equipped with the sixth-generation eDrive electric drive system and adopts innovative technologies such as an 800V high-voltage architecture and SiC inverters. The project takes the iX3 as the first mass-produced model, followed by the new-generation i3 sedan. The goal is to radiate this technology to approximately 40 models within the group by 2027, driving BMW's upgrade in the direction of electrification and digitalization.
Currently, in the automotive-grade SiC track, ROHM has both direct nominated projects facing OEMs and expands its market through deep binding with Tier 1 suppliers. In addition to BMW, its SiC MOSFETs have been introduced to automakers such as Toyota and Lucid Motors; on the other hand, ROHM has also reached cooperation with Tier 1 suppliers such as Schaeffler, United Automotive Electronic Systems (UAES), and Valeo, landing and mass-producing main inverter projects for multiple domestic and foreign automakers.
ROHM also revealed in its financial report for the first quarter of fiscal year 2026 (ending June 30, 2026) that its SiC business revenue exceeded JPY 10 billion (approximately CNY 429 million) in this quarter, a year-on-year increase of 53%, benefiting from the growth in the European automotive inverter market and the AI server market.
This article is published by [ASiC Third Generation], focusing on industry observations of the third-generation semiconductor (silicon carbide and gallium nitride) sector.