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TsingMicro Establishes Shanghai Platform and Joint Venture for Ten-thousand-card Intelligent Computing Cluster

by zhangtongshe·October 8, 2026

Recently, Beijing TsingMicro Intelligent Technology Co., Ltd. (hereinafter referred to as "TsingMicro"), a leading domestic enterprise in reconfigurable computing chips, has wholly established Shanghai Zhisan Qingxin Information Technology Co., Ltd. (hereinafter referred to as "Shanghai Zhisan Qingxin") in Xuhui District, Shanghai. The new company has a registered capital of CNY 10 million, with Li Xiudong serving as the legal representative.

According to business registration information, the business scope of Shanghai Zhisan Qingxin covers technology services, technology development, technology consulting, technology exchange, technology transfer, and technology promotion; retail of computer software and hardware and auxiliary equipment; as well as import and export of goods, import and export of technology, and import and export agency business.

This move marks a further deepening of TsingMicro's strategic layout in core cities of the Yangtze River Delta, and also represents a crucial step in extending its reach from the Beijing headquarters to national computing power hub nodes.

From Tsinghua Laboratory to Unicorn

TsingMicro was founded in July 2018 and is headquartered in Haidian District, Beijing. It has obtained multiple qualifications, including High-Tech Enterprise, National-Level Specialized, Refined, Differential, and Innovative "Little Giant" Enterprise, and Unicorn Enterprise.

The company was spun off from nearly two decades of technological accumulation in reconfigurable computing at Tsinghua University. Its core team members come from Tsinghua University, as well as renowned domestic and international chip and technology enterprises such as HiSilicon, NVIDIA, Apple, and AMD.

Public information shows that Wang Bo, the current Chairman and CEO of TsingMicro, was born in 1978 and holds a master's degree in computer communication from Beijing University of Posts and Telecommunications. From 2003 to 2006, Wang Bo worked at Beijing Wanlinke Communication Technology Co., Ltd., successively serving as a system architect and R&D director. He participated in the R&D of China's first-generation digital switches and routers, deeply engaging in underlying communication technologies. From 2006 to 2018, he joined Hanbang Technology, successively serving as the R&D manager of the network security product line, general manager of the basic network product line, general manager of the pattern recognition product line, and Chief Technology Officer (CTO). During this period, he led the R&D of facial recognition technology and promoted the commercialization of the products.

In 2018, Wang Bo, together with the Tsinghua University reconfigurable computing team (led by academic leader Professor Yin Shouyi), co-founded TsingMicro. They overcame the challenges in reconfigurable computing chip technology and commercialization, propelling the company to become the world's first enterprise to achieve large-scale commercialization of reconfigurable computing chips.

As one of the representative domestic enterprises developing "non-GPU" new architecture AI chips, the reconfigurable AI chips developed by TsingMicro retain the versatility of GPUs while approaching the energy efficiency advantages of dedicated AI chips like TPUs through the dynamic reconfiguration of operators. Evolving from Google TPU's "fixed dataflow architecture" to a "reconfigurable dataflow architecture," it allows the chip hardware to dynamically reorganize in real-time according to different AI tasks, and is also known as an "advanced TPU."

The company has mass-produced over ten high-energy-efficiency intelligent computing chips across two series, including the "TX8 Series" cloud computing power chips for cloud computing scenarios such as smart computing centers, and the "TX5 Series" high-energy-efficiency chips for edge computing scenarios related to computer vision. These chips are widely applied in fields such as smart security, smart offices, intelligent robots, and aerospace.

Among them, the TX8 cloud chip series can natively support the MXFP8 format (E4M3, E5M2, and UE8M0 scale) and MXFP4, providing native, clean, and efficient FP8 GEMM kernels with fine-grained scaling capabilities. It achieves nearly lossless FP8 precision errors and brings MXFP4 inference speeds to the industry's cutting-edge level.

The AI training and inference integrated server equipped with TsingMicro's reconfigurable TX81 chip surpasses international mainstream chips in single-machine computing power under the same power consumption. A single server can support the deployment of large models with trillions of parameters. Through architectural innovation, the overall cost is reduced by 50%, and the energy efficiency ratio is improved by 3 times.

Behind its technological strength is the rapid rise in its market position. According to IDC data, the shipments of TsingMicro's reconfigurable chips have entered the first tier of domestic AI chips. In the first half of 2025, TsingMicro ranked sixth in the shipment volume of major commercially available AI accelerator cards in China. The top five were Cambricon, Hygon, MetaX, Iluvatar CoreX, and Moore Threads. This ranking did not include HiSilicon among the commercially available AI accelerator card brands.

Commercialization progress is equally impressive. As of early 2026, TsingMicro's reconfigurable chips received orders for over 30,000 computing power cards in 2025, with cumulative shipments exceeding 30 million units. They have achieved large-scale deployment in more than ten thousand-card smart computing centers across the country, providing strong support for domestic AI inference application computing power.

The capital market has also highly recognized this technology-driven enterprise. In terms of equity financing, TsingMicro has completed seven rounds of financing in its seven years since establishment, cumulatively introducing strategic shareholders such as Baidu, Ant Group, SK Hynix, SenseTime, China Integrated Circuit Industry Investment Fund Phase II, Wuyuefeng Capital, and GigaDevice.

In December 2025, TsingMicro completed its Series C financing of over CNY 2 billion, receiving joint support from Beijing's "municipal + district-level" state-owned assets. Beijing state-owned institutions such as Beijing Energy Group, Beijing Venture Capital, Beijing Guorui, and Zhongguancun Science City Company served as core investors.

Notably, the scale of TsingMicro's Series C financing set a new high in the domestic AI chip field. Wang Bo, the actual controller, also revealed that TsingMicro is the only new architecture computing power chip enterprise invested by the National Integrated Circuit Industry Investment Fund. After the completion of the Series C financing, insiders claimed that TsingMicro's valuation had jumped from CNY 8 billion at the beginning of the year to over CNY 20 billion.

With the support of capital, the company has also accelerated its steps toward the capital market. On January 31, 2026, the company completed its share reform, changing its name from "Beijing TsingMicro Intelligent Technology Co., Ltd." to "Beijing TsingMicro Intelligent Technology Joint Stock Limited Company." The company plans to build the first listed benchmark enterprise in the field of domestic "non-GPU" new architecture AI chips.

On June 16, 2026, information on the official website of the China Securities Regulatory Commission showed that TsingMicro and its sponsoring broker, Huatai United Securities, have submitted the "Report on the Completion of Sponsoring Work" to the Beijing Securities Regulatory Bureau, marking the official end of its IPO sponsoring phase. Looking back, the company submitted the sponsoring record on March 4 this year, and the entire sponsoring process took only about three months.

Setting Foot in Shanghai: More Than Just a Regional Operation Platform

TsingMicro has been highly active in the Shanghai market recently.

In early September 2026, TsingMicro made an appearance at the Shanghai Bund Summit, showcasing its latest achievements adapted for internet computing power scenarios in the "Data and Computing" exhibition area, including the Reconfigurable Computing 3.0 architecture and the REX81 Supernode server.

Just one day after the establishment of Shanghai Zhisan Qingxin, TsingMicro, together with the listed company Hangzhou Garden and computing power operation service provider Daoke Zhisan, jointly established Hangwei Tiansuan (Shanghai) Intelligent Technology Co., Ltd. in Xuhui District, Shanghai. The joint venture has a registered capital of CNY 20 million, with Hangzhou Garden holding a 51% controlling stake, and Shanghai Zhisan Qingxin participating as the investing entity of TsingMicro. The new company is located in the Xuhui Yidian Huaxin Industrial Park and will integrate the full-stack capabilities of the three parties in infrastructure, chips, and computing power operations to build a localized ten-thousand-card intelligent computing cluster covering the entire industrial chain.

This layout means that Shanghai Zhisan Qingxin is not only TsingMicro's regional operation platform in East China but also plays a key role in leveraging local industrial resources and promoting the landing of large-scale intelligent computing infrastructure.

Choosing Xuhui as the landing site also has a clear industrial logic behind it. Currently, Xuhui District has built a complete AI industry closed loop of "computing power - foundation models - vertical applications," gathering national-level scientific research platforms such as the Shanghai AI Laboratory and the Shanghai Institute for AI Innovation. Embedding TsingMicro's chip capabilities into this closed loop is equivalent to directly accessing the reach channels of downstream customers.

From the perspective of the industry background, domestic AI computing power is currently at a critical stage of transitioning from "usable" to "economical and highly effective." Issues such as restrictions on advanced processes, reliance on imports for high bandwidth memory, and severe redundant losses in traditional architecture computing power continue to plague the industry. Innovative architectures represented by reconfigurable computing have become an important path to break the deadlock.

Industry insiders analyze that the establishment of the Shanghai subsidiary coincides with the triple node of TsingMicro's accelerated technology iteration, IPO process advancement, and national computing power network expansion. It is expected to become its frontier position for docking with Yangtze River Delta customer resources, participating in the construction of national-level computing power hubs, and deepening applications in the internet and financial industries—and this is perhaps the true profound meaning of this Beijing chip unicorn marching south.

Text | Liu Chengxing Layout | Guo Beibei