On October 22, Guangzhou Tozed Kangwei Technology Co., Ltd. listed on the ChiNext board of the Shenzhen Stock Exchange with stock code 301718 and an issue price of CNY 26.88 per share. This brings the total number of domestic and overseas listed companies in Nansha to 18, marking another successful outcome from the "Kunpeng Plan" incubation system.
For Nansha, which is reshaping its semiconductor landscape through a full-chain logic, the listing of Tozed Kangwei signifies more than just a capitalization milestone for a single enterprise. It represents the application end of the semiconductor industry chain, where chip capabilities are integrated into finished devices and delivered to global carrier networks, undergoing verification through real-world delivery.
Tozed Kangwei, Incubated by the Kunpeng Plan, Supports Chip-to-Device Integration Capabilities
Tozed Kangwei settled in Zhujiang Street, Nansha, in 2019. As a key ICT technology enterprise introduced by the Guangzhou Nansha Free Trade Zone, it focuses on the design, R&D, production, and sales of broadband connection terminal devices. The company is a national-level specialized, refined, differential, and innovative (SRDI) "Little Giant" enterprise. Over the years, the company has adhered to an R&D-driven strategy and a tech-export initiative, building a product technology platform based on mainstream communication chips from UNISOC, ZTE Microelectronics, MediaTek, Qualcomm, and other domestic and international suppliers. Its products cover multiple lines including CPEs, portable devices, industrial electronics, and optical communications, meeting broadband access needs across residential, government/enterprise, commercial, and industrial scenarios. The company continues to empower global telecom operators, helping China's communication terminal industry achieve technological breakthroughs and industrial upgrades.
Moving from chip design to large-scale commercialization requires device design, frequency band adaptation, carrier network validation, and mass delivery. Tozed Kangwei plays a critical role in this intermediate stage.
In the past three years, Tozed Kangwei reported operating revenues of CNY 1.025 billion, CNY 1.152 billion, and CNY 1.646 billion, respectively, with a compound annual growth rate (CAGR) of 26.72%. In the first half of 2026, operating revenue further increased to CNY 1.154 billion, up 72.02% year-on-year; net profit attributable to shareholders reached CNY 89 million, a year-on-year increase of 204.38%, indicating sustained acceleration in growth momentum. In 2025, overseas sales accounted for 90.61% of the company's main business revenue, with Sub-Saharan Africa, the Middle East, and North Africa contributing over 70% of that total, demonstrating steady progress in the export of "Nansha Smart Manufacturing."
Nansha's Semiconductor Industry Reaches the Application End, with Tozed Kangwei Filling a Key Gap
Nansha's current semiconductor industry layout centers on Wanqingsha, covering the "materials—equipment—design—manufacturing—packaging—application" chain. By 2026, the Wanqingsha Integrated Circuit Industrial Park hosted 31 enterprises, 18 of which were above-scale enterprises, and established China's first third-generation semiconductor full-industry-chain layout. AscenPower and AccoPower Semiconductor have jointly developed second-generation automotive-grade silicon carbide (SiC) main drive chips and module combinations that have been successfully integrated into vehicles. They are also co-developing third-generation full-series chips, having secured intent orders for main drive projects from multiple automakers in the passenger vehicle sector. Nansha Wafer displayed its 12-inch SiC substrates at SEMICON China 2026 and initiated validation with leading AI chip packaging companies. Anjieli Meiwei's advanced packaging substrate manufacturing base launched in 2026, with a Phase I total investment of CNY 3 billion, focusing on high-end packaging substrate products such as FC-BGA and FC-CSP. These projects address questions of "where chips come from" and "what performance levels are achieved." However, a complete industry chain also requires entities to integrate chips into terminals and deliver them to global networks.
Tozed Kangwei's 5G CPE, industrial electronics, and optical communication products sit at the application outlet of the semiconductor chain: chips undergo device design and adaptation/validation across different global carrier networks, completing delivery as "Nansha Smart Manufacturing." The AI computing chip design ecosystem and wide-bandgap material capabilities being cultivated in Nansha similarly require a terminal outlet with global channels and device engineering experience to receive feedback. With the opening of the Nansha Link of the Shenzhen-Zhongshan Bridge, travel time from Wanqingsha to Shenzhen Bao'an has been reduced to under 20 minutes, adding a layer of transportation support to the collaboration between the two banks of the Pearl River Estuary in "chip design—terminal manufacturing—carrier delivery."
By the end of 2025, Tozed Kangwei had maintained stable cooperation with over 90 global telecom operators, sold products to more than 80 countries and regions, held 104 invention patents and 143 software copyrights, and employed R&D personnel accounting for 53.88% of its workforce. Cumulative R&D investment over the past three years exceeded CNY 250 million. The company has established the Guangdong Provincial 5G CPE/Wireless Router Engineering Technology Research Center and the Guangdong Provincial Postdoctoral Workstation.
From rooting down to growing up, a series of "firsts"
According to the company, starting from Guangzhou Nansha, it has written a series of "first batches" and "first companies" into its growth trajectory:
One of the first manufacturers globally to launch5G CPE products;
The second manufacturer after Huawei to launch 5G CPE products using domestic chips, achieving a breakthrough in the industrialized application of domestic 5G chips;
An Alpha customer for UNISOC's 5G data chips and the first partner for 5G chip CPE products;
The only broadband connection terminal equipment manufacturer in mainland China, apart from Huawei and ZTE Corporation, to enter the top ten global 5G FWA CPE supplier competitiveness rankings;
A national-level SRDI "Little Giant" enterprise, a national high-tech enterprise, and a Guangdong Provincial Manufacturing Single-Item Champion Enterprise.
Of the funds raised in this issuance, CNY 792 million will be invested in the R&D operation center and informatization construction project to strengthen frontier R&D for 5G/5G-A and FWA products and enhance global marketing service capabilities.
Nansha as a Location Hub: The "First Stop" for Guangzhou-Shenzhen Collaboration in the Era of the Shenzhen-Zhongshan Bridge
As Tozed Kangwei rings the bell, the "15th Five-Year Plan" has included sixth-generation mobile communications in the key layout for future industries. The company's R&D planning already covers 6G key technical directions such as U6G and AI-native wireless networks. This aligns temporally with Nansha's semiconductor industry extension towards AI computing chips, automotive-grade third-generation semiconductors, and wide-bandgap materials.
In 2026, the core challenge for Nansha's semiconductor industry is shifting from "whether the chain is complete" to "whether key links can form a closed loop of definition, manufacturing, validation, and iteration." After the opening of the Nansha Link of the Shenzhen-Zhongshan Bridge, travel time from Nansha to Shenzhen Bao'an is under 20 minutes, and to Zhongshan urban area is 15 minutes, providing hard transportation support for the judgment that Nansha District is the "First Stop for Guangzhou-Shenzhen Collaboration." In 2026, Nansha District held the Guangzhou-Shenzhen Electronic Information Industry Collaborative Development Matching Conference in Shenzhen Nanshan, and the Guangzhou Nansha-Shenzhen Bao'an Semiconductor and Integrated Circuit Industry Cooperation Exchange Conference was held at Xindongli Tech City. Collaboration on the semiconductor industry chain across the east and west banks of the Pearl River Estuary has moved from concept to routine matching.
Tozed Kangwei's IPO is one step in the "Kunpeng Plan" and a node in the extension of Nansha's ICT and semiconductor ecosystem from manufacturing clustering to application exports. In the future, Nansha will continue to support local enterprises in becoming stronger and larger, focusing on innovation-driven development, industrial upgrading, and service optimization to attract more high-quality enterprises and talent, contributing to the autonomous and controllable development of China's semiconductor industry.