On July 1, 2026, electronica China kicked off as scheduled at the Shanghai New International Expo Centre. As a pioneer in the intelligent and digital transformation of the electronics industry supply chain, Supplyframe made a brilliant appearance at Booth 600, Hall N2, showcasing its latest digital and intelligent product matrix along with cutting-edge concepts.
During this exhibition, Supplyframe focused on deeply integrating AI (Artificial Intelligence) technology into three core business scenarios: engineering, procurement and supply chain, and market expansion. By showcasing a newly customized AI toolchain, it provided tangible, interactive, and practical solutions for the intelligent upgrade of the electronics industry.
On the first day of the exhibition, a series of events at the Supplyframe booth were spectacular. In the highly anticipated executive dialogue session, eight senior representatives from Southchip, onsemi, RS, DigiKey, New Han Technology, ADI (Analog Devices), Geehy Semiconductor, and Eshi Intelligence took turns visiting the live streaming room. They engaged in discussions around hot topics such as automotive-grade chip industry layout, intelligent power and sensing technologies, development paths for component distribution, precision instrument measurement solutions, breakthroughs of domestic high-end MCUs (Microcontroller Units), and information security for intelligent vehicles. They deeply analyzed the pain points and transformation opportunities in the upstream and downstream development of the industry chain, providing highly valuable insights and practical references for the innovative development of the semiconductor and electronic component industries.
Below, through text and images, let us review the clash of ideas and wonderful moments from the executive dialogue live streaming room.
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Southchip: From Point to Surface, the Grand Strategy of Domestic Automotive-Grade Chips
Photo | Gao Yang, Editor-in-Chief of EEWORLD (left), and Lu Haizhou, Head of the Automotive Business Unit of Southchip (right)
Given the rapid iteration of intelligent driving and intelligent cockpits, automobiles have increasingly stringent collaborative requirements for power management, high-speed data transmission, and functional safety. Traditional discrete chip supply can hardly meet the integration needs under the domain control architecture. Lu Haizhou, Head of the Automotive Business Unit at Southchip, stated that the company has clearly adopted an application-scenario-driven approach to reverse-engineer product planning. Focusing on the three major directions of intelligent cockpits, body control, and intelligent driving, it has built a complete matrix covering power management, high-side protection, SerDes high-speed interfaces, and functional safety PMICs (Power Management ICs). Its latest mass-produced vertical BCD integration process and automotive-grade RISC-V platform are precisely designed to meet the stringent requirements of L3 autonomous driving in terms of efficiency, transmission rate, and safety levels.
Meanwhile, Southchip is accelerating its global layout. Lu Haizhou revealed that the company has completed the localization of its overseas wafer, packaging and testing, and technical support teams, and is deeply involved in the formulation of international standards such as MIPI A-PHY. In his view, the next stage for domestic automotive-grade chips requires not only maintaining the advantages of the local supply chain but also building long-term trust in the global market by aligning with international standards and providing localized services. The year 2026 is precisely the critical node for this transition from "going global with products" to "going global with capabilities."
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From Transformation to Leadership: onsemi's Dual-Engine Strategy for Intelligent Power and Sensing
Photo | Sravan Vanaparthy, Vice President and General Manager of the Power Solutions Business Unit at onsemi (left), and Wang Xiaodan, Media Director of Supplyframe (right)
Driven by the dual forces of global energy transition and the explosion of AI computing power, power electronics technology is moving from behind the scenes to the center stage. As a veteran player in the power semiconductor field, onsemi is building core competitive advantages in the waves of electric vehicles, AI data centers, and robotics through a strategic focus.
Sravan Vanaparthy, Vice President and General Manager of the Power Solutions Business Unit at onsemi, pointed out that China is the fastest-reacting and most cutting-edge market in terms of demand in its global business. In response to the rapid iteration pace of Chinese customers moving from 400V to 800V and even 1000V high-voltage platforms, onsemi has adopted a "half a step ahead" product strategy. Its silicon carbide (SiC) and IGBT solutions now cover the complete chain from grid-side energy storage and charging piles to vehicle electric drives. Particularly in the field of AI infrastructure, onsemi proposes a system-level strategy of "from the grid to the GPU," no longer limited to single devices but providing a full suite of power management solutions from AC-DC conversion to point-of-load power supply, aiming to solve the thermal management and efficiency bottlenecks of data centers under high power density.
Facing fierce local competition in China, onsemi has chosen to bind top customers through a deep joint laboratory model, extending its R&D reach into the pre-research of customers' next-generation vehicle models or energy systems. Sravan Vanaparthy emphasized that the deepest insight from his 20 years of industry experience is the necessity to resonate with customer needs; this is not only a business strategy but also the source of technological direction. At a time when competition in power semiconductors is becoming increasingly homogenized, this collaborative innovation based on long-term trust is becoming an invisible yet most solid moat for onsemi in the Chinese market.
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Dialogue with RS: The Path of Deep Cultivation in the Chinese Market
Photo | Jiang Wenhui, Director of Business Development and Marketing for RS China (left), and Wang Xiaodan, Media Director of Supplyframe (right)
Currently, the global electronics industry chain is undergoing profound restructuring, with geopolitical politics and energy crises accelerating the processes of regionalization and compliance. As a global manufacturing hub, China's role has shifted from unidirectional introduction to bidirectional empowerment. It not only requires high-precision and advanced technologies but also exports high cost-performance solutions, deeply participating in global strategic layout.
Jiang Wenhui, Director of Business Development and Marketing for RS China, pointed out that the key to coping with this transformation lies in "using China as a hub to build a digital supply ecosystem connecting global supply and demand."
RS is leveraging its network covering 36 countries to not only introduce international technical products but, more importantly, help Chinese enterprises go global in compliance. Facing the EU's stringent ESG and carbon footprint regulations, RS provides over 30,000 green-label certified materials to help enterprises achieve low-carbon compliance at the production end, turning environmental protection into a competitive advantage.
Meanwhile, relying on its powerful digital platform and data analysis, RS can precisely match R&D and mass production needs, extremely compressing delivery cycles. It replaces trial and error with data and feeds back the global supply chain with "China speed." This model of deep localization and global resource integration has been highly recognized by the headquarters, proving the irreplaceable leading value of China in the global supply chain.
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DigiKey: Big Data Empowerment, Highlighting Core Competitiveness in Evolution
Photo | Tony Ng, Vice President of DigiKey Asia Pacific (left), and Wang Xiaodan, Media Director of Supplyframe (right)
The electronic component distribution industry is undergoing profound changes. The traditional stocking model, which relies on customer demand forecasting, is becoming increasingly passive under the challenges of intensified supply chain fluctuations and shortened product life cycles. Meanwhile, simple information matching platforms struggle to solve engineers' deep-seated pain points regarding authentic product guarantees and technical support. How to find a balance between "fast" and "stable" has become a core proposition for distributors.
In response, Tony Ng, Vice President of DigiKey Asia Pacific, stated that DigiKey, a distributor with a 54-year history, has its deepest moat not in scale, but in a data-driven decision-making closed loop that has been running for decades. Unlike traditional distributors that rely on procurement forecasts from large customers, DigiKey chooses to trust real behavioral data on its platform—tens of thousands of daily searches, views, and sample orders by engineers worldwide constitute the most primitive demand signals. After a new part number is introduced, only the minimum package quantity is stocked initially. Once the backend observes continuous click-through conversions, the system drives the procurement team to proactively increase orders, stocking up in advance for demand 6 to 9 months later. Since the data comes from globally, demand fluctuations merely shift between different "pockets" of DigiKey, greatly hedging regional risks.
Tony Ng revealed that supporting this model is DigiKey's adherence to "in stock means authentic." All 2 million in-stock items come directly from original manufacturers, ensuring delivery speed and quality traceability. From starting out in the 1970s by clearing inventory through newspapers to now managing 18 million online part numbers, DigiKey has always positioned itself as the infrastructure connecting original manufacturer technologies with engineers' innovations. This operational philosophy of "letting data speak" is precisely the key to maintaining certainty in a volatile market.
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From Local Breakthrough to Global Vision: Strategic Thinking and Layout of a Component Distributor
Photo | He Jin, CEO of New Han Technology of Flytronics Group (left), and Gao Yang, Editor-in-Chief of EEWORLD(right)
China's semiconductor industry is standing at a critical node, transitioning from "breakthroughs in mature processes" to "global market penetration." Over the past eight years, the global share of domestic chips has leaped from less than 10% to over 20%, with product performance, delivery cycles, and cost-performance ratios now possessing international competitiveness. However, the true challenge for the industry has shifted from "being able to manufacture" to "being able to sell"—the selection habits of overseas engineers, localized technical support, and digital reach capabilities have become invisible thresholds restricting the large-scale global expansion of domestic devices.
It is precisely against this backdrop that He Jin, CEO of New Han Technology of Flytronics Group, shared the company's strategic evolution: from a single supply chain service to a comprehensive service provider covering chip distribution, solution design, non-standard customization, global sourcing, and digital platforms. Its core logic is to use "online-offline integration" to solve the two major pain points of scattered information and long supply chain fluctuations—offline, a team of over 40 FAEs deeply engages in customers' design-in processes; online, it jointly launched the "Xplorechips" platform with Supplyframe, connecting the most comprehensive international component data with domestic semiconductor product lines to achieve 24/7 selection support.
In terms of going global, He Jin emphasized that "globalization is localization." Taking Mexico as an example, the local team translates the performance and cost-performance advantages of China's mature process products into solutions that conform to local cultural habits. Currently, the overseas business of New Han Technology accounts for 30%-40%. Its path is to amplify local supply chain advantages with digital tools, carry cultural integration with a global governance structure, and ultimately create tangible "better value" for customers.
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ADI Precision Instrument and Meter Measurement Solutions
Photo | Jiang Haitao, Senior Marketing Manager of the Instrumentation Business Unit at ADI (left), and Shi Dezhi, Senior Industry Analyst at EEWORLD (right)
Currently, the instrument and meter measurement industry is undergoing profound changes. Emerging applications such as new material R&D, new energy testing, and even quantum computing have put unprecedented demands on measurement equipment—no longer satisfied with the traditional trade-off between accuracy and speed, they pursue the ultimate performance of "high accuracy, fast speed, and even faster bandwidth." Meanwhile, product development cycles continue to compress, and enterprises face the dual pressure of launching higher-performance systems in shorter times.
In response, Jiang Haitao, Senior Marketing Manager of the Instrumentation Business Unit at ADI, pointed out that the core pain point for downstream manufacturers is no longer selecting high-performance single devices, but how to quickly realize the implementation of system-level products.
Addressing this demand, ADI is shifting its strategic focus from providing "signal chain products" to delivering "system-level platform solutions"—not simply selling chips, but providing pre-verified complete hardware and software reference designs and algorithm IP. For example, its business-card-sized LCR impedance test modules and ultra-low distortion signal sources allow customers to directly embed them into systems, significantly reducing iteration costs and time from prototype verification to mass production. This model aims to enable enterprises to focus their energy on terminal application innovation rather than repetitive construction of basic platforms, continuously empowering the precision measurement field through high-performance core technologies and deep customer collaboration.
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Geehy Semiconductor: Intensifying Competition, How Domestic Microcontrollers Break Through into the High-End
Photo | Liu Yang, Director of the Industrial Control Chip Business Unit at Geehy (left), and Gao Yang, Editor-in-Chief of EEWORLD (right)
Currently, industrial automation, humanoid robots, and the low-altitude economy are moving from concepts to mass production, posing stringent requirements for the computing power, real-time performance, and functional safety of main control chips. Meanwhile, price hikes and shortages of passive components such as MLCCs further force system cost optimization. How can domestic MCUs (Microcontroller Units) cross these thresholds?
Liu Yang, Director of the Industrial Control Chip Business Unit at Geehy, provided an approach: stepping out of the single-chip performance competition and shifting towards system-level integration.
At the practical level, addressing the shortage of peripheral devices, Geehy launched an "All in One" full-stack motor chip integrating MCU + driver + power, reducing the number of resistors, capacitors, and inductors through high integration, thereby helping customers cut costs at the source. The newly launched G32F0 series digs deep into analog performance, with rail-to-rail Op-Amps (Operational Amplifiers) and high-speed ADCs directly addressing the pain points of high-precision motor control. Facing real-time scenarios such as AI power supply and charging piles, the G32R502 dual-core architecture embeds mathematical acceleration models and has achieved mass production substitution. In the field of high-end servo encoders, dedicated MCUs are built-in with 16-bit high-precision ADCs and hardware protocol decoding. Coupled with mass-production-level demos and one-on-one FAE support, they can help customers achieve rapid implementation within a week.
Liu Yang stated that Geehy is shifting from "selling chips" to "full-chain ecosystem services," breaking through into the high-end with hardware-software synergy.
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Eshi Intelligence: A New Paradigm of Information Security for Intelligent Vehicles in the AI Era
Photo | Sun Tengye, Director of the Business Unit at Eshi Intelligence (left), and Shi Dezhi, Senior Industry Analyst at EEWORLD (right)
The rapid development of intelligent connected vehicles has turned information security from an "elective course" to a "compulsory course." With the official implementation of GB44495 this year and the mandatory enforcement of the EU Cyber Resilience Act next year, the compliance red lines are already clear. However, the popularization of AI large models is profoundly changing the attack and defense landscape—the threshold for attacks has dropped sharply, and vulnerability exploitation has been shortened from "days" to "hours." Traditional defense models relying on manual labor face huge challenges.
Facing this change, Sun Tengye, Director of the Business Unit at Eshi Intelligence, believes that the core pain point for automakers is not a lack of technology, but "resource deceleration": there is a severe shortage of compound talents who understand both automotive functions and are proficient in information security and regulatory standards. Meanwhile, automotive R&D cycles have been compressed from years to months, making it difficult for security design to keep up with the agile pace.
Addressing this challenge, Sun Tengye pointed out that the way to break through lies in "intelligent defense." To this end, Eshi Intelligence has launched a full-chain agent family covering TARA risk assessment, solution design, testing and verification, and O&M monitoring. These agents deeply integrate methodologies, expert experience, and knowledge bases to achieve "knowledge equity"—solution design that used to take two weeks can now be completed in half a day; penetration testing efficiency has significantly improved, with stable and reliable quality. Additionally, the agents can seamlessly embed into automakers' DevOps pipelines, continuously evolving through ecological collaboration.
Therefore, in the AI era, information security is no longer a compliance burden but a core competitiveness for intelligent vehicles.
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Demo Zone and Joint Press Conference
In addition to the executive dialogue live streaming room, the on-site "Demo with Us" joint demonstration zone was crowded with people. The application appreciation brought by Supplyframe in collaboration with RS and Arduino, as well as the hardcore teardown of the UBTECH AI Wukong Companion Robot Gen 2 on-site, provided the audience with an immersive experience from technology to products.
Photo | "Demo with Us" Joint Demonstration Zone
Meanwhile, on the first day, the strategic cooperation signing ceremony between Supplyframe and Flytronics was also held. Both parties jointly announced collaborative initiatives for the global market centered around the next-generation AI-driven electronic component trading platform Xplorechips.
Photo | Hong Zilun, General Manager of Supplyframe Asia Pacific (left), and Wang Zhongliang, Senior Vice President of Flytronics Group (right)