Recently, AsGaN has observed a dense rollout of SiC orders and partnerships, with silicon carbide accelerating its adoption in AI data centers, energy storage, NEVs, and other fields:
Infineon: Partnered with SolarEdge and Smarten, supplying SiC products for AI data centers and energy storage fields, respectively.
Sanan Semiconductor: Brought SiC innovation achievements to Enpower, conducting a supply and demand matchmaking exchange meeting;
YOFC Advanced: Reached a strategic partnership with Zhixin Control, jointly promoting the development, certification, and mass production delivery of automotive-grade SiC products;
Lianchuang Technology: Secured a batch order for 16 sets of high-power multi-site 8-inch CP test systems for automotive-grade SiC testing;
Infineon: Secures SiC Partnerships with SolarEdge and Smarten
Recently, Infineon announced the closure of silicon carbide partnerships in the SST and energy storage fields.
On September 12, Infineon announced an expanded partnership with SolarEdge to promote the application of Solid-State Circuit Breaker (SSCB) technology in high-voltage direct current (HVDC) power distribution for AI and hyperscale data centers.
It is reported that this expanded cooperation into solid-state protection will bridge the critical gap in the distribution layer between Solid-State Transformers (SST) and computer racks. SolarEdge will lead the design of the SSCB solution, while Infineon will provide its Silicon Carbide (SiC) JFET technology as the core of the protection device. This also means that SolarEdge's SST platform will adopt Infineon's SiC components.
Almost at the same time, on September 7, Infineon visited the headquarters of Shenzhen Smarten Electric. The two parties held exchanges on the supply guarantee of SiC devices, technological synergy, and the global layout of new energy microgrids, jointly consolidating the "core supply" for microgrid energy storage.
Smarten stated that this symposium is not merely about procurement and sales, but a deep integration of "underlying devices" and "microgrid systems"—Infineon's power technology supports Smarten's product performance, while Smarten's globally deployed microgrids also provide an excellent commercial validation platform for Infineon's advanced devices.
It is reported that Smarten is a key strategic customer of Infineon in the new energy and microgrid fields. All grid-forming energy storage Power Conversion Systems (PCS) from Smarten adopt Infineon's SiC modules. At the symposium, Infineon clarified its long-term supply to Smarten, stating that it will subsequently empower Smarten in SiC device selection, system-level thermal management, and joint testing of a new generation of high-frequency and high-voltage products.
Sanan Semiconductor: Brings SiC Innovation Achievements to Enpower
On September 16, Sanan Semiconductor, a subsidiary of Sanan Optoelectronics, released a statement announcing that they and their joint venture, Suzhou SICO Semiconductor, were invited to attend the "2026 Enpower Supply Chain Technical Exchange and Supply-Demand Matchmaking Meeting".
At the meeting, Sanan Optoelectronics released the latest research achievements in silicon carbide and a special report on related testing research. It also showcased its capabilities in SiC MOSFET design, testing evaluation, and mass supply, gaining recognition from Enpower and attending industry chain partners. Enpower is an enterprise engaged in the R&D and production of electric drive and power supply systems for NEVs.
The article further revealed that, as of now, Sanan Optoelectronics has cumulatively shipped over 400 million SiC chips/devices. Its power device shipments consistently rank among the top in the domestic industry, with products widely applied in NEVs, photovoltaic energy storage, charging piles, AI server power supplies, and white goods. In terms of products, Sanan Optoelectronics has completed the gradient construction of SiC diode products covering full voltage and current ranges from 650V to 2300V and 1A to 120A, as well as the full-series layout of SiC MOSFET products ranging from 650V to 3300V and 12mΩ to 1000mΩ.
It is reported that Hunan Sanan Semiconductor possesses a vertically integrated manufacturing platform spanning from crystal growth, substrate preparation, epitaxial growth, to chip processing, relying on fully autonomous and controllable full-process and whole-chain quality management. As a joint venture of Hunan Sanan Semiconductor, SICO Semiconductor extends its product capabilities to the packaging and testing module segment, enabling Hunan Sanan to form a complete product supply from chips and devices to packaging and testing modules, better meeting customer needs in application scenarios such as OBC, main drive, and AIDC.
YOFC Advanced: Conducts Automotive-Grade SiC Cooperation with Zhixin Control
On September 16, YOFC Advanced officially announced that it has successfully signed a strategic cooperation agreement with Zhixin Control System Co., Ltd., jointly promoting the development, certification, and mass production delivery of automotive-grade SiC products.
The statement declared that this cooperation covers the entire chain from module packaging to system integration. Both parties will fully leverage their respective core advantages—Zhixin Control, relying on its profound development experience in the automotive components field and extensive domestic and international customer resources, and YOFC Advanced, leveraging its whole-industry-chain advantages in the silicon carbide power semiconductor field—to jointly promote the development, certification, and mass production delivery of automotive-grade chips, power modules, and power semiconductor PCB embedded products.
According to previous reports by AsGaN, YOFC Advanced just closed an A+ round equity financing of over CNY 1 billion in February this year. The funds will be mainly used for the whole-industry-chain technological layout of silicon carbide power semiconductors. Currently, YOFC Advanced has two major production bases in Wuhu and Wuhan, forming an annual production capacity of 420,000 pieces of SiC wafers. In June 2025, YOFC Advanced also reached a strategic partnership with Jingwei Hirain, supplying the latter with high-performance silicon carbide power modules.
The official WeChat account shows that YOFC Advanced, founded in 2018, is an enterprise focusing on the R&D and manufacturing of SiC power semiconductor products. It possesses whole-industry-chain capabilities from epitaxial growth, device and module design, wafer manufacturing, to module packaging and testing, and can provide a full range of industrial-grade to automotive-grade SiC SBD and MOSFET products.
Lianchuang Technology: Secures 16 Sets of Automotive-Grade 8-Inch SiC Testing Orders
On September 14, Lianchuang Technology revealed on its official WeChat account that it has successfully secured a batch order for 16 sets of high-power multi-site 8-inch CP test systems from a leading silicon carbide enterprise. The equipment will be specifically used for the mass production testing of automotive-grade high-power silicon carbide wafer chips.
The article stated that Lianchuang Technology's multi-site high-power SiC testing solution has achieved mass production implementation in leading enterprises and over a dozen key customers nationwide. This solution natively supports the functional upgrade of merged RG and avalanche testing, directly matching the acceptance requirements of high-end projects and adapting to the iteration needs of automotive-grade SiC devices.
According to previous reports by AsGaN, in October 2025, Lianchuang Technology announced substantive progress in its cooperation with Shenzhen Pinghu Laboratory, and its ultra-high voltage silicon carbide wafer testing system has been deployed at the Shenzhen Pinghu Laboratory.
As a supplier of semiconductor discrete device testing systems, Lianchuang Technology's equipment has been recognized and applied by well-known domestic and international semiconductor enterprises such as onsemi, Amkor Technology, JCET, Tongfu Microelectronics, and Hua Tian Technology. It is also one of the few Chinese semiconductor equipment manufacturers that have entered the supply chain system of the international packaging and testing market.
This article is published by AsGaN, focusing on industry observation of third-generation semiconductors (silicon carbide and gallium nitride).