On September 14, the Fujian Environmental Protection Network released the Interim Completion Environmental Protection Acceptance Monitoring Report for the Phase I Project of the 8-inch SiC Power Device Chip Manufacturing Production Line by Xiamen Silan Microelectronics Co., Ltd., with an acceptance result of "qualified."
According to the acceptance report, construction of the project began in June 2024. The total planned investment was CNY 7 billion, while the actual estimated investment stood at CNY 5.6 billion (as some equipment has not yet been installed), covering a total land area of 136,300 m².
The Phase I project is designed to have a production capacity of 35,000 8-inch SiC power devices per month, or 420,000 units annually. During this acceptance period, not all production equipment was operational, resulting in an actual capacity of 23,300 8-inch SiC power device chips per month (280,000 units annually).
It is reported that the Silan Jihong project is being constructed in two phases, with a total building area reaching 234,500 m². Centered on SiC MOSFETs as its core product, the project aims to increase total capacity to 720,000 units/year after Phase II becomes operational, establishing it as one of the world's largest 8-inch SiC power device production lines.
Silan Microelectronics stated that upon full operation, the project will effectively meet domestic demand for silicon carbide chips required by NEVs. It will also be capable of supplying high-performance silicon carbide chips for power inversion products in sectors such as photovoltaics, energy storage, charging piles, AI server power supplies, and large white goods intelligent power modules, thereby promoting the coordinated development of domestic 8-inch silicon carbide substrates and related process equipment.
As previously reported by "Hangjia Shuo Third-Generation Semiconductors," Silan Micro has been laying out its silicon carbide projects since 2017, continuously expanding investment amounts and production capacity. It has established two major SiC chip production lines: "Silan Advanced Compound Semiconductor - 6-inch" and "Silan Jihong - 8-inch."
In 2017, Silan Micro signed an investment cooperation agreement with Xiamen Semiconductor Investment Group in Xiamen to prepare for the construction of a 4/6-inch compatible compound semiconductor production line in Haicang District, Xiamen. The project is undertaken by their joint venture, Silan Advanced Compound Semiconductor, and is divided into two phases.
In August 2021, Silan Micro's SiC power device pilot line achieved operational status. By 2022, R&D on automotive-grade SiC MOSFET devices was completed, with plans to send samples to customers and begin mass production.
In July 2022, Silan Micro announced that Silan Advanced Compound Semiconductor would construct a Phase II project—the "SiC Power Device Production Line Project"—with a total investment of CNY 1.5 billion. Upon reaching full capacity, this phase will add annual production capabilities of 120,0006-inch SiC MOSFET chips and 24,000 6-inch SiC SBD chips.
In June 2024, construction began on the Xiamen Silan Jihong 8-inch SiC Power Device Chip Manufacturing Production Line Project. The main structure was topped out in February 2025, the first equipment was moved in ahead of schedule in June 2025, and the Phase I completion ceremony was held in September 2025, marking initial operational readiness.
In its 2026 semi-annual report, Silan Micro disclosed that in the first half of 2026, the company's total operating revenue reached CNY 7.262 billion, up 14.62% year-on-year; operating profit was CNY 427 million, up 161.03% year-on-year. Specifically, revenue from power semiconductors and discrete devices reached CNY 3.444 billion, an increase of approximately 15%; revenue from IGBTs and SiC (modules and devices) applied in automotive and photovoltaic sectors reached CNY 1.596 billion, an increase of approximately11%.
Regarding capacity, Silan Advanced Compound Semiconductor has formed a production capability of 10,000 6-inch SiC-MOSFET chips per month, which is currently running near full load.
In terms of silicon carbide business expansion, during the first half of 2026, Silan Micro achieved bulk shipments of SiC MOS devices for photovoltaic applications. Shipments of main motor drive modules for electric vehicles, produced using self-developed Gen II and Gen IV SiC-MOSFET chips, along with the number of customers, continued to increase, with significant growth expected in the second half. Additionally, its Gen II SiC-MOSFETs have passed rigorous certifications from top-tier domestic manufacturers and are achieving bulk shipments for power supplies in AI computing centers.
Looking ahead, Silan Micro plans to accelerate the R&D and technology maturity of 8-inch automotive-grade GaN power devices and introduce relevant products in due course.