In September, seven departments including the Cyberspace Administration of China, the National Development and Reform Commission, and the Ministry of Industry and Information Technology jointly released the Implementation Plan for Promoting the Coordinated Transformation and Development of Digitalization and Greenization (2026-2030), explicitly proposing to "explore the 800V high-voltage direct current (HVDC) power supply architecture for computing power facilities and promote the deployment of single cabinets exceeding100 kilowatts."
Meanwhile, leading domestic enterprises such as ByteDance and Meituan are also accelerating the deployment of the 800V route. This means the 800V DC architecture is accelerating its transition from concept to implementation. In this power supply architecture upgrade, Gallium Nitride (GaN) is becoming the core component in the critical 800V-to-50V conversion stage.
Against this backdrop, a domestic company, Yingnuosaike, is standing out. With its 12kW 800V-to-50V HVDC solution, it provides a high-efficiency, high-density, and liquid-cooling-compatible power supply path for AI data centers, and has won recognition from NVIDIA.
It can be seen that Yingnuosaike's all-GaN solution will become an important part of the 800V HVDC power supply ecosystem. So, why does HVDC power supply need GaN? And why can Yingnuosaike's solution stand out?
800V HVDC Accelerates Implementation: AI Power Supply Architecture Ushers in an Upgrade Window
From the germination of the concept to project implementation, the 800V high-voltage direct current (HVDC) data center industry has completed rapid iteration in less than two years.
According to research data from Xingjiashuo Research, as of the first half of 2026, there are over 61 publicly announced AI data center (AIDC) projects globally, of which 14 explicitly adopt the ±400V or 800VDC power supply solution, with a penetration rate approaching one-quarter. It has been only a little over a year since NVIDIA first proposed the 800VDC technical concept at the Computex conference in May 2025, and the industry implementation speed far exceeds market expectations.
Looking at the global terminal market, major leading computing power manufacturers have fully entered the game and increased their layout. In the overseas camp, NVIDIA has clearly finalized the implementation timetable for 800VDC technology, planning to achieve large-scale mass production and introduction based on the Kyber rack in 2027; Google, Microsoft, and META, in collaboration with NVIDIA, are jointly promoting the establishment and implementation of 800VDC industry standards under the framework of the Open Compute Project (OCP).
The implementation pace of domestic manufacturers is also continuously accelerating. Meituan took the lead in achieving technical implementation. The Solid State Transformer (SST) project created jointly with Qinhua Data and Delta Electronics has successfully completed real-network scenario verification; Alibaba Cloud and ByteDance start from the computing power system, directly introducing 800V HVDC power supply into IT cabinets to reconstruct the computing power supply link; Tencent also publicly announced at an industry forum that it will launch pilot applications of 800VDC power supply technology within the year.
Although the paths for various enterprises to enter the track vary, the direction of technological upgrade is highly unified. This also means that the 800V HVDC data center is no longer a technical concept on paper, but a definite industry trend that has entered the stage of large-scale implementation.
The core of this AIDC power supply architecture reform stems from the essential differences between the old and new power supply systems. The traditional data center power supply link is tedious and long, requiring multiple AC-DC conversions. As the power consumption of AI computing clusters continues to rise, costs such as equipment loss, copper cable consumption, and data center floor space have increased simultaneously.
The 800VDC technology route led by NVIDIA completely simplifies the power supply link: it completes the conversion from AC to 800VDC high-voltage direct current in one go through the Solid State Transformer (SST), and then the rack DC-DC conversion power supply steps down the 800VDC to 50VDC to directly power the GPU equipment, greatly simplifying the conversion stages and reducing energy loss.
The entire architecture relies on the link mode of IT rack 800V HVDC power distribution + DC/DC conversion, which not only reshapes the power supply logic of the AIDC industry but also reconstructs the value distribution system of the entire industrial chain. Among them, the Solid State Transformer (SST) and rack DC-DC power supply have become the two incremental tracks with the highest certainty in this round of AI power supply architecture upgrade, and the upstream and downstream of the industrial chain are accelerating capacity and product layout.
According to incomplete statistics, as of September 2026, more than 34 companies globally have launched solid-state transformer-related products, and the track heat continues to rise. Among them, industry leaders such as Delta Electronics and Weiguang Energy have achieved batch shipment of SST products or won multiple industry orders, successfully landing in core AIDC scenarios, marking that solid-state transformers have officially moved from the prototype verification stage to the scale delivery cycle.
In the core DC-DC supporting link, aiming at rack power distribution needs such as 800VDC to 50VDC, mainstream power supply manufacturers such as Delta Electronics, Lite-On Technology, Megmeet, and Flex have all launched adaptive products, and the pace of mass production and delivery nodes continue to become clear, greatly improving industrial supporting capabilities.
Delta Electronics publicly stated at its Q2 2026 earnings call that the ±400V and 800V power supply products developed for the GPU server market have started mass production in Q3 2026, and it is expected to usher in a large-scale shipment inflection point in 2027.
Lite-On Technology also disclosed the latest industrial progress. Its 800VDC high-power rack project created with leading cloud customers has a single cabinet power exceeding 1.5MW. The project verification work was completed ahead of schedule in Q3 2026, and mass production officially started in Q4; at the same time, the 2.5kW DC-DC power module adapted to the scene will also enter the mass production stage synchronously.
As core power supply suppliers for global leading computing power manufacturers such as NVIDIA and Google, the products of Delta and Lite-On, from R&D implementation, sample iteration to formal mass production and delivery, mean that in the near future, the 800VDC power supply industrial chain will cross the bottleneck of technical verification and thus enter the key stage of large-scale commercial use.
800V-to-50V Becomes a Key Challenge: Yingnuosaike Cuts into the Core of AI Power Supply
According to feedback from industry insiders, from the progress of leading manufacturers, compared with the Solid State Transformer (SST) which has entered the implementation stage, the 800V HVDC rack power supply is still in the stage of technical verification and iteration.
Against the background of 800V AIDC, the new challenge faced by traditional DC-DC power conversion is how to convert power from high-voltage distribution to GPU core power supply with higher efficiency and more compactness. The direct transition from 800V to a lower voltage level not only puts forward higher requirements for the withstand voltage, loss, and frequency of power devices but also forces the power supply solution to upgrade comprehensively in terms of size, efficiency, and reliability.
Aiming at the power supply conversion needs of 800V high-voltage racks, Delta Electronics clarified two mainstream technical routes at the 2025 OCP conference: the first is the DC-DC power shelf solution, which steps down 800V to a 54V (50V) bus and then powers the backend load; the second is the Power Distribution Board (PDB) direct distribution solution, which can support higher rack power but puts forward higher requirements for the power density of the whole machine. Delta Electronics judges that when the rack power exceeds 300kW, the PDB direct distribution solution will become the industry mainstream.
A technical expert from ByteDance also confirmed this trend at a recent AIDC technology forum: when the power of a single computing node exceeds 30kW, 800V+PDB will become the mainstream technical route; and among the current three technical solutions, the 800V-to-54V architecture has strong adaptability and better meets the needs of large-scale AIDC implementation at this stage.
However, the core challenge of 800V entering the cabinet focuses on the HVDC PDB part, and its core is the challenge of power density. According to ByteDance R&D personnel, they have currently developed a PDB with a power level of 30kW, within an area of 330mm×220mm, and achieved 30kW in a 1U node with limited height, which requires integrating three 10kW full-brick power modules inside the PDB.
Secondly, it is the challenge of the ecosystem. This solution requires a large number of new components, including high-performance capacitors and EMC inductors. Traditional devices are too large to meet the needs of high-density integration, so it is necessary to use miniaturized component models close to the physical limit.
Against this backdrop, GaN power devices have become a new breakthrough. At the same voltage level, compared with traditional power devices, GaN can achieve higher switching frequency, lower switching loss and driving loss, and more compact power stage design. These advantages at the device level will be translated into value at the system level—high efficiency, high power density, excellent thermal performance, smaller sizes of magnetic components and passive devices, and lower overall system cost.
Therefore, the 800 AIDC alliance formed by NVIDIA has included multiple leading GaN suppliers such as Yingnuosaike. At present, AIDC power supply manufacturers such as Delta Electronics, Lite-On Technology, and Megmeet are also actively introducing GaN technology, indicating that GaN is becoming the key path to solve the challenge of 800V rack power conversion.
It is worth noting that as the only domestic chip manufacturer that has cooperated with NVIDIA, Yingnuosaike has launched an all-GaN 12kW 800V-50V data center HVDC power supply solution, and won the NVIDIA GTC MGX Ecosystem Award with this solution, becoming the only Chinese chip enterprise to win the award.
In the 800V HVDC AI data center power architecture ecosystem demonstrated by NVIDIA, more than half of the NVIDIA partner power system solutions also use Yingnuosaike's GaN power devices. This means that Yingnuosaike's GaN technology is becoming one of the key core components of the AI data center HVDC power supply architecture.
The reason why Yingnuosaike's all-GaN solution can win NVIDIA's recognition and become the key solution for 800V-to-50V lies in its advantages in efficiency, power density, and cost.
In terms of efficiency, the 12kW HVDC power reference solution adopts an All-GaN design, with the primary and secondary sides using Yingnuosaike's 650V and 100V GaN devices respectively. Relying on features such as low on-resistance and low gate charge, as well as the All-GaN LLC architecture, the solution achieves a peak efficiency of 98.63% and a full-load efficiency of 98.18%, leading the industry in energy efficiency.
Compared with the traditional Si solution, switching loss and driving loss are greatly reduced, and the device is packaged with double-sided heat dissipation. Coupled with an ultra-thin design, it can be used with liquid cooling, which can further reduce heat generation and cooling pressure, thereby reducing computing power costs.
In terms of power density and compact design, the solution adopts a 16-layer PCB integrated planar transformer design, with a power stage size of only 60mm×124mm×11mm, and the volumes of magnetic passive devices such as transformers and inductors are greatly reduced, helping to achieve miniaturization and lightweight of power modules, which can meet the deployment needs of AI high-density cabinets and liquid-cooled intelligent computing centers.
Combined with the 30kW power level PDB solution requirements proposed by ByteDance mentioned earlier—integrating three 10kW power modules within an area of 330mm×220mm and a 1U height limit—the size and power level of Yingnuosaike's 12kW solution exactly match this scenario.
Through calculation, the power stage area of Yingnuosaike's solution is only about 7,440mm². The side-by-side layout of3 modules only accounts for about 30% of the total PDB area, and the 11mm height is far lower than the 1U limit of44.45mm, leaving sufficient space for liquid cooling plates, structural parts, and current sharing design. This shows that stacking three modules of Yingnuosaike can achieve a total power of 36kW, leaving peak margin and redundant backup capabilities.
In terms of cost and scalability, Yingnuosaike's solution further reduces costs by streamlining the usage of copper and cables; at the same time, it adopts a standardized 12kW power unit, which can be flexibly stacked to easily realize the upgrade of cabinet power supply from hundreds of kilowatts to megawatts, with high hardware reuse rate and lower iteration cost.
It is worth noting that for the 800V HVDC power supply architecture, Yingnuosaike has achieved full-link InnoGaN application introduction. In the field of 800V-to-50V, in addition to the above 12kW HVDC Demo solution, Yingnuosaike is also developing a 6kW MHz HVDC half-brick module solution; in the field of 48V-to-12V, corresponding to different power levels, Yingnuosaike has also launched 1.2kW and 1.5kW high-power-density multi-phase Buck converter solutions respectively.
As the technical layout continues to land, Yingnuosaike's business process at the AI data center end accelerates, and shipments achieve rapid growth. In the first half of 2026, Yingnuosaike has delivered 9.63 million GaN chips to AI data centers, a year-on-year increase of 183%.
During this period, Yingnuosaike has completed the full-series design layout of 5.5KW AC-DC, 800V HVDC, 48V/12V, and 6V/1V. Among them, the 650V high-voltage chip applied to 800V and the 100V medium-voltage chip applied to 48V/12V have achieved large-scale delivery; the 15V DrGaN product applied to 6V/1V GPU power supply has completed sampling and testing by international leading customers. Its AIDC power supply technology ecosystem continues to improve, which will open up a new round of growth space.
From the accelerated implementation of the 800V HVDC architecture to the large-scale introduction of GaN in AI server power supplies, Yingnuosaike's 800V-50V HVDC solution provides a mass-producible GaN answer for this round of power supply upgrade.
As leading power supply manufacturers such as Delta and Lite-On promote large-scale shipment of 800V products in 2027, the penetration rate of GaN in data center power supplies is expected to rise rapidly. In the future, whoever can take the lead in balancing efficiency, density, and reliability in the key link of 800V-to-50V will have a better chance of taking the lead in the power supply competition for AI computing infrastructure.
This article is published by [Ascomp第三代半], focusing on industry observation of the third-generation semiconductor (silicon carbide and gallium nitride).