Recently, two more companies have announced their progress in Micro LED Co-Packaged Optics (CPO).
BOE and Corning held an upgrade press conference, showcasing a functional verification prototype for Micro LED optical interconnect;
AUO addressed misconceptions regarding Micro LED CPO technology and stated that the Pan-AUO group, along with Ennostar, Tekcore, and others, is overcoming challenges in Micro LED CPO.
▋ BOE Showcases Optical Interconnect Functional Verification Prototype
On October 16, the upgrade press conference for the BOE × Corning Joint Innovation Space was held at the BOE Technology Innovation Center. The event announced the co-establishment of the joint innovation space, which is based on the previous memorandum of cooperation to continuously deepen technological collaborative innovation.
The upgraded joint innovation space focuses on glass-based packaging substrates, glass-based perovskite devices, optical interconnects, bendable glass, and automotive displays. The cooperation between the two parties includes traditional supply chain support and joint research and development in the display field. BOE is also promoting the global technological innovation strategy of intelligent connectivity of all things through optoelectronic integration technology. BOE and Corning also jointly displayed related exhibits.
In the glass-based packaging substrate section, relevant samples in the field of advanced packaging were displayed, highlighting solutions in areas such as glass vias and glass cores.
In the optical interconnect section, BOE's Micro LED optical interconnect functional verification prototype was exhibited.
In the glass-based perovskite device section, BOE's perovskite photovoltaic power generation model breaks through the bottleneck of weak light power generation in traditional crystalline silicon, achieving efficient power generation in indoor and weak light environments.
In the bendable glass section, Corning's glass materials and BOE's mirror-like "traceless" OLED flexible screen were exhibited. Through material and structural optimization, visual tracelessness is achieved in the bright state.
In the automotive display section, automotive Micro LED smart cockpit displays were exhibited, featuring the advantages of high brightness, high transparency, and high reliability in automotive application scenarios.
▋ AUO: Benefits of Micro LED CPO Expected to Materialize in 2-3 Years
Largan Chairman Lin Enping previously expressed the view that using Micro LED for CPO is "unfeasible," sparking heated industry discussions. AUO Chairman Peng Shuanglang responded that there are misconceptions, stating that different technological routes have their respective applicable scenarios. Recently, Credo launched the new 1.6T ZeroFlap active optical cable product, which also provides support for this route. The Pan-AUO system is joining forces with enterprises such as Ennostar and Tekcore to jointly promote the implementation of Micro LED in the CPO field.
Optical transmission architectures cover Scale-in, Scale-up, and Scale-out depending on the transmission distance, with different technological paths excelling in their respective domains. At the OCP Summit, Credo introduced the new 1.6T ZeroFlap active optical cable product. Industry analysis indicates that the micro-emitter architecture demonstrated by Credo supports transmission up to 50 meters, successfully advancing micro-light-emitting technology into the backplane of server racks, verifying its feasibility for implementation.
Peng Shuanglang previously revealed that AUO's CPO layout focuses on high-value optical communication modules and is responsible for module integration and shipment. Currently, product verification has been carried out with customers and has entered the sampling stage. The expected benefits will materialize within two to three years.
As AI high-speed transmission drives architectural innovation, the Pan-AUO group is extending Micro LED technology to the optical communication field. With the capabilities of both mass production of III-V dies and system integration, it is expected to secure a place in the next-generation CPO ecosystem. AUO specializes in high-complexity substrate technology and module system integration for shipment, Ennostar provides light-emitting components, Tekcore focuses on sensing dies for the optical receiving end, and HuanYu possesses VCSEL component capabilities, building a complete micro-optoelectronic chain from the light-emitting end to the light-receiving end.
▋ Multiple LED Companies Advance Micro LED CPO
Overall, Micro LED CPO is a low-power route for parallel arrays, matching the interconnect needs of chips and boards within racks. The capabilities accumulated by LED companies over the years in III-V epitaxy, micron-level chips, mass transfer, and precision packaging can be directly reused, representing a second growth curve with immense imagination space in Micro LED technology.
According to statistics from Asight Display, multiple LED companies entered the Micro LED CPO track in the third quarter:
In October, ams OSRAM joined the Short-Reach Micro-Emitter Optical (SRMO) working group of OCP, joining hands with Credo to co-build optical interconnect standards for AI infrastructure.
In October, Xinghuo Chenguang announced the completion of its first round of financing, led by Sequoia China and followed by Sanan Optoelectronics. The company can provide Micro-LED-based optical interconnect chips and solutions.
In October, Focus Lightings Tech stated in an investor Q&A that its Micro LED CPO optical chips have currently received customer verification feedback and completed system prototype verification. It is expected to complete the verification of commercialization opportunities at the customer end in 2027 and achieve commercialization breakthroughs in 2028.
In September, INNOSHINE Semiconductor collaborated with Tsinghua University and Beijing Xinghuo Chenguang Technology Co., Ltd. Its Micro-LED chip samples achieved a -3dB bandwidth (an indicator measuring the high-speed response capability of light-emitting devices) of 3.5GHz at a current density of 500A/cm².
In September, at CIOE, Sanan Optoelectronics, Shenzhen MTC, Raysolve, StarkSEMI, Enkris Semiconductor, and Lekin Semiconductor showcased optical communication solutions.
In August, the "Nanjing University-BOE Huacan Optoelectronics Micro-LED Co-Packaged Optics (CPO) Frontier Technology University-Enterprise Joint Laboratory" was officially signed and unveiled.
In August, AUO planned to increase its investment by TWD 8.4 billion into three high-value main lines, including Micro LED optical communication.
In July, Ledman Optoelectronic signed the "Strategic Cooperation Framework Agreement for Industry-University-Research" with the Institute of Nanoscience and Applications at Southern University of Science and Technology, striving to achieve technological breakthroughs in fields such as TGV glass-based Micro LED, quantum dot display, and Micro LED-based CPO optical communication.