The "15th Five-Year Plan for the Electronic Information Manufacturing Industry" clearly deploys the acceleration of smart sensor innovation and application, taking the enhancement of process capabilities for smart sensors such as MEMS and the construction of a whole-process quality system as key tasks, directly addressing the core issues of China's smart sensor industry development. Currently, China's smart sensor industry has formed a complete industrial chain, with significant achievements in domestic substitution in the fields of consumer electronics and environmental monitoring. However, it still faces structural shortcomings such as insufficient MEMS process stability, incomplete product portfolios, weak system solution capabilities, and an industrialization "death valley" in the connection between production and application. The root causes are concentrated in cognitive inertia bias, the disconnect between industry-university-research mechanisms, loose industrial chain coordination, and misaligned policy support focus. Facing the "15th Five-Year Plan", industrial development needs to shift to a systematic upgrade approach of process foundation, quality assurance, portfolio supply, and scenario implementation. By tackling MEMS micro-nano processes and heterogeneous/heterostructure integration, building a whole-chain quality control system, and improving portfolio-based product supply, it will promote the integration of production and application relying on key scenarios such as the "Six Networks", and improve supporting mechanisms for standards, innovation consortia, talent, and capital. At the same time, it is necessary to be vigilant against the misconceptions of blind capacity expansion and prioritizing indicators over mass production, promote domestic substitution in a gradient manner, and consolidate the perception industry foundation required for China's new industrialization and new quality productive forces.
Smart Sensors: The Perceptual Foundation and Industrial Base in the Digital Era
(I) The Era Background of the Plan's Release
The new round of global scientific and technological revolution and industrial transformation continues to deepen. New tracks such as AI (Artificial Intelligence), embodied intelligence, intelligent manufacturing, and the low-altitude economy are accelerating their landing and iteration, and the boundary of interaction between the physical and digital worlds continues to dissolve. As the core interface for converting physical signals into digital signals, smart sensors are indispensable "perceptual organs" for various digital and intelligent systems. They undertake the core functions of collecting real data signals from the physical environment, identifying changes in environmental parameters, supporting intelligent decision-making, and ensuring the safe operation of equipment. Their strategic value in the entire electronic information industry system continues to rise. Without highly reliable perception capabilities, digital systems cannot obtain digital information from the real physical world. All intelligent applications, such as AI large models, industrial automation, and high-end intelligent equipment, will lose their source of real-world data and become water without a source and a tree without roots.
The "15th Five-Year Plan" period is a critical five years for China to promote new industrialization and accelerate the development of new quality productive forces. The Ministry of Industry and Information Technology and the National Development and Reform Commission jointly issued the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry", which takes accelerating smart sensor innovation and application as an independent key task to build up industrial foundation capabilities, deploying it in parallel with underlying basic tracks such as IC (Integrated Circuit), core electronic components, and the photonics industry. This arrangement is not simply adding an entry to the industrial catalog, but a systematic top-level design by the state aiming at the underlying shortcomings of China's electronic information industry. It releases a clear policy orientation to concentrate efforts on tackling the bottlenecks of the sensor industry and consolidating the underlying foundation capabilities of the manufacturing industry.
After more than ten years of continuous cultivation, the market scale of China's sensor industry has steadily ranked among the top in the world, the coverage of product categories continues to broaden, and the industrial volume maintains steady growth. However, unavoidable realistic contradictions have long existed, and the industry presents a structural pattern problem of "large but not strong, comprehensive but not excellent, excellent but without scale". In scenarios with strict reliability requirements such as high-end industrial control, automotive electronics, high-end medical equipment, and aerospace, domestic sensors have prominent shortcomings in long-term working stability, batch consistency, and reliability under complex working conditions, which has become one of the most prominent bottlenecks restricting the independent security of the industrial chain and supply chain and the localization of high-end equipment. After a large number of domestic complete equipment achieve breakthroughs in system architecture and software algorithms, they are ultimately limited by the performance shortcomings of perceptual components, making it difficult to complete the full-chain independentization, which directly drags the overall process of independent and controllable major equipment.
(II) Interpretation of the Core Essence of Smart Sensor Tasks in the Plan
Reading through the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry", the deployment on smart sensor innovation and application clearly outlines the long-term trend of two-way evolution in industrial development: the front end of the industry focuses on sensitive materials, sensitive components, MEMS chips, and core micro-nano process innovation, consolidating the underlying physical capabilities of devices and systematically improving the reliability and long-term stability of devices under complex working conditions; the back end of the industry evolves towards networking, intelligence, and scenario adaptation, strengthening multi-sensor system integration and industry integrated applications, and transforming the hardware performance of single devices into industry-oriented system value.
This development mainline can be disassembled into three layers of mutually supporting internal logic: the technology research mainline focuses on improving the process capabilities of smart sensors such as MEMS, breaking through the core technologies of sensor reliability, and solving the problem of device performance attenuation from the source of micro-nano manufacturing processes; the quality system mainline improves the whole-process quality control mechanism of design, manufacturing, and packaging/testing, systematically improving product stability and consistency, and transforming laboratory single-point indicators into stable and controllable engineering capabilities under scaled mass production; the industrial upgrade mainline promotes mainstream sensor products to move towards the high-end market, enhances portfolio supply and system-level application capabilities, promotes the deep integration and landing of sensors in key industry scenarios, and opens up the complete value closed loop from component R&D, mass production to industry application.
The plan no longer views sensor chip products in isolation, but coordinates and deploys micro-nano processes, whole-chain quality control, portfolio-based product supply, and industry scenario applications as an organic whole. This reflects the deepening of the national level's understanding of the development laws of the sensor industry, marking that China's support thinking for the sensor industry has shifted from single-point technology research to the systematic capability building of the whole industrial chain.
(III) Interpretation of the Core Arguments and Concepts of the Plan
Entering the "15th Five-Year Plan", the development logic of China's smart sensor industry must achieve a fundamental transformation: the focus of industrial development will no longer simply pursue market scale expansion, but will be promoted synergistically around the four dimensions of process foundation, quality assurance, portfolio supply, and scenario implementation. Process is the underlying foundation, determining the physical performance limit of sensor devices; quality is the lifeline of the industry, determining whether products can achieve stable and controllable batch delivery; portfolio supply supports the differentiated needs of diversification and full scenarios, making up for the shortcomings of the product system; and system-level scenario application is the ultimate foothold for the value release of sensor technology and products.
Currently, there are prominent structural pain points in the domestic sensor industry. A large number of laboratory samples show excellent single indicators, but lack consistency after scaled mass production, forming the industry dilemma of "strong samples, weak mass production, usable but not good to use". The reliability shortcomings on the supply side cause products to be "unusable and not good to use", while the demand side forms a market barrier of "dare not use and unwilling to use" due to safety risks and verification costs. The two ends of supply and demand restrict each other, constituting the core blockage restricting the scaled landing of domestic high-end sensors. Implementing the deployment of the "15th Five-Year Plan", the core task is to open up this industrialization blockage: consolidating the underlying capabilities of devices through micro-nano process research such as MEMS, solving the consistency and reliability problems through a whole-process quality control system, improving product supply capabilities through platform-based and portfolio-based product construction, and relying on key industries, especially the "Six Networks" construction scenarios, to drive the deep integration of production and application. Through whole-chain collaborative innovation, promote China's sensor industry to leap from single-point technology breakthroughs to whole-chain system capabilities, from catching up in single component products to an overall leap in system-level perception capabilities, and then move towards intelligent super-perception units, building a solid and reliable perception foundation for China's new industrialization and the cultivation of new quality productive forces.
Reality Review: Phased Achievements and Deep-Seated Structural Contradictions of the Industry
(I) Phased Achievements of Industrial Development
After years of continuous investment, China's smart sensor industry has accumulated a solid development foundation, showing a development trend of scaled formation, complete chain, entity growth, and accelerated substitution. Mature tracks such as MEMS have achieved scaled breakthroughs, and fields such as consumer electronics and environmental monitoring have basically completed domestic substitution. Some products of domestic enterprises have formed stable batch shipping capabilities, and a sufficient and benign market competition pattern has been formed at the consumer end.
From the perspective of the industrial chain, a complete industrial chain covering sensitive material R&D, chip design, wafer manufacturing, packaging and testing, and system integration has been built domestically. Industrial clusters in regions such as the Yangtze River Delta, the Pearl River Delta, and the Bohai Rim continue to be cultivated and formed. The number of upstream and downstream supporting entities continues to enrich, initially possessing the basic conditions for whole-chain collaborative innovation and joint verification.
At the level of innovation entities, a group of domestic enterprises has gradually got rid of the development path of pure OEM and reverse imitation, established forward design and development capabilities for MEMS sensors, and mastered the independent R&D logic from sensitive mechanisms and device structures to process development. Some industrial-grade and automotive sensors have entered the long-cycle verification stage of downstream head enterprises. Domestic substitution has officially entered the substantive landing stage of small-batch trial and scaled introduction from conceptual promotion, and the industry as a whole has the basic conditions to launch an impact on the high-end market.
(II) Four Prominent Shortcomings Restricting Industrial Upgrade
Process Shortcoming: Insufficient stability of MEMS manufacturing process and significant gap in mass production consistency.
First, the process parameters of domestic MEMS production lines fluctuate greatly, and the batch yield control is difficult. MEMS is a typical micro-nano multi-physics field manufacturing, and the process fault tolerance space is extremely small. There is still an obvious gap in the process stability of domestic production lines in core links such as thin film deposition, deep silicon etching, wafer bonding, and structure release; high-end MEMS special equipment, special process materials, and precision testing instruments still face external supply constraints, and the shortcomings of equipment and materials reversely restrict the iterative optimization of production line processes.
Second, process development is disconnected from reliability verification. Many samples prepared in the laboratory environment have excellent single indicators, but after entering scaled mass production, facing complex working conditions such as high and low temperature alternation, continuous vibration, long-term aging, and alternating stress superposition, device performance will attenuate rapidly. The single-point performance indicators measured in the laboratory environment cannot be equated with the reliable performance of long-term service in engineering scenarios, which is the most prominent technical gap in industrialization transformation.
Quality Shortcoming: The whole-chain quality control mechanism has not yet been truly implemented
First, quality control is fragmented. The design end lacks forward reliability simulation and failure mechanism prediction, and a large number of reliability defects are concentratedly exposed in the manufacturing, packaging/testing links, or even the terminal use stage; the manufacturing end has inconsistent process control standards among different enterprises, and the gap in process control levels is huge; the packaging and testing links have their own testing specifications, and the testing conditions and judgment standards for similar products are not unified, lacking the basis for horizontal comparison and unified evaluation of product quality.
Second, the reliability verification system is imperfect. The testing capabilities for durability, environmental adaptability, and long-term aging facing strict scenarios such as automotive grade and industrial grade are insufficient, making it difficult to meet the strict market access thresholds of high-end industries.
Third, there is a shortage of unified industry evaluation standards and public third-party testing and calibration platforms. It requires huge investment for enterprises to build a full set of reliability verification platforms independently. For small and medium-sized enterprises to independently carry out multi-dimensional reliability verification, not only the financial pressure is high and the testing cycle is long, but it will also seriously drag down the product iteration speed.
Product Supply Shortcoming: Incomplete product portfolio and weak system-level solution capability
First, there are mostly scattered developments of single products, few platform-based product systems, repeated R&D of similar products, and a lack of portfolio and serialized product layout. Many enterprises develop single products separately for the customized needs of single customers, making it difficult to derive multi-range and multi-specification series products based on a set of mature process foundations, resulting in scattered R&D resources and difficulty in exerting scaled cost advantages.
Second, most enterprises only stay at the level of hardware component supply, lacking the integrated delivery capabilities of calibration algorithms, temperature drift compensation, multi-sensor fusion, and edge signal processing. Downstream complete machine manufacturers need to invest a lot of manpower and material resources to carry out secondary development. Domestic enterprises are difficult to upgrade from single component suppliers to perceptual system solution service providers, unable to match the integrated development needs of downstream complete machine systems.
Production-Application Docking Shortcoming: There is a "death valley" between technological innovation and industrialization application
First, downstream complete machine enterprises have doubts about the long-term stability of domestic sensors. High-end equipment has zero tolerance for device failure. The introduction and verification cycle of domestic sensors is long, and the trial-and-error cost is high. The willingness of complete machine enterprises to apply and verify is insufficient.
Second, the supply and demand information between upstream and downstream is asymmetric. Upstream chip enterprises do not thoroughly understand the real and complex working conditions of industrial, automotive, and medical equipment. Product design simplifies environmental conditions and is detached from the complex working conditions on site; downstream complete machines lack low-cost, safe, and controllable domestic device verification scenarios, the volume of demonstration applications is insufficient, and it is difficult to accumulate scaled working condition verification data.
Third, facing complex environments and special scenarios such as deep sea, aviation, and extreme industry, the industry has insufficient understanding of the multi-physics field coupling interference mechanism, and the product's adaptability in complex environments with multiple factors superimposed is insufficient, making it difficult to meet the strict needs of special fields.
(III) Analysis of the Deep Roots Behind the Shortcomings
Concept Level: Cognitive bias, emphasizing static indicators over engineering reliability. There has long been a thinking inertia of emphasizing static performance indicators over long-term reliability, and emphasizing laboratory sample indicators over engineering mass production capabilities. Project approval evaluation and product evaluation pay more attention to single-point performance parameters, while the weight of engineering indicators such as long-term aging and batch consistency is low, leading to a large amount of R&D resources tilting towards sample indicators and insufficient continuous polishing of mass production reliability.
Mechanism Level: Chain disconnection, lacking a long-term mechanism for collaborative research on common technologies. The innovation chain of industry-university-research-application is disconnected. Reliability engineering and failure analysis are typical common industrial shortcomings, with large investment, long cycles, and no obvious short-term economic returns. A single enterprise is difficult to independently bear huge continuous investment, lacking a long-term organizational mechanism for cross-entity collaborative research.
Ecosystem Level: Loose coordination, lacking an industrial chain joint verification mechanism. There is insufficient coordination between upstream and downstream of the industrial chain. There is a lack of normalized joint verification mechanisms among sensitive materials, equipment, processes, and complete machines. New materials, new equipment, and new devices cannot be jointly tested in real production lines and real working conditions synchronously. Each link of the industrial chain "fights alone", and the cross-link coordination and integration capabilities are relatively low.
Policy Level: Misaligned support, weak public support in the engineering link. Past support resources were more biased towards front-end R&D project approval, encouraging breakthroughs in samples and prototypes and the improvement of single indicators; there is relatively little policy support for mass production quality system construction, public reliability infrastructure, pilot verification platforms, and working condition demonstration scenarios, and the support for the engineering link from samples to mass production is weak.
Strategic Logic: The Triple Value Connotation of Plan Deployment
(I) Security Value: Consolidating the Security Foundation of the Industrial Chain and Supply Chain of the Electronic Information Manufacturing Industry
High-end smart sensors are the core basic components for the digital transformation of industrial equipment, automotive electronics, aerospace, energy equipment, and major infrastructure. The safe operation of a large number of high-end equipment highly depends on the signals collected in real time by sensors. Once the supply of perceptual devices is restricted or their performance fails, it will directly affect the safety of the equipment and the overall stable operation of the system. Only by truly solving the shortcomings of stability, consistency, and reliability, and achieving stable batch supply of high-end sensors, can the independent and controllable core components be completed, reducing the risk of external supply chain disruption.
MEMS process belongs to the general underlying technology and capability in the field of micro-nano manufacturing. Its breakthrough value is not limited to the single category of sensors. This micro-nano processing, heterogeneous integration, and thin film preparation process system can also radiate and drive the coordinated upgrade of multiple semiconductor sub-tracks such as optoelectronics, microfluidic chips, RF devices, and micro-actuators. It is the underlying manufacturing base supporting the continuous development of the entire micro-nano industrial cluster. The improvement of MEMS process capabilities will drive the overall level of China's micro-nano manufacturing to leap forward.
(II) Quality Value: The Industrial Paradigm Transforms from "Having or Not" to "Good or Bad"
During the "14th Five-Year Plan" stage, the focus of China's sensor industry was more on solving the problem of availability, focusing on achieving single-point domestic substitution of products from 0 to 1, and making up for the gap in domestic product categories. Entering the "15th Five-Year Plan", the industry has officially entered a new stage of quality priority, and the quality control mode has undergone a fundamental transformation: shifting from traditional terminal sampling testing to forward-shifting in the whole process of front-end design, manufacturing, and packaging/testing. Reliability is no longer an optional indicator added after product R&D is completed, but a forward access threshold for entering high-end markets such as industrial, automotive, and medical. The industrial development goal has shifted from "whether the sample can be made" to "whether stable batch supply can be achieved and whether users are willing to use it for a long time". This marks that China's sensor industry has leaped from catching up in single-point component domestic substitution to systematic and engineering independent and controllable paradigm.
(III) Ecological Value: Building a Positive Cycle of Technology-Product-Market and Cultivating New Quality Productive Forces
The scaled landing of domestic sensors with high reliability and high consistency will directly empower the transformation and upgrade of trillion-level industries such as downstream intelligent manufacturing, robots, smart transportation, and smart cities, providing basic perception capabilities for the digital transformation of all walks of life. In turn, large-scale scenario applications downstream will continuously accumulate massive real working condition data, forcing upstream process iteration, yield improvement, and cost optimization, forming a positive cycle of "process iteration → product maturity → scenario application → data feedback → process re-optimization". The industrialization landing of sensor technology can continuously spawn new equipment, new scenarios, and new business formats, opening up the front-end link of physical world digitalization, which is an important part of cultivating new quality productive forces.
Implementation Path: Five Major Action Directions for Implementing Plan Deployment
(I) Tackling Core MEMS Manufacturing Processes and Building an Independent and Controllable Process Platform System
Relying on national major projects and special deployments, focusing on key nodes such as MEMS etching, thin film deposition, wafer bonding, and structure release processes, organize upstream and downstream of the industrial chain to carry out cross-entity joint research. Simultaneously layout heterogeneous and heterostructure integration process platforms, facing future needs such as embodied intelligence and multi-parameter integrated perception, promote the R&D of heterogeneous integration technologies for various material systems such as silicon-based, optical fiber, and ceramics, break through the technical bottlenecks of integrated monolithic integration of different materials and different functional devices, and support the development of multi-functional and multi-parameter integrated smart sensors. Layout and build a group of national-level MEMS pilot platforms to support the rapid verification and iteration of new processes and new products, lower the threshold for new product trial production for small and medium-sized enterprises, and shorten the cycle from process development to sample verification.
Promote the integrated collaborative research of process-equipment-material, open up the verification and trial channels of domestic MEMS equipment and special process consumables in the production line, establish a small-batch verification mechanism for domestic equipment and materials in MEMS production lines, and drive the iterative upgrade of equipment and materials with device process requirements. Encourage leading enterprises to precipitate standardized process modules, build enterprise process knowledge bases, solidify mature MEMS processes into reusable process IPs, reduce repeated process development of similar products, shorten the new product development cycle, and reduce trial production costs.
(II) Building a Whole-Process Quality Control System of Design-Manufacturing-Packaging/Testing
Forward reliability engineering in the design stage, introduce multi-physics field simulation and failure mechanism prediction, identify potential failure risks such as temperature, stress, and fatigue in advance, avoid stability problems from the source, realize forward reliability design, and move the failure control gate forward to the device design link.
Implement digital process control in the manufacturing link, rely on the MES system to realize the traceability of whole-process parameters, implement closed-loop control of key parameters such as thin film thickness, etching depth, and bonding stress, and strictly control the consistency level of products in different batches.
Establish a hierarchical testing system in the packaging and testing link, distinguish the differentiated testing specifications for consumer grade, industrial grade, automotive grade, and aerospace grade, formulate corresponding aging, environmental, and reliability testing project contents and indicator systems for products of different levels, promote the landing of hierarchical certification, and form a unified domestic sensor hierarchical evaluation mechanism.
Layout national-level and regional-level public reliability verification and calibration platforms, open aging tests, high and low temperature cycling, vibration shock, and long-term stability testing capabilities to the whole industry, reduce the reliability testing and certification costs for small and medium-sized enterprises, and make up for the shortcomings of public testing infrastructure in the industry.
(III) Promoting Portfolio-Based Product Layout and Improving System-Level Supply Capabilities
Guide leading enterprises to build platform-based sensor product architectures, derive multi-range and multi-specification series products based on a unified process foundation, build a complete product portfolio, and reduce low-level repeated development. Relying on the platform-based architecture, quickly derive devices of different specifications in the same series, improve the portfolio-based supply capability of products, meet the diversified selection needs of downstream complete machines, and solve the pain points of downstream users of "difficult selection and incomplete categories".
Promote the integrated collaborative development of hardware, calibration algorithms, signal processing, and multi-source fusion software, embed compensation algorithms, multi-sensor fusion, and edge preprocessing into perceptual units, promote enterprises to transform from single component suppliers to perceptual system solution service providers, and improve system-level delivery capabilities.
Implement classified policies: stabilize capacity and expand domestic supply in mature tracks such as consumer electronics, consolidating the achievements of domestic substitution; concentrate resources for key research in high-reliability tracks such as industrial, automotive, energy, and medical, prioritize breaking through high-end sensor categories with strong market rigid demand and obvious "choke point" characteristics, and promote high-end market substitution in a gradient manner.
(IV) Relying on Key Industry Scenario Traction to Promote the Deep Integration and Landing of Production and Application
Based on the "Six Networks" construction deployment proposed by the state, the Industrial Internet, Energy Internet, Transportation Network, Space-Air-Ground Integrated Network, Urban Perception Network, and Livelihood Service Network are the carriers with the most concentrated digital perception needs, the richest scenarios, and the most sufficient data accumulation. They are also the core test sites for scaled verification and iterative upgrade of domestic sensors. Combining the five major directions of intelligent manufacturing, intelligent connected vehicles, smart cities, energy equipment, and high-end medical equipment, set up domestic smart sensor demonstration projects. Facing the six major network scenarios, layout a group of scaled demonstration application projects for domestic sensors, continuously verify product performance and accumulate long-term service data under real working conditions.
Establish a joint verification mechanism for complete machine + sensor enterprises, form upstream and downstream joint research groups, jointly define working condition boundaries, formulate testing standards, and carry out joint verification. For downstream enterprises that take the lead in batch adoption of domestic high-end sensors, implement policy incentives such as the first set (unit) to share the application trial-and-error costs and eliminate downstream users' concerns about reliability risks.
Build public verification scenarios based on real working conditions, replicate extreme and complex working conditions such as high temperature, high humidity, strong vibration, and strong electromagnetic interference, establish a standardized working condition database, shorten the product verification cycle, reduce downstream introduction risks, and cross the "death valley" of industrialization of innovation achievements.
(V) Improving Supporting Institutional Guarantees and Cultivating a Benign Industrial Ecosystem
Accelerate the improvement of the national standard and industry standard system for smart sensors, unify the evaluation specifications for reliability, environmental adaptability, and long-term aging, establish a unified product hierarchical evaluation system, and solve the pain points of inconsistent testing standards among different enterprises and the inability to horizontally compare product performance.
Establish and strengthen the national-level smart sensor innovation consortium, break through the barriers of industry-university-research-application, collaboratively tackle common problems such as reliability, MEMS common processes, and failure analysis, concentrate efforts to solve basic technology shortcomings that a single enterprise cannot afford, and promote the integration and sharing of innovation resources.
Optimize the talent training system, improve the joint training mechanism of universities, research institutes, and enterprises, make up for the shortage of scarce talents such as MEMS process engineers, reliability engineering, failure analysis, and sensor calibration, and build a multi-level talent echelon covering basic research, process development, quality control, and system application.
Guide the capital market to change its investment logic, shift from chasing short-term concept projects to supporting long-cycle industrial links such as process upgrade, quality system construction, and engineering verification, encourage long-term capital to deeply cultivate the underlying capability building of the sensor industry, and establish an investment and financing ecosystem adapted to the laws of the basic component industry.
Risk Prediction and Key Point Control
(I) Being Vigilant Against Two Major Development Misconceptions
First, avoid emphasizing investment and capacity expansion while neglecting process polishing. Under the background of policy benefits, it is necessary to prevent local authorities from blindly starting MEMS production lines, causing scattered overcapacity of low-end capacity, repeated construction clustering, as well as disorderly expansion of low-end capacity and homogeneous involution, falling into vicious low-price competition. The core shortcoming of the industry is not insufficient capacity, but production-application adaptability problems such as insufficient high-end process and reliability capabilities. Simply expanding capacity cannot solve the fundamental contradictions of the industry, but will instead disperse industrial resources and delay the progress of high-end technology research.
Second, avoid only pursuing single indicator breakthroughs and ignoring the construction of the whole-chain quality system. Some products can achieve single-point indicator compliance through sample debugging, but lacking systematic quality control from design, manufacturing to packaging/testing, once entering large-scale production, there will be batch dispersion and insufficient consistency, leading to poor overall product quality and insufficient usability. "Sample compliance does not equal mass production reliability and stability" is a trap that must be continuously vigilant in the process of industrial promotion. Sample performance cannot be equated with industrialization capabilities.
(II) Adhering to the Implementation Strategy of Gradient Promotion and Market Dominance
Adhere to step-by-step and gradient promotion. Prioritize scaled domestic substitution in mature fields such as consumer electronics and environmental monitoring; for high-reliability fields in complex environments such as automotive grade and aerospace, carry out introduction and verification step by step in the order from non-safety components to safety components and from auxiliary perception to core perception. Do not be eager for quick success, and avoid safety hazards caused by hasty application.
Clearly divide the boundary between government and market. The government focuses on building public pilot platforms, standard systems, public verification scenarios, and common technology research to make up for the shortcomings of industrial public infrastructure; process iteration, product development, market competition, and business model innovation are left to the market entities to take the lead, giving full play to the role of enterprises as innovation entities and avoiding administrative intervention replacing market choices.
In short, facing the new journey of the "15th Five-Year Plan", China's smart sensor industry is at a critical historical node of shifting from scale expansion to quality leap. Implementing the deployment of the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry", we must firmly grasp the two fulcrums of MEMS process improvement and whole-chain quality control, achieve industrial breakthroughs with reliability, consolidate the industrial foundation with portfolio supply, and release industrial value with scenario integration.
The progress of the sensor industry has never been a once-and-for-all project. It requires long-term, continuous, and stable investment, relying on generation after generation of process iteration and continuous reliability polishing. Only by polishing core processes with long-term effort, building a solid quality foundation with meticulous care, continuously opening up the collaborative chain of industry-university-research-application, and promoting the collaborative construction of the industrial ecosystem by upstream and downstream of the industrial chain, can we build a high-quality system of the smart sensor industry with global competitiveness, and build a solid perceptual foundation for China's new industrialization and the development of new quality productive forces.
Author | Guo Yuansheng, Deputy Director of the Science and Technology Committee of the Central Committee of the Jiusan Society, Executive Vice Chairman of the China Sensor and IoT Industry Alliance
Editor | Zhang Xinyi
Art Designer | Malia Supervisor | Lian Xiaodong