Extending upstream in the AI industry chain.
Recently, Shanghai Dijiang Technology Co., Ltd. (hereinafter referred to as "Dijiang Tech") successfully held the launch ceremony for its advanced packaging project at the Shanghai World Reception Hall.
The project will invest in and build scaled-up production lines in phases, creating a full-category process platform for 2.5D/3D advanced packaging to provide one-stop mass production foundry services for customers with high-computing-power chips such as AI and memory chips.
Founded on September 10, 2026, and located in Xuhui, Shanghai, Dijiang Tech is an industrialization platform company focused on 2.5D/3D advanced packaging.
Despite being established for less than ten days, the launch ceremony attracted executives from dozens of well-known investment institutions, including CICC (China International Capital Corporation), Wuxi High-tech Zone New Investment Group, Wuxi Venture Capital, Lianchuang Capital, Shengshi Capital, Qingdao Chengtou Group, and Jiaxing Nantou Group.
All this starts with its co-initiator, YOOZOO Network.
YOOZOO Network's AI Strategy
Compared to the name YOOZOO Network, the public is more familiar with its game products such as "Young Three Kingdoms" and "Game of Thrones: Winter is Coming". However, beyond its core gaming business, the company's layout in AI has been ongoing for over two years.
The earliest focus was on the integration of AI and gaming. In 2023, YOOZOO Network established the AI Innovation Institute to promote the application of AI across the entire chain of game R&D and publishing.
The YOOZOO.AI agent and AI tool aggregation platform it has built has integrated dozens of mainstream large models, covering dozens of core business segments such as planning and design, advertising material generation, code writing, delivery and operation, and testing and operation. It has cumulatively generated content hundreds of thousands of times, with the total duration of generated videos reaching nearly a thousand hours.
At the level of technology application, the company has been continuously launching products in recent years to promote the integration of AI with its own business.
The visual creation tool YOOLab (YOOZOO Wanxiang Canvas) connects the entire AI creation chain with its high-degree-of-freedom, visualized image, text, and video generation capabilities; meanwhile, the game creation platform YOOSpark has achieved zero-threshold creation by "using natural language dialogue to let AI make games."
With its leading AI layout, scaled-up implementation results, and industrial ecosystem construction capabilities, YOOZOO Network was also successfully selected for the "2026 AI Development Report of the Game Industry" and rated as a "Representative Enterprise in AI Layout."
Beyond gaming, YOOZOO Network has begun to extend upstream in the AI industry chain.
In 2025, the company successively made strategic investments in domestic AI chip enterprises Biren Technology and Sunrise Technology. Earlier this year, Biren Technology listed on the Hong Kong Stock Exchange as the "first GPU stock on the HKEX"; Sunrise Technology, incubated by SenseTime, just completed a CNY 2 billion equity financing at the end of August this year. In July of the same year, YOOZOO Network and Sunrise Technology signed a strategic cooperation agreement to promote the deep integration of cutting-edge intelligent computing power with game R&D and publishing needs.
Chips are the heart of AI computing power, and investing in GPU enterprises means that YOOZOO Network has taken the lead in securing the most critical segment of the computing power industry chain.
In December 2025, YOOZOO Network and People's Daily Online jointly took the lead in establishing the "AI Interactive Corpus Innovation Laboratory," aiming to build a safe, reliable, and high-quality multimodal human-computer interaction corpus system. In May 2026, the laboratory released the country's first batch of "Embodied Interactive Multimodal Corpus Datasets," providing core data support with both technical depth and ethical thickness for the development of the embodied intelligence industry.
From AI tool platforms to chips and AI corpora, YOOZOO Network has formed a multi-point layout in the AI industry chain. This collaboration with Dijiang Tech fills in the most upstream link in its previous layout—advanced packaging.
Packaging is an inevitable path for chips to move from design to mass production. As the demand for computing power and bandwidth in AI chips continues to climb, the 2.5D/3D advanced packaging focused on by Dijiang Tech is even more critical technology for breaking through the computing power bottleneck. In the future, YOOZOO Network will also provide comprehensive support in terms of industrial resource docking and investment and financing cooperation.
From the perspective of the investment model, YOOZOO Network did not invest directly with its own funds, but laid out indirectly through multi-layer platforms. This limited partnership architecture can control the risk exposure of investments while retaining operational space for subsequent additional investments.
Targeting the Domestic Gap in Advanced Packaging
Dijiang Tech is positioned in the field of 2.5D/3D advanced packaging, providing one-stop foundry services from R&D and design to mass production manufacturing for customers with high-computing-power chips such as AI and memory chips. The company plans to invest in and build scaled-up production lines in phases, gradually forming the mass production capability of a full-category process platform.
The team is the core support for Dijiang Tech. In the field of advanced packaging, talent is often scarcer than equipment. The length of the yield ramp-up cycle for a production line largely depends on whether the team has practical experience in large-scale mass production.
It is reported that the company's process routes and equipment selection have been verified by multiple mass-produced products, enabling it to quickly respond to market demands; the core team is composed of senior experts in advanced packaging in a structured manner, and all members have practical experience in the mass production of top-tier AI chips.
Dijiang Tech is situated in an incremental market with the highest certainty.
According to industry reports, the global advanced packaging market size reached USD 55 billion in 2025 and is expected to exceed USD 120 billion by 2031. In particular, the 2.5D/3D packaging market for AI accelerators is expected to reach USD 14.84 billion in 2026 and increase to USD 45.19 billion by 2031, with a compound annual growth rate as high as 32.09%, demonstrating extremely strong growth resilience.
However, while the demand for AI computing power continues to rise, packaging has become a bottleneck in the industry chain. The industry is simultaneously facing realistic challenges such as rising costs, tight capacity, and insufficient domestic substitution capabilities.
The landing of Dijiang Tech's advanced packaging project in Shanghai also coincides with the node of policy efforts. In August 2026, the General Office of the Shanghai Municipal People's Government issued the "15th Five-Year Plan for the Development of Strategic Emerging Industries in Shanghai," explicitly proposing to promote the R&D and mass production application of new technologies such as advanced packaging, and support the R&D of equipment and materials for packaging. Advanced packaging has been listed as one of the key development directions of Shanghai's IC (Integrated Circuit) industry.
Beyond policies, Shanghai's own industrial foundation and ecological environment may also be the reasons why Dijiang Tech chose this place.
In the latest ranking of the "Top 100 Cities in Global Comprehensive Competitiveness of the IC Industry" by the World IC Association, Shanghai ranks fourth globally and first domestically.
Currently, Shanghai has gathered more than 1,200 IC enterprises, covering the entire chain of design, manufacturing, packaging and testing, equipment and materials. The addition of another scaled-up production line enterprise in the packaging and testing segment this time is another strengthening of the completeness of Shanghai's IC industry chain.
In recent years, the value of advanced packaging is being seen by a broader range of industrial capital. As a listed company, YOOZOO Network's early bet is expected to drive more long-term capital and patient capital into this critical segment, injecting new momentum into the independent and controllable development of domestic advanced packaging.
Of course, YOOZOO Network is not the only one crossing over to enter the advanced packaging field. As the demand for computing power is transmitted from the design end to the manufacturing end, more and more industrial capital from different industries is pouring into this track, and everything has just begun.
Text | Zhouyu Editor | Yida